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1. 发明申请

WO2007025675A1 AQUEOUS SOLUTION AND METHOD FOR REMOVING IONIC CONTAMINANTS FROM THE SURFACE OF A WORKPIECE 审中-公开
标题翻译：从工作表面去除离子污染物的水溶液和方法
公开(公告)号：WO2007025675A1
公开(公告)日：2007-03-08
申请号：PCT/EP2006/008315
申请日：2006-08-21
申请人： ATOTECH DEUTSCHLAND GMBH , KUBITZA, Irene , BECK, Thomas , SCHREIER, Hans-Jürgen , STEINBERGER, Gerhard
发明人： BECK, Thomas , SCHREIER, Hans-Jürgen , STEINBERGER, Gerhard
IPC分类号： C11D11/00 , H05K3/26 , G03F7/42 , H01L21/306 , C11D7/32 , C11D7/26 , C11D7/50
CPC分类号： H05K3/26 , C11D7/261 , C11D7/3218 , C11D7/5013 , C11D7/5022 , C11D11/0047 , G03F7/40 , G03F7/405 , G03F7/425 , H05K3/244 , H05K3/28 , H05K2201/0761 , H05K2203/122
摘要： To reduce ionic contaminants on printed circuit boards that are at least partially covered with a solder resist mask and are provided with top layers on the copper structures, an aqueous cleaning solution is used, which contains at least one ethanolamine compound and/or the salt thereof, at least one alcoholic solvent and, at need, at least one guanidine compound and/or the salt thereof.
摘要翻译：为了减少至少部分地被阻焊掩模覆盖的印刷电路板上的离子污染物，并且在铜结构上设置有顶层，使用含水清洗溶液，其含有至少一种乙醇胺化合物和/或其盐，至少一种醇溶剂和需要的至少一种胍化合物和/或其盐。

2. 发明申请

WO2006021445A1 METHOD FOR COATING SUBSTRATES CONTAINING ANTIMONY COMPOUNDS WITH TIN AND TIN ALLOYS 审中-公开
标题翻译：涂有含钛和钛合金的抗微生物化合物的基材的方法
公开(公告)号：WO2006021445A1
公开(公告)日：2006-03-02
申请号：PCT/EP2005/009201
申请日：2005-08-25
申请人： ATOTECH DEUTSCHLAND GMBH , LOWINSKI, Christian , SCHREIER, Hans-Jürgen , STEINBERGER, Gerhard , NAUMAN, Jana
发明人： LOWINSKI, Christian , SCHREIER, Hans-Jürgen , STEINBERGER, Gerhard , NAUMAN, Jana
IPC分类号： C23C18/16 , C23C18/18 , C23C18/48 , H05K3/42
CPC分类号： C23C18/48 , C23C18/1844 , H05K3/244 , H05K2203/0392
摘要： The present invention relates to a method for depositing tin or tin alloy layers on substrates containing antimony compounds as flameproofing agents or for improving the stampability, wherein the antimony compound is removed from the surface of the substrate material by an acid solution prior to metallization. Particularly preferred, pretreatment solutions containing hydrochloric acids are used for this purpose. The method is particularly suitable for producing joinable tin final layers on printed circuit boards containing antimony compounds, the tin final layers being applied onto copper portions of the conductor pattern which are not covered by the solder stop mask.
摘要翻译：本发明涉及一种用于在含有锑化合物作为防火剂的基材上沉积锡或锡合金层或提高冲压性的方法，其中在金属化之前通过酸溶液从基材表面除去锑化合物。特别优选使用含有盐酸的预处理溶液用于此目的。该方法特别适用于在含有锑化合物的印刷电路板上生产可接合的锡最终层，锡末端层被施加到未被阻焊掩模覆盖的导体图案的铜部分上。

3. 发明申请

WO2017089610A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM 审中-公开
标题翻译：镀钯组合物和钯化学镀方法
公开(公告)号：WO2017089610A1
公开(公告)日：2017-06-01
申请号：PCT/EP2016/079008
申请日：2016-11-28
申请人： ATOTECH DEUTSCHLAND GMBH
发明人： WALTER, Andreas , SUCHENTRUNK, Christof , BECK, Thomas , STEINBERGER, Gerhard , BERA, Holger , BRUNNER, Heiko , FROESE, Bernd
IPC分类号： C23C18/44 , H01L21/288 , H05K3/24
CPC分类号： H05K3/187 , C23C18/1651 , C23C18/1683 , C23C18/32 , C23C18/44 , H01L21/288 , H05K3/244
摘要： The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the unsaturated compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The unsaturated compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.
摘要翻译：本发明涉及一种水性镀浴组合物和通过无电镀在基材上沉积钯层的方法。根据本发明的含水镀浴组合物包含钯离子源，钯离子还原剂和不饱和化合物。根据本发明的水性镀浴组合物具有改进的稳定性，以防止由于不饱和化合物引起的不希望的分解，同时将钯的沉积速率保持在期望的满意值。含水电镀液组合物也具有延长的使用寿命。本发明的不饱和化合物允许将沉积速率调节至浴寿命期间的满意范围，并且用于在较低温度下无电沉积钯层。

4. 发明申请

WO2016097084A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM 审中-公开
标题翻译：涂层浴组合物及其电镀方法
公开(公告)号：WO2016097084A1
公开(公告)日：2016-06-23
申请号：PCT/EP2015/080138
申请日：2015-12-17
申请人： ATOTECH DEUTSCHLAND GMBH
发明人： BECK, Thomas , STEINBERGER, Gerhard , WALTER, Andreas
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , C23C18/1646 , C23C18/1651
摘要： The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aldehyde compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aldehyde compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aldehyde compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.
摘要翻译：本发明涉及一种水性电镀浴组合物和一种通过无电镀在基片上沉积钯层的方法。根据本发明的水性电镀浴组合物包含钯离子源，钯离子还原剂和醛化合物。含水电镀浴组合物具有增加的钯沉积速率，同时保持浴的稳定性。电镀浴组合物也具有延长的使用寿命。本发明的醛化合物允许将沉积速率在浴寿命中调节到一定范围，并且在较低温度下无电沉积钯层。本发明的醛化合物活化具有低沉积速率的化学镀钯浴并且重新活化老化的化学镀钯浴。

5. 发明申请

WO2017089608A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM 审中-公开
标题翻译：镀钯组合物和钯化学镀方法
公开(公告)号：WO2017089608A1
公开(公告)日：2017-06-01
申请号：PCT/EP2016/079002
申请日：2016-11-28
申请人： ATOTECH DEUTSCHLAND GMBH
发明人： WALTER, Andreas , SUCHENTRUNK, Christof , BECK, Thomas , STEINBERGER, Gerhard , BERA, Holger , BRUNNER, Heiko , RÜCKBROD, Sven
IPC分类号： C23C18/44 , H01L21/288 , H05K3/24
CPC分类号： C23C18/44 , C23C18/1844 , H01L21/288 , H05K3/187 , H05K3/243
摘要： The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and a cyanide group containing aromatic compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the cyanide group containing aromatic compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The cyanide group containing aromatic compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.
摘要翻译：本发明涉及一种水性镀浴组合物和通过无电镀在基材上沉积钯层的方法。根据本发明的水性镀浴组合物包含钯离子源，钯离子还原剂和含氰基的芳族化合物。根据本发明的水性镀浴组合物具有改进的稳定性，以防止由于含氰化物基团的芳族化合物引起的不希望的分解，同时将钯的沉积速率保持在期望的满意值。含水电镀液组合物也具有延长的使用寿命。本发明的含氰基芳族化合物允许将沉积速率调节至浴寿命期间的满意范围并且用于在较低温度下无电沉积钯层。

6. 发明申请

WO2016169952A1 ELECTROLYTIC COPPER PLATING BATH COMPOSITIONS AND A METHOD FOR THEIR USE 审中-公开
标题翻译：电镀铜镀层组合物及其使用方法
公开(公告)号：WO2016169952A1
公开(公告)日：2016-10-27
申请号：PCT/EP2016/058704
申请日：2016-04-20
申请人： ATOTECH DEUTSCHLAND GMBH
发明人： BRUNNER, Heiko , ROHDE, Dirk , PÖLLETH, Manuel , RÜCKBROD, Sven , DARWIN, Desthree , NIEMANN, Sandra , STEINBERGER, Gerhard
IPC分类号： C25D3/38 , C25D7/00
CPC分类号： C25D3/38 , C25D7/00 , C25D21/00
摘要： The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.
摘要翻译：本发明涉及用于电子应用的印刷电路板，IC基板，半导体和玻璃装置的制造中铜和铜合金沉积的酸性电镀液。根据本发明的电镀浴包含至少一种铜离子源，至少一种酸和至少一种胍化合物。电镀浴特别适用于镀铜的凹陷结构和铜柱凸块结构的堆积。

7. 发明申请

WO2022258726A1 A COMPOSITE AND A METHOD FOR MANUFACTURING A COMPOSITE OF A COPPER LAYER AND AN ORGANIC LAYER 审中-公开
公开(公告)号：WO2022258726A1
公开(公告)日：2022-12-15
申请号：PCT/EP2022/065620
申请日：2022-06-09
申请人： ATOTECH DEUTSCHLAND GMBH & CO. KG
发明人： SCHMIDT, Ralf , WOLTER, Ingomar , STEINBERGER, Gerhard , HAARMANN, Philipp , LÜTZOW, Norbert , HÜLSMANN, Thomas
IPC分类号： C23C22/63 , C23C22/73 , C25D1/04 , H05K3/38
摘要： The present invention relates to a composite and a method for manufacturing a composite and a composite, the method comprises in this order the steps: (i) providing a first pure copper structure having a first copper surface; (ii) contacting the first copper surface with an aqueous alkaline conditioner solution and nano-oxidizing the first copper surface by converting Cu-(0) into Cu-(I) and Cu-(II) oxide species obtaining a uniformly oxidized first copper surface layer having a uniformly oxidized first copper surface; (iii) contacting the uniformly oxidized first copper surface with an aqueous alkaline enhancer solution, comprising at least one oxidizing agent, and oxidizing the uniformly oxidized first copper layer by converting the Cu-(I) oxide species into Cu-(II) oxide species and Cu-(0) oxide species into Cu-(I) oxide species obtaining a controlled oxidized first copper surface layer having a controlled oxidized first copper surface; (iv) providing a first non-conductive organic material; and (v) applying the first non-conductive organic material as a first non-conductive organic material layer onto the controlled oxidized first copper surface to obtain the composite.

8. 发明申请

WO2014044435A1 MANUFACTURE OF COATED COPPER PILLARS 审中-公开
标题翻译：涂层铜管的制造
公开(公告)号：WO2014044435A1
公开(公告)日：2014-03-27
申请号：PCT/EP2013/065296
申请日：2013-07-19
申请人： ATOTECH DEUTSCHLAND GMBH
发明人： BECK, Thomas , STEINBERGER, Gerhard , WALTER, Andreas
IPC分类号： H01L21/60 , H01L23/485
CPC分类号： H01L24/14 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0345 , H01L2224/03464 , H01L2224/0401 , H01L2224/05568 , H01L2224/05573 , H01L2224/05583 , H01L2224/05655 , H01L2224/05657 , H01L2224/05666 , H01L2224/05681 , H01L2224/10145 , H01L2224/11462 , H01L2224/1147 , H01L2224/1181 , H01L2224/11821 , H01L2224/11822 , H01L2224/11823 , H01L2224/11825 , H01L2224/11901 , H01L2224/13005 , H01L2224/13013 , H01L2224/13014 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13562 , H01L2224/13565 , H01L2224/13582 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13664 , H01L2224/13669 , H01L2224/13673 , H01L2224/13676 , H01L2224/16507 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/3841 , H01L2924/01074 , H01L2924/01015 , H01L2924/01005 , H01L2924/01042 , H01L2924/20751 , H01L2924/2076 , H01L2924/0105 , H01L2924/01047 , H01L2224/05552
摘要： The present invention relates to a method for forming a copper pillar on a semi-conducting substrate, the copper pillar having an underbump metallization area comprising a metal less noble than copper and optionally a solder bump on the top portion, and having a layer of a second metal selected from tin, tin alloys, silver, and silver alloys deposited onto the side walls of said copper pillar. A layer of a first metal which is more noble than copper is deposited onto the entire outer surface of the copper pillar prior to deposition of the second metal layer. The layer of a second metal then has at least a reduced number of undesired pin-holes and serves as a protection layer for the underlying copper pillar.
摘要翻译：本发明涉及一种在半导体基板上形成铜柱的方法，所述铜柱具有底部金属化区域，该底部金属化区域包括比铜更贵的金属，并且可选地在顶部上具有焊料凸块，并且具有选自沉积在所述铜柱的侧壁上的锡，锡合金，银和银合金的第二金属。在沉积第二金属层之前，在铜柱的整个外表面上沉积比铜更贵的第一金属层。然后，第二金属层至少具有减少数量的不期望的针孔，并且用作下面的铜柱的保护层。

9. 发明申请

WO2003025254A3 VORRICHTUNG ZUM TRANSPORT UND ZUR NASSCHEMISCHEN ODER ELEKTROLYTISCHEN BEHANDLUNG VON SEHR DÜNNEM UND FLACHEM BEHANDLUNGSGUT 审中-公开
公开(公告)号：WO2003025254A3
公开(公告)日：2003-03-27
申请号：PCT/DE2002/003562
申请日：2002-09-10
申请人： ATOTECH DEUTSCHLAND GMBH
发明人： MANCHEN, Michael , STEINBERGER, Gerhard
IPC分类号： C25D17/06
摘要： Es wird ein Stapelgehänge zum gleichzeitigem Transport einer Vielzahl von dünnem, flachem Behandlungsgut in nasschemischen oder elektrolytischen Anlagen beschrieben. Das Behandlungsgut wird an den Ecken mittels Aufhängern und/oder Spannblöcken (8) aufgehängt und festgeklemmt. Mittels Spannelementen wird es sicher und ohne Beschädigung im Stapelgehänge gehalten.

10. 发明申请

WO2003025254A2 VORRICHTUNG ZUM TRANSPORT UND ZUR NASSCHEMISCHEN ODER ELEKTROLYTISCHEN BEHANDLUNG VON SEHR DÜNNEM UND FLACHEM BEHANDLUNGSGUT 审中-公开
标题翻译：设备运输和湿法化学或电解处理非常薄，FLAT处理
公开(公告)号：WO2003025254A2
公开(公告)日：2003-03-27
申请号：PCT/DE2002/003562
申请日：2002-09-10
申请人： ATOTECH DEUTSCHLAND GMBH
发明人： MANCHEN, Michael , STEINBERGER, Gerhard
IPC分类号： C25D
CPC分类号： C25D17/06 , C25D17/08 , H05K3/0085
摘要： Es wird ein Stapelgehänge zum gleichzeitigem Transport einer Vielzahl von dünnem, flachem Behandlungsgut in nasschemischen oder elektrolytischen Anlagen beschrieben. Das Behandlungsgut wird an den Ecken mittels Aufhängern und/oder Spannblöcken aufgehängt und festgeklemmt. Mittels Spannelementen wird es sicher und ohne Beschädigung im Stapelgehänge gehalten.
摘要翻译：它描述了一种用于同时传输多个薄的，平坦材料的湿化学或电解系统待处理Stapelgehänge。待处理的材料通过衣架装置和/或所述夹紧块悬浮在角部和夹紧。夹紧元件意味着它是安全的，并没有损害Stapelgehänge举行。

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