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    • 2. 发明申请
    • IN-SITU MONITORING ON A SPINNING-DISK ION IMPLANTER
    • WO2005091342A3
    • 2005-09-29
    • PCT/US2005/009194
    • 2005-03-18
    • AXCELIS TECHNOLOGIES, INC.PEREL, AlexanderLOIZIDES, WilliamSTONE, LyudmilaBENVENISTE, Victor
    • PEREL, AlexanderLOIZIDES, WilliamSTONE, LyudmilaBENVENISTE, Victor
    • H01J37/317
    • The present invention is directed to in-situ detection of particles and other such features in an ion implantation system (300) during implantation operations to avoid such additional monitoring tool steps otherwise expended before and/or after implantation, for example. One or more such systems are revealed for detecting scattered light from particles on one or more semiconductor wafers illuminated by a light source (e.g., laser beam). The system comprises an ion implanter (302) having a laser (322) for illumination of a spot on the wafer (308) and a pair of detectors (360) (e.g., PMT or photodiode) rotationally opposite from the ion implantation operations. A wafer transport holds a wafer or wafers for translational scanning under the fixed laser spot. A computer analyzes the intensity of the scattered light (326) detected from the illuminated wafer (workpiece) (308), and may also map the light detected to a unique the present invention is directed to in-situ detection of particles and other such features in an ion implantation system during implantation operations to avoid such additional monitoring tool steps otherwise expended before and/or after implantation, for example. One or more such sysetms are revealed for detecting scattered light from particles on one or more semiconductor wafers illuminated by a light source (e, g., laser beam).The system comprises an ion implanter having a laser for illumination of a spot on the wafer and a pair of detectors (e, g., PMT or photodiode ) rotationally opposite from the ion implantation operations. A wafer transport holds a wafer or wafers for tanslational scanning under fixed laser spot. A computer analyzes the intensity of the scattered light detected from the illuminated wafer (workpiece), and may also map the light detected to a unique position. For example, particles or other such contaminates may be identified on wafers during the implantation process before additional time and resources are consumed, and aid in determining the sources of such contaminates. Further, threshold analysis of the quantity or size of such particles, for example, may provide a system interlock for shutdown or feedback control.
    • 3. 发明申请
    • LOAD LOCK CONTROL
    • 负载锁定控制
    • WO2007127068A1
    • 2007-11-08
    • PCT/US2007/009150
    • 2007-04-13
    • AXCELIS TECHNOLOGIES, INC.FASHEH, TariqCARROLL, JamesPETRY, KlausSTONE, DaleSTONE, LyudmilaWEIDERSPAHN, Dave
    • FASHEH, TariqCARROLL, JamesPETRY, KlausSTONE, DaleSTONE, LyudmilaWEIDERSPAHN, Dave
    • H01L21/00
    • H01L21/67201Y10S414/139
    • A control for pressurizing a load lock. The control initiates pressurization of the loadlock interior by coupling a source of gas to the loadlock interior. A representative load lock includes a pressure sensor and multiple valves to atmosphere where at least one such valves is a passthrough valve for removal of and insertion of workpieces from and into a load lock interior. A second fast acting valve also opens to atmosphere. A pressure rise inside the loadlock interior is monitored and when the pressure reaches a threshold pressure above atmosphere the fast acting valve is opened to atmosphere. This second fast acting valve is configured to relieve overpressure from the passthrough valve prior to opening of said passthrough valve. Workpiece movement is accomplished with the aid of a robot which reaches into the loadlock interior as it is either depositing workpieces or retrieving them. This system and process minimizes particle contamination of the load lock interior as well as contamination in the region outside the loadlock near the passthrough valve and any scheduled workpieces.
    • 用于对加载锁加压的控制。 该控制通过将气源连接到负载锁内部来启动负载锁内部的加压。 代表性的加载锁包括压力传感器和多个阀,其中至少一个这样的阀是用于从工作装置锁定内部移除和插入工件的直通阀。 第二个快动作阀也向大气敞开。 监控负载锁内部的压力上升,当压力达到高于大气压的阈值压力时,快速作用阀向大气开放。 该第二快动阀构造成在打开所述通气阀之前减轻通气阀的过压。 工件运动是借助于一个机器人来实现的,该机器人可以通过放置工件或检索它们而进入到装载锁内部。 该系统和过程最大限度地减少了负载锁内部的颗粒污染以及穿通阀附近的负载锁定区域和任何预定工件的污染。