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    • 3. 发明申请
    • MEMS BASED CONTACT CONDUCTIVITY ELECTROSTATIC CHUCK
    • 基于MEMS的接触电导率静电卡盘
    • WO2005036637A1
    • 2005-04-21
    • PCT/US2004/033247
    • 2004-10-08
    • AXCELIS TECHNOLOGIES INC.KELLERMAN, PeterQIN, ShuALLEN, ErnieBROWN, Douglas
    • KELLERMAN, PeterQIN, ShuALLEN, ErnieBROWN, Douglas
    • H01L21/68
    • H01L21/6831Y10S438/964
    • The present invention is directed to a method for clamping and processing a semiconductor substrate using a semiconductor processing apparatus. According to one aspect of the present invention, a multi-polar electrostatic chuck and associated method is disclosed which provides heating or cooling of a substrate by thermal contact conduction between the electrostatic chuck and the substrate. The multi-polar electrostatic chuck comprises a semiconductor platform having a plurality of protrusions that define gaps therebetween, a surface roughness of the plurality of protrusions is less than 100 Angstroms. The electrostatic chuck further comprises a voltage control system operable to control a voltage applied to the electrostatic chuck to thus control a contact heat transfer coefficient of the electrostatic chuck, wherein the heat transfer coefficient of the electrostatic chuck is primarily a function of a contact pressure between the substrate and the plurality of protrusions.
    • 本发明涉及使用半导体处理装置夹持和处理半导体衬底的方法。 根据本发明的一个方面,公开了一种多极静电卡盘和相关方法,其通过静电卡盘和基板之间的热接触传导来提供加热或冷却基板。 多极静电卡盘包括具有限定间隙的多个突起的半导体平台,多个突起的表面粗糙度小于100埃。 静电卡盘还包括电压控制系统,其可操作以控制施加到静电卡盘的电压,从而控制静电卡盘的接触热传递系数,其中静电卡盘的传热系数主要是介于静电卡盘之间的接触压力的函数 基板和多个突起。
    • 5. 发明申请
    • MEMS BASED MULTI-POLAR ELECTROSTATIC CHUCK
    • 基于MEMS的多极静电卡盘
    • WO2005020316A1
    • 2005-03-03
    • PCT/US2004/026896
    • 2004-08-18
    • AXCELIS TECHNOLOGIES INC.KELLERMAN, PeterQIN, ShuBROWN, Douglas
    • KELLERMAN, PeterQIN, ShuBROWN, Douglas
    • H01L21/68
    • H01L21/6875H01L21/6833
    • The present invention is directed to a semiconductor processing apparatus and a method for clamping a semiconductor substrate and controlling a heat transfer associated therewith. According to one aspect of the present invention, a multi-polar electrostatic chuck and associated method is disclosed which provides a controlled and uniform heat transfer coefficient across a surface thereof. The multi-polar electrostatic chuck comprises a semiconductor platform having a plurality of protrusions that define gaps therebetween, wherein a distance or depth of the gaps is uniform and associated with a mean free path of the cooling gas therein. The electrostatic chuck is permits a control of a backside pressure of a cooling gas within the plurality of gaps to thus control a heat transfer coefficient of the cooling gas. The plurality of protrusions further provide a uniform contact surface, wherein a contact conductivity between the plurality of protrusions and the substrate is controllable and significantly uniform across the substrate.
    • 本发明涉及一种用于夹持半导体衬底并控制与之相关的热传递的半导体处理装置和方法。 根据本发明的一个方面,公开了一种多极静电卡盘和相关方法,其提供跨越其表面的受控且均匀的传热系数。 多极静电卡盘包括具有限定间隙的多个突起的半导体平台,其中间隙的距离或深度是均匀的,并且与其中的冷却气体的平均自由路径相关联。 静电吸盘可以控制多个间隙内的冷却气体的背侧压力,从而控制冷却气体的传热系数。 多个突起还提供均匀的接触表面,其中多个突起和基底之间的接触导电性在基底上是可控的和显着均匀的。