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    • 7. 发明申请
    • PROCESS CHAMBER FOR DIELECTRIC GAPFILL
    • 电介质加工室
    • WO2007140421A9
    • 2008-12-31
    • PCT/US2007069996
    • 2007-05-30
    • APPLIED MATERIALS INCLUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • LUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • C23F1/00C23C16/22C23C16/30C23C16/36C23C16/40C23C16/46C23C16/48C23C16/52H01L21/306
    • C23C16/46C23C16/452C23C16/45565C23C16/45574H01L21/67115
    • A system (100) to form a dielectric layer on a substrate from a plasma of dielectric precursors is described. The system (100) may include a deposition chamber (201 ), a substrate stage in the deposition chamber (201 ) to hold the substrate, and a remote plasma generating system coupled to the deposition chamber (201 ), where the plasma generating system is used to generate a dielectric precursor having one or more reactive radicals. The system (100) may also include a precursor distribution system (700) comprising dual-channel showerhead (700) positioned above the substrate stage. The showerhead (700) may have a faceplate (802) with a first set of openings (804) through which the reactive radical precursor enters the deposition chamber (201 ), and a second set of openings (806) through which a second dielectric precursor enters the deposition chamber (201 ). An in-situ plasma generating system may als be included to generate the plasma in the deposition chamber (201 ) from the dielectric precursors supplied to the deposition chambe (201).
    • 描述了从电介质前体的等离子体在衬底上形成电介质层的系统(100)。 系统(100)可以包括沉积室(201),沉积室(201)中的用于保持基板的基板台和耦合到沉积室(201)的等离子体生成系统,其中等离子体产生系统是 用于产生具有一个或多个反应性基团的电介质前体。 系统(100)还可以包括前置分布系统(700),其包括位于衬底台上方的双通道喷头(700)。 喷头(700)可以具有带有第一组开口(804)的面板(802),反应性基团前体通过该开口进入沉积室(201),第二组开口(806)通过第二组开口 进入沉积室(201)。 可以包括原位等离子体产生系统以在从沉积腔(201)提供的电介质前体在沉积室(201)中产生等离子体。
    • 8. 发明申请
    • PROCESS CHAMBER FOR DIELECTRIC GAPFILL
    • 电介质加工室
    • WO2007140426A3
    • 2008-12-11
    • PCT/US2007070001
    • 2007-05-30
    • APPLIED MATERIALS INCLUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • LUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • C23F1/00C23C16/22C23C16/30C23C16/36C23C16/40C23C16/46C23C16/48C23C16/52H01L21/306
    • C23C16/45565C23C16/402C23C16/45574C23C16/505
    • A system (100) to form a dielectric layer on a substrate from a plasma of dielectric precursors is described. The system (100) may include a deposition chamber (201), a substrate stage in the deposition chamber (201) to hold the substrate, and a remote plasma generating system coupled to the deposition chamber (201), where the plasma generating system is used to generate a dielectric precursor having one or more reactive radicals. The system (100) may also include a precursor distribution system (700) comprising a dual-channel showerhead (700) positioned above the substrate stage. The showerhead (700) may have a faceplate (802) with a first set of openings (804) through which the reactive radical precursor enters the deposition chamber (201), and a second set of openings (806) through which a second dielectric precursor enters the deposition chamber (201). An in-situ plasma generating system may also be included to generate the plasma in the deposition chamber (201) from the dielectric precursors supplied to the deposition chamber (201)
    • 描述了从电介质前体的等离子体在衬底上形成电介质层的系统(100)。 系统(100)可以包括沉积室(201),沉积室(201)中的用于保持基板的基板台和耦合到沉积室(201)的等离子体生成系统,其中等离子体产生系统是 用于产生具有一个或多个反应性基团的电介质前体。 系统(100)还可以包括前体分配系统(700),其包括位于衬底台上方的双通道喷头(700)。 喷头(700)可以具有带有第一组开口(804)的面板(802),反应性基团前体通过该开口进入沉积室(201),第二组开口(806)通过第二组开口 进入沉积室(201)。 还可以包括原位等离子体产生系统,以从沉积室(201)中提供的电介质前体在沉积室(201)中产生等离子体,
    • 9. 发明申请
    • PROCESS CHAMBER FOR DIELECTRIC GAPFILL
    • 电介质加工室
    • WO2007140421A3
    • 2008-10-30
    • PCT/US2007069996
    • 2007-05-30
    • APPLIED MATERIALS INCLUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • LUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • C23F1/00C23C16/22C23C16/30C23C16/36C23C16/40C23C16/46C23C16/48C23C16/52H01L21/306
    • C23C16/46C23C16/452C23C16/45565C23C16/45574H01L21/67115
    • A system (100) to form a dielectric layer on a substrate from a plasma of dielectric precursors is described. The system (100) may include a deposition chamber (201 ), a substrate stage in the deposition chamber (201 ) to hold the substrate, and a remote plasma generating system coupled to the deposition chamber (201 ), where the plasma generating system is used to generate a dielectric precursor having one or more reactive radicals. The system (100) may also include a precursor distribution system (700) comprising dual-channel showerhead (700) positioned above the substrate stage. The showerhead (700) may have a faceplate (802) with a first set of openings (804) through which the reactive radical precursor enters the deposition chamber (201 ), and a second set of openings (806) through which a second dielectric precursor enters the deposition chamber (201 ). An in-situ plasma generating system may als be included to generate the plasma in the deposition chamber (201 ) from the dielectric precursors supplied to the deposition chambe (201)
    • 描述了从电介质前体的等离子体在衬底上形成电介质层的系统(100)。 系统(100)可以包括沉积室(201),沉积室(201)中的用于保持基板的基板台和耦合到沉积室(201)的等离子体生成系统,其中等离子体产生系统是 用于产生具有一个或多个反应性基团的电介质前体。 系统(100)还可以包括前置分布系统(700),其包括位于衬底台上方的双通道喷头(700)。 喷头(700)可以具有带有第一组开口(804)的面板(802),反应性基团前体通过该开口进入沉积室(201),第二组开口(806)通过第二组开口 进入沉积室(201)。 可以包括原位等离子体产生系统以在从沉积腔(201)提供的电介质前体在沉积室(201)中产生等离子体,