专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP0719735A1 Fabrication of a thin sheet by a sol-gel process 失效
标题翻译： Sol-Gelverfahren zum Herstellen einesdünnenScheibenkörpers
公开(公告)号：EP0719735A1
公开(公告)日：1996-07-03
申请号：EP95308954.7
申请日：1995-12-11
申请人： AT&T Corp.
发明人： Chandross, Edwin Arthur , MacChesney, John Burnette , Johnson, David Wilfred, Jr. , Rabinovich, Eliezer M. , Thomson, John, Jr.
IPC分类号： C03B19/12 , C04B35/624
CPC分类号： C03B19/12 , C04B35/624 , Y02P40/57
摘要： Cracking in thin sheets of sol-gel-produced material (10) is avoided by use of a support liquid (11) during gelation and drying. Silica glass, as well as other glass and ceramic bodies, is contemplated.
摘要翻译：在凝胶化和干燥期间通过使用支撑液体（11）来避免在薄溶胶凝胶生产的材料（10）中破裂。考虑了二氧化硅玻璃以及其它玻璃和陶瓷体。

2. 发明授权

EP0700066B1 Spaced-gate emission device and method for making same 失效
标题翻译：具有隔开的网格和用于制备方法发射装置
公开(公告)号：EP0700066B1
公开(公告)日：2001-07-04
申请号：EP95305911.0
申请日：1995-08-23
申请人： AT&T Corp.
发明人： Jin, Sungho , Thomson, John, Jr. , Kochanski, Gregory Peter
IPC分类号： H01J9/02 , H01J3/02 , H01J31/12
CPC分类号： H01J9/025 , H01J2201/30403 , H01J2201/30457 , H01J2329/00

3. 发明公开

EP0698590A3 Metallization of ceramics through application of an adherent reducible layer 失效
标题翻译：通过将粘合剂层施加还原陶瓷材料的金属化
公开(公告)号：EP0698590A3
公开(公告)日：1997-04-16
申请号：EP95305684.3
申请日：1995-08-15
申请人： AT&T Corp.
发明人： Jin, Sungho , Law, Henry Hon , Johnson, David Wilfred, Jr. , Thomson, John, Jr. , Tiefel, Thomas Henry
IPC分类号： C04B41/88
CPC分类号： C04B41/009 , C04B41/4558 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/88 , C04B41/89 , C04B2111/00844 , H01L39/2474 , H01L41/29 , H05K1/0306 , H05K3/105 , Y10S428/901 , Y10T428/12007 , Y10T428/12493 , Y10T428/24926 , C04B41/4572 , C04B41/5027 , C04B41/4519 , C04B41/4578 , C04B41/5025 , C04B41/5194 , C04B2103/0096 , C04B41/4541 , C04B35/10 , C04B35/00 , C04B35/26 , C04B35/45
摘要： The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate (20) and depositing a layer of reducible material (30) on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions (40) having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region (42) is interspersed between the sintered ceramic regions. In this fashion, the metal is firmly held to the ceramic substrate due to the presence of the bonded ceramic within the metallized layer.

4. 发明授权

EP0512718B1 Process for making a ferrite multistructure 失效
标题翻译：一种用于制造铁素体的多层结构的方法。
公开(公告)号：EP0512718B1
公开(公告)日：1995-04-19
申请号：EP92303700.6
申请日：1992-04-24
申请人： AT&T Corp.
发明人： Grader, Gideon S. , Johnson, David Wilfred, Jr. , Roy, Apurba , Thomson, John, Jr.
IPC分类号： H01F41/02
CPC分类号： H01F41/16 , H01F17/0033 , Y10T29/4902

5. 发明授权

EP0698590B1 Metallization of ceramics through application of an adherent reducible layer 失效
标题翻译：通过将粘合剂层施加还原陶瓷材料的金属化
公开(公告)号：EP0698590B1
公开(公告)日：2003-10-22
申请号：EP95305684.3
申请日：1995-08-15
申请人： AT&T Corp.
发明人： Jin, Sungho , Law, Henry Hon , Johnson, David Wilfred, Jr. , Thomson, John, Jr. , Tiefel, Thomas Henry
IPC分类号： C04B41/88
CPC分类号： C04B41/009 , C04B41/4558 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/88 , C04B41/89 , C04B2111/00844 , H01L39/2474 , H01L41/29 , H05K1/0306 , H05K3/105 , Y10S428/901 , Y10T428/12007 , Y10T428/12493 , Y10T428/24926 , C04B41/4572 , C04B41/5027 , C04B41/4519 , C04B41/4578 , C04B41/5025 , C04B41/5194 , C04B2103/0096 , C04B41/4541 , C04B35/10 , C04B35/00 , C04B35/26 , C04B35/45

6. 发明公开

EP0700066A1 Spaced-gate emission device and method for making same 失效
标题翻译： Emissionsvorrichtung mit beabstandetem Gitter und Verfahren zur Herstellung
公开(公告)号：EP0700066A1
公开(公告)日：1996-03-06
申请号：EP95305911.0
申请日：1995-08-23
申请人： AT&T Corp.
发明人： Jin, Sungho , Thomson, John, Jr. , Kochanski, Gregory Peter
IPC分类号： H01J9/02 , H01J3/02 , H01J31/12
CPC分类号： H01J9/025 , H01J2201/30403 , H01J2201/30457 , H01J2329/00
摘要： A field emission device is made by disposing emitter material on an insulating substrate, applying a sacrificial film to the emitter material and forming over the sacrificial layer a conductive gate layer having a random distribution of apertures therein. In the preferred process, the gate is formed by applying masking particles to the sacrificial film, applying a conductive film over the masking particles and the sacrificial film and then removing the masking particles to reveal a random distribution of apertures. The sacrificial film is then removed. The apertures then extend to the emitter material. In a preferred embodiment, the sacrificial film contains dielectric spacer particles which remain after the film is removed to separate the emitter from the gate. The result is a novel and economical field emission device having numerous randomly distributed emission apertures which can be used to make low cost flat panel displays.
摘要翻译：场致发射器件是通过将发射极材料设置在绝缘衬底上，将牺牲膜施加到发射极材料并在牺牲层上形成具有其中孔径随机分布的导电栅极层制成的。在优选的方法中，通过将掩模颗粒施加到牺牲膜上，在掩模颗粒和牺牲膜上施加导电膜，然后去除掩模颗粒以露出孔的随机分布来形成栅极。然后去除牺牲膜。然后孔径延伸到发射体材料。在优选实施例中，牺牲膜含有电介质间隔物颗粒，其在除去膜之后保留，以将发射极与栅极分离。结果是一种新颖且经济的场致发射装置，其具有许多随机分布的发射孔径，可用于制造低成本的平板显示器。

7. 发明公开

EP0698590A2 Metallization of ceramics through application of an adherent reducible layer 失效
标题翻译：通过将粘合剂层施加还原陶瓷材料的金属化
公开(公告)号：EP0698590A2
公开(公告)日：1996-02-28
申请号：EP95305684.3
申请日：1995-08-15
申请人： AT&T Corp.
发明人： Jin, Sungho , Law, Henry Hon , Johnson, David Wilfred, Jr. , Thomson, John, Jr. , Tiefel, Thomas Henry
IPC分类号： C04B41/88
CPC分类号： C04B41/009 , C04B41/4558 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/88 , C04B41/89 , C04B2111/00844 , H01L39/2474 , H01L41/29 , H05K1/0306 , H05K3/105 , Y10S428/901 , Y10T428/12007 , Y10T428/12493 , Y10T428/24926 , C04B41/4572 , C04B41/5027 , C04B41/4519 , C04B41/4578 , C04B41/5025 , C04B41/5194 , C04B2103/0096 , C04B41/4541 , C04B35/10 , C04B35/00 , C04B35/26 , C04B35/45
摘要： The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate (20) and depositing a layer of reducible material (30) on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions (40) having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region (42) is interspersed between the sintered ceramic regions. In this fashion, the metal is firmly held to the ceramic substrate due to the presence of the bonded ceramic within the metallized layer.
摘要翻译：本发明提供了一种金属化陶瓷基片的改进的技术。该方法包括提供一个陶瓷基板（20）和沉积在陶瓷基板还原材料（30）的层。可还原的材料的层包括一种可还原的陶瓷颜色：如氧化铜。具有材料设置在其上可还原的层中的陶瓷基片被加热和可还原的物质与还原剂接触以产生导电区域。所述导电区是要么通过还原形成的金属化的区域中，或者它是一个导电性陶瓷表面通过还原形成的。本发明还提供一种金属化的陶瓷基片。该金属化层包括具有共同的至少一种成分与所述陶瓷基板的陶瓷区域（40）。陶瓷基板和金属化层的陶瓷区域被烧结以海誓山盟检查做了金属化区域（42）的烧结的陶瓷区域之间散布。以这种方式，所述金属牢固地保持陶瓷基板由于结合的陶瓷的金属化层内的存在。

8. 发明公开

EP0512718A1 Process for making a ferrite multistructure 失效
标题翻译： Verfahren zur Herstellung einer Ferrit-Mehrschichtstruktur。
公开(公告)号：EP0512718A1
公开(公告)日：1992-11-11
申请号：EP92303700.6
申请日：1992-04-24
申请人： AT&T Corp.
发明人： Grader, Gideon S. , Johnson, David Wilfred, Jr. , Roy, Apurba , Thomson, John, Jr.
IPC分类号： H01F41/02
CPC分类号： H01F41/16 , H01F17/0033 , Y10T29/4902
摘要： Magnetic components are fabricated as monolithic structures using multilayer co-fired ceramic tape techniques. Fabrication of these magnetic components involves constructing multiple layers of a magnetic material and an insulating non-magnetic mataerial to form a monolithic structure with well defined magnetic and insulating non-magnetic regions. Windings are formed using screen printed conductors connected through the multilayer structure by conducting vias.
摘要翻译：使用多层共烧陶瓷带技术将磁性部件制成为整体式结构。这些磁性部件的制造涉及构造多层磁性材料和绝缘非磁性材料以形成具有良好限定的磁性和绝缘非磁性区域的整体结构。使用通过导电通孔通过多层结构连接的丝网印刷导体形成绕组。

9. 发明公开

EP0478188A3 Integrated circuit package and compact assemblies thereof 失效
标题翻译：集成电路封装及其紧凑型组件
公开(公告)号：EP0478188A3
公开(公告)日：1992-07-08
申请号：EP91308391.1
申请日：1991-09-13
申请人： AT&T Corp.
发明人： Tai, King Lien , Thomson, John, Jr.
IPC分类号： H01L25/11 , H01L23/498 , H01L23/057
CPC分类号： H01L23/3672 , H01L23/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49109 , H01L2225/1005 , H01L2225/1035 , H01L2225/1064 , H01L2225/1094 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01066 , H01L2924/01079 , H01L2924/09701 , H01L2924/12033 , H01L2924/14 , H01L2924/15156 , H01L2924/1532 , H01L2924/1627 , H01L2924/00 , H01L2224/05599
摘要： An integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conductive connectors extending laterally through the rectangular structure. Preferably the rectangular structure also includes transverse contacts. Advantageously the plate includes extensions beyond the rectangular structure for acting as cooling fins on opposing sides of the rectangular structure. The linear arrays and cooling fins are preferably on different pairs of parallel sides. The integrated circuit package permits the aggregation of packages into assemblies and into clusters of assemblies rich in interconnections. Vertically stacked packages form a rectangular parallelepiped having a plurality of parallel planar cooling fins projecting from two opposing surfaces and another pair of planar surfaces providing rectangular arrays of contacts to the enclosed integrated circuits. In addition, transverse contacts permit electrical interconnection of the stacked packages. Linear clusters can be aggregated as a linear array of such assemblies with their contact surfaces interconnected either directly by an anisotropically conducting plane or indirectly by an intervening transformation plane. In a preferred linear cluster, successive assemblies are rotated by 90° with respect to the axis of the array. In such clusters each package in the rotated assembly contacts each package in the neighboring assemblies. In low power equipment, elimination of the cooling fins permits even higher levels of interconnection such as rectangular clusters of assemblies.

10. 发明公开

EP0478188A2 Integrated circuit package and compact assemblies thereof 失效
标题翻译： Integrierte Schaltungspackung und kompakter Zusammenbau dieser Packungen。
公开(公告)号：EP0478188A2
公开(公告)日：1992-04-01
申请号：EP91308391.1
申请日：1991-09-13
申请人： AT&T Corp.
发明人： Tai, King Lien , Thomson, John, Jr.
IPC分类号： H01L25/11 , H01L23/498 , H01L23/057
CPC分类号： H01L23/3672 , H01L23/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49109 , H01L2225/1005 , H01L2225/1035 , H01L2225/1064 , H01L2225/1094 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01066 , H01L2924/01079 , H01L2924/09701 , H01L2924/12033 , H01L2924/14 , H01L2924/15156 , H01L2924/1532 , H01L2924/1627 , H01L2924/00 , H01L2224/05599
摘要： An integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conductive connectors extending laterally through the rectangular structure. Preferably the rectangular structure also includes transverse contacts. Advantageously the plate includes extensions beyond the rectangular structure for acting as cooling fins on opposing sides of the rectangular structure. The linear arrays and cooling fins are preferably on different pairs of parallel sides.
The integrated circuit package permits the aggregation of packages into assemblies and into clusters of assemblies rich in interconnections. Vertically stacked packages form a rectangular parallelepiped having a plurality of parallel planar cooling fins projecting from two opposing surfaces and another pair of planar surfaces providing rectangular arrays of contacts to the enclosed integrated circuits. In addition, transverse contacts permit electrical interconnection of the stacked packages.
Linear clusters can be aggregated as a linear array of such assemblies with their contact surfaces interconnected either directly by an anisotropically conducting plane or indirectly by an intervening transformation plane. In a preferred linear cluster, successive assemblies are rotated by 90° with respect to the axis of the array. In such clusters each package in the rotated assembly contacts each package in the neighboring assemblies. In low power equipment, elimination of the cooling fins permits even higher levels of interconnection such as rectangular clusters of assemblies.
摘要翻译：集成电路封装（10）包括用于接收集成电路的导热板（11）和用于围绕电路的侧面的导体和绝缘体的开放矩形结构（20），并且呈现一个或多个线性阵列的导电连接器延伸横向穿过矩形结构。优选地，矩形结构还包括横向接触。有利地，板包括超过矩形结构的延伸部，用于在矩形结构的相对侧上用作冷却片（12）。线性阵列和冷却翅片优选地在不同的平行侧对上。集成电路封装允许将封装集合到组件中并且集成到具有互连的组件的集群中。垂直堆叠的包装形成长方体，其具有从两个相对的表面突出的多个平行的平面冷却翅片和另一对平面，其向封闭的集成电路提供矩形的触点阵列。此外，横向触点允许堆叠封装的电互连。线性簇可以聚集成这样的组件的线性阵列，其接触表面直接通过各向异性导电平面互相连接，或间接地通过中间转换平面相互连接。在优选的线性簇中，连续的组件相对于阵列的轴线旋转90°。在这样的群集中，旋转的组件中的每个包装都接触相邻组件中的每个包装。在低功率设备中，消除散热片允许甚至更高级别的互连，例如矩形组件组。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式