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1. 发明申请

WO2007109432A3 METHODS AND APPARATUS FOR ELECTROPROCESSING WITH RECESSED BIAS CONTACT 审中-公开
标题翻译：具有凹陷接触的电子加工方法和装置
公开(公告)号：WO2007109432A3
公开(公告)日：2007-11-29
申请号：PCT/US2007063579
申请日：2007-03-08
申请人： APPLIED MATERIALS INC , WANG YAN , HSU WEI-YUNG , DUBOUST ALAIN , MANENS ANTOINE P
发明人： WANG YAN , HSU WEI-YUNG , DUBOUST ALAIN , MANENS ANTOINE P
IPC分类号： H01L21/44
CPC分类号： B23H5/08 , B24B37/046 , B24B37/20 , C25D17/10 , C25F7/00
摘要： A method and apparatus are provided for electroprocessing with recessed bias contact. In one embodiment, the apparatus includes a platen, a processing pad disposed on the platen and having at least a first aperture and a second aperture formed therethrough, a first electrode positioned under the processing pad and exposed to a polishing surface of the processing pad through the first aperture, wherein an upper surface of the first electrode is recessed from the polishing surface; a plurality of second electrodes exposed to the polishing surface through the second aperture, wherein upper surfaces of the second electrodes are recessed from the polishing surface, and an electrical circuit coupled to the first and second electrodes and configured to bias each of the second electrodes independently relative to the first electrode.
摘要翻译：提供了用于具有凹入式偏置接触的电处理的方法和设备。在一个实施例中，该设备包括台板，设置在台板上并且至少具有穿过其形成的第一孔和第二孔的加工垫，位于加工垫下方并且通过加工垫的抛光表面暴露的第一电极所述第一孔口，其中所述第一电极的上表面从所述抛光表面凹陷; 多个第二电极，所述多个第二电极通过所述第二孔暴露于所述抛光表面，其中所述第二电极的上表面从所述抛光表面凹入;以及电路，所述电路耦合至所述第一电极和所述第二电极并且被配置为独立地偏压所述第二电极相对于第一电极。

2. 发明申请

WO2011017572A3 LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING 审中-公开
标题翻译：用于薄膜太阳能电池板激光切割的激光模块和工艺
公开(公告)号：WO2011017572A3
公开(公告)日：2011-06-16
申请号：PCT/US2010044620
申请日：2010-08-05
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , LEI WEI-SHENG , HSU WEI-YUNG , SHAMOUN BASSAM , WANG YAN
发明人： MANENS ANTOINE P , LEI WEI-SHENG , HSU WEI-YUNG , SHAMOUN BASSAM , WANG YAN
IPC分类号： H01L31/18 , B23K26/36 , H01L31/042 , H01S3/10
CPC分类号： H01L31/18 , B23K26/0673 , B23K26/082 , B23K26/364
摘要： Laser systems for laser scribing are provided. The systems include a remote module coupled to a laser module through a cable. The remote module includes a controller and a chiller. The laser module has at least a laser source and a cooling plate. The laser module is operable to remove material from at least a portion of a workpiece. The systems also include a plurality of termination modules coupled to the laser module through a plurality of optical fibers. Each of the termination modules includes a mechanical interface. The mechanical interface is coupled to a respective optical fiber. The systems further include a plurality of scanning devices operable to control a position of the output from the laser. Each of the scanning devices is coupled to a respective mechanical interface.
摘要翻译：提供用于激光刻划的激光系统。该系统包括通过电缆耦合到激光模块的远程模块。远程模块包括一个控制器和一个冷却器。激光模块至少具有激光源和冷却板。激光模块可操作以从工件的至少一部分去除材料。该系统还包括通过多个光纤耦合到激光模块的多个终端模块。每个终端模块都包括一个机械接口。机械接口耦合到相应的光纤。该系统还包括多个扫描装置，其可操作以控制来自激光器的输出的位置。每个扫描设备都耦合到相应的机械接口。

3. 发明申请

WO2007117301A3 BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION 审中-公开
标题翻译：用于铜减少和减少焦距的球接触罩
公开(公告)号：WO2007117301A3
公开(公告)日：2008-01-31
申请号：PCT/US2006060421
申请日：2006-11-01
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , DUBOUST ALAIN , OLGADO DONALD J K , WANG YAN , SALAS-VERNIS JOSE , CHANG SHOU-SUNG
发明人： MANENS ANTOINE P , DUBOUST ALAIN , OLGADO DONALD J K , WANG YAN , SALAS-VERNIS JOSE , CHANG SHOU-SUNG
IPC分类号： B24B37/16 , H01L21/321
CPC分类号： B24B37/16 , B23H5/08 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing comprises a conductive material. In another embodiment, the housing comprises a lower housing and a contact cover wherein the contact cover comprises a conductive material.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理衬底的方法和装置。在一个实施例中，用于电化学处理衬底的接触组件包括具有设置在通过壳体形成的通道中的球的壳体。该球适于在加工过程中从壳体部分延伸以接触基底。壳体包括导电材料。在另一个实施例中，壳体包括下壳体和接触盖，其中接触盖包括导电材料。

4. 发明申请

WO2006081285A2 ELECTROPROCESSING PROFILE CONTROL 审中-公开
标题翻译：电子轮廓控制
公开(公告)号：WO2006081285A2
公开(公告)日：2006-08-03
申请号：PCT/US2006002595
申请日：2006-01-24
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , GALBURT VLADIMIR , WANG YAN , DUBOUST ALAIN , OLGADO DONALD J K , CHEN LIANG-YUH
发明人： MANENS ANTOINE P , GALBURT VLADIMIR , WANG YAN , DUBOUST ALAIN , OLGADO DONALD J K , CHEN LIANG-YUH
IPC分类号： B23H5/08 , B24D99/00 , B24B37/04 , H01L21/321
CPC分类号： B23H5/08 , B24B37/042 , C25D17/10 , C25F7/00
摘要： A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially outward of substrate with a polarity opposite the bias applied to the first electrode.
摘要翻译：提供了一种用于电子处理衬底的方法和装置。在一个实施例中，用于电子处理衬底的方法包括以下步骤：偏置第一电极以在电极和衬底之间建立第一电处理区，并且以与施加到衬底的偏压相反的极性偏置衬底径向外侧的第二电极第一电极。

5. 发明申请

WO2004108358A3 CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：电化学机械抛光导电抛光法
公开(公告)号：WO2004108358A3
公开(公告)日：2005-06-09
申请号：PCT/US2004017827
申请日：2004-06-07
申请人： APPLIED MATERIALS INC , HU YONGQI , DUBOUST ALAIN , MANENS ANTOINE P , TSAI STAN D , BUTTERFIELD PAUL D , WANG YAN , LIU FENG Q , NEO SIEW S , CHEN LIANG-YUH , TIAN YUAN A , KO SEN-HOU , EWALD ROBERT A
发明人： HU YONGQI , DUBOUST ALAIN , MANENS ANTOINE P , TSAI STAN D , BUTTERFIELD PAUL D , WANG YAN , LIU FENG Q , NEO SIEW S , CHEN LIANG-YUH , TIAN YUAN A , KO SEN-HOU , EWALD ROBERT A
IPC分类号： B23H5/08 , B24B37/20 , B24B37/22 , C25F7/00 , B24B37/04 , H01L21/321
CPC分类号： B82Y30/00 , B23H5/08 , B24B37/205 , B24B37/22 , C25F7/00
摘要： Embodiments of a polishing article for processing a substracte are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理减法器的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层可以是编织的或无纺的。导电层可以由软质材料组成，并且在一个实施例中，暴露表面可以是平面的。

6. 发明申请

WO2007047215A2 CONTACT ASSEMBLY CLEANING IN AN ELECTRO-CHEMICAL MECHANICAL PROCESSING APPARATUS 审中-公开
标题翻译：在电化学机械加工设备中接触组件清洁
公开(公告)号：WO2007047215A2
公开(公告)日：2007-04-26
申请号：PCT/US2006039439
申请日：2006-10-10
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , DUBOUST ALAIN , BUTTERFIELD PAUL D , MARTINEZ RICARDO , WANG YAN , SALAS-VERNIS JOSE
发明人： MANENS ANTOINE P , DUBOUST ALAIN , BUTTERFIELD PAUL D , MARTINEZ RICARDO , WANG YAN , SALAS-VERNIS JOSE
IPC分类号： C25D21/06
CPC分类号： C25F7/00 , B23H5/08 , B24B37/16 , B24B53/017
摘要： Embodiments of the invention generally provide a method and apparatus for cleaning an electrical contact in an electrochemical mechanical planarizing apparatus. In one embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of draining electrolyte from the contact assembly and flowing a rinsing fluid into the contact assembly. In another embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of preventing fluid from passing between an interface of the contact assembly and a pad disposed outward thereof, flowing a rinsing fluid into the contact assembly and draining fluid flowing out of the contact assembly.
摘要翻译：本发明的实施例通常提供用于清洁电化学机械平坦化设备中的电触点的方法和设备。在一个实施例中，一种用于清洁电处理设备中的接触组件的方法包括以下步骤：从接触组件中排出电解质并且使冲洗流体流入接触组件中。在另一个实施例中，一种用于清洁电处理设备中的接触组件的方法包括以下步骤：防止流体在接触组件的接口和设置在接触组件的外部的垫之间流动，使冲洗流体流入接触组件并排出流出的流体的接触组件。

7. 发明申请

WO2005002794A3 CELL, SYSTEM AND ARTICLE FOR ELECTROCHEMICAL MECHANICAL PROCESSING (ECMP) 审中-公开
标题翻译：电化学机械加工用电池，系统及其制品（ECMP）
公开(公告)号：WO2005002794A3
公开(公告)日：2005-03-31
申请号：PCT/US2004022722
申请日：2004-07-01
申请人： APPLIED MATERIALS INC , WANG YAN , NEO SIEW S , LIU FENG Q , TSAI STAN D , HU YONGQI , DUBOUST ALAIN , MANENS ANTOINE P , WADENSWEILER RALPH M , MAVLIV RASHID , CHEN LIANG-YUH , OLGADO DONALD J K , BUTTERFIELD PAUL D , TSENG MING-KUEI , CHANG SHOU-SUNG , SUN LIZHONG
发明人： WANG YAN , NEO SIEW S , LIU FENG Q , TSAI STAN D , HU YONGQI , DUBOUST ALAIN , MANENS ANTOINE P , WADENSWEILER RALPH M , MAVLIV RASHID , CHEN LIANG-YUH , OLGADO DONALD J K , BUTTERFIELD PAUL D , TSENG MING-KUEI , CHANG SHOU-SUNG , SUN LIZHONG
IPC分类号： B23H5/08 , B24B37/04 , B24B53/007 , C25F7/00 , H01L21/321
CPC分类号： B24B37/04 , B23H5/08 , B24B53/017 , C25F7/00
摘要： The invention provides a cell, a system and an article for processing a substrate in an electrochemical mechanical polishing system. A cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper polishing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. A system is provided having a bulk polishing cell and a residual polishing cell. The residual polishing cell includes a biased conductive polishing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明提供一种用于在电化学机械抛光系统中处理基底的电池，系统和制品。用于抛光基板的单元包括设置在压板组件的顶表面上的抛光垫。多个导电元件跨过上抛光表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏置衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。提供了具有大量抛光单元和残余抛光单元的系统。残余抛光单元包括偏置的导电抛光表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

8. 发明申请

WO2013033428A3 IN SITU PROCESS KIT CLEAN FOR MOCVD CHAMBERS 审中-公开
标题翻译：现场加工成套工具为MOCVD房间清洁
公开(公告)号：WO2013033428A3
公开(公告)日：2013-04-25
申请号：PCT/US2012053186
申请日：2012-08-30
申请人： APPLIED MATERIALS INC , LU JIANG , CHUNG HUA , WANG YAN , SHEN KUAN CHIEN KERIS , DONG XIZI , DUBOUST ALAIN , HSU WEI-YUNG , GRIFFIN KEVIN S , OLGADO DONALD J K
发明人： LU JIANG , CHUNG HUA , WANG YAN , SHEN KUAN CHIEN KERIS , DONG XIZI , DUBOUST ALAIN , HSU WEI-YUNG , GRIFFIN KEVIN S , OLGADO DONALD J K
IPC分类号： H01L21/205 , H01L21/02 , H01L21/302
CPC分类号： H01L21/67115 , C23C16/4405
摘要： Embodiments of the invention include methods of in situ cleaning of deposited materials from the surfaces of processing chambers, e.g., MOCVD processing chambers. The cleaning process increases the time between preventative maintenance cleanings and reduces chamber down-time by targeting the removal of the layers deposited on the interior surfaces of the chamber body and/or liner, as well as the process kit components. The cleaning process occurs while shielding the showerhead and a carrier plate from at least some of the cleaning gases used during the cleaning process. To prevent chemical attack of the layers already deposited on the surface of the showerhead, and to prevent poisoning of the layers deposited after performing the cleaning process, the showerhead and the carrier plate are shielded from the cleaning gas by delivering an inert gas through the showerhead and across the surface of the carrier plate and/or cleaning plate during the cleaning.
摘要翻译：本发明的实施例包括从处理室例如MOCVD处理室的表面就地清洁沉积材料的方法。清洁过程增加了预防性维护清洁之间的时间，并通过针对去除沉积在腔室主体和/或衬里的内表面上的层以及处理套件组件来减少腔室停机时间。清洁过程发生的同时将喷头和承载板与清洁过程中使用的至少一些清洁气体隔离。为了防止已经沉积在喷头表面上的层的化学侵蚀，并且为了防止在执行清洁过程之后沉积的层的中毒，通过将惰性气体输送通过喷头来将喷头和承载板与清洁气体隔离并且在清洁期间越过承载板和/或清洁板的表面。

9. 发明申请

WO2007121177A3 PLANARIZATION OF SUBSTRATES AT A HIGH POLISHING RATE USING ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：使用电化学机械抛光在高抛光速率下对基板进行平面化
公开(公告)号：WO2007121177A3
公开(公告)日：2007-12-21
申请号：PCT/US2007066329
申请日：2007-04-10
申请人： APPLIED MATERIALS INC , DUBOUST ALAIN , HSU WEI-YUNG , LIU FENG Q , WANG YAN , WANG ZHIHONG , ECONOMIKOS LAERTIS
发明人： DUBOUST ALAIN , HSU WEI-YUNG , LIU FENG Q , WANG YAN , WANG ZHIHONG , ECONOMIKOS LAERTIS
IPC分类号： B24B1/00 , B24B7/19
CPC分类号： B23H5/08 , B24B37/042 , C25D11/34 , C25F1/04 , H01L21/32125
摘要： A method and apparatus for removing conductive material from a substrate surface are provided. In one embodiment, a method is provided for electrochemical mechanical polishing of a substrate. A substrate comprising dielectric feature definitions, a barrier material disposed on the feature definitions, and a bulk conductive material in an amount sufficient to fill the feature definitions is provided. The substrate is exposed to an electrolyte solution. A passivation layer is formed on the conductive material. The passivation strength of the passivation layer is increased by polishing the substrate with a first voltage for a first time period. The substrate is polished with a second voltage higher than the first voltage for a second time period. Conductive material is removed from at least a portion of the substrate surface by anodic dissolution.
摘要翻译：提供了用于从基板表面去除导电材料的方法和装置。在一个实施例中，提供了一种用于衬底的电化学机械抛光的方法。提供了包括介电特征定义的基板，设置在特征定义上的阻挡材料以及足以填充特征定义的量的体导电材料。将基底暴露于电解质溶液。在导电材料上形成钝化层。通过用第一时间段的第一电压抛光衬底来增加钝化层的钝化强度。在第二时间段内以比第一电压高的第二电压来抛光衬底。通过阳极溶解从导电材料的至少一部分去除导电材料。

10. 发明申请

WO2007019279A3 METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE 审中-公开
标题翻译：用于抛光底物的方法和组合物
公开(公告)号：WO2007019279A3
公开(公告)日：2007-05-10
申请号：PCT/US2006030381
申请日：2006-08-03
申请人： APPLIED MATERIALS INC , LIU FENG Q , DU TIANBAO , DUBOUST ALAIN , WANG YAN , HU YONGQI , TSAI STAN D , CHEN LIANG-YUH , TU WEN-CHIANG , HSU WEI-YUNG
发明人： LIU FENG Q , DU TIANBAO , DUBOUST ALAIN , WANG YAN , HU YONGQI , TSAI STAN D , CHEN LIANG-YUH , TU WEN-CHIANG , HSU WEI-YUNG
IPC分类号： B23H5/06 , B23H5/08
CPC分类号： B23H5/08 , B24B37/042 , C25F3/02 , H01L21/32125 , H01L21/6875 , H01L21/7684
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率除去，以及然后用至少一种化学机械抛光技术研磨衬底。

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