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    • 8. 发明申请
    • APPARATUS AND METHODS FOR SPECTRUM BASED MONITORING OF CHEMICAL MECHANICAL POLISHING
    • 用于基于频谱监测化学机械抛光的装置和方法
    • WO2007024807A3
    • 2007-07-12
    • PCT/US2006032659
    • 2006-08-21
    • APPLIED MATERIALS INCBENVEGNU DOMINIC JDAVID JEFFREY DRUESWEDEK BOGDANLEE HARRY QKARUPPIAH LAKSHMANAN
    • BENVEGNU DOMINIC JDAVID JEFFREY DRUESWEDEK BOGDANLEE HARRY QKARUPPIAH LAKSHMANAN
    • B24B37/04B24B49/12
    • B24B37/042B24B37/205B24B49/12
    • Apparatus and methods for spectrum based monitoring of chemical mechanical polishing, including spectrum based endpointing, spectrum based polishing rate adjustment, flushing a top surface of an optical head (53), or a pad (30) with a window. The spectrum-based endpointing uses a reference spectrum which is empirically selected for particular spectrum based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum based endpoint logic. The polishing endpoint can be determined using a difference trace or a sequence of index values. The flushing system creates a laminar gas flow across the top surface of the optical head (53) . The vacuum nozzle (308) and vacuum sources (312) are configured so that the flow of gas is laminar. The window includes a soft plastic portion and a crystalline or glass like portion. The spectrum based polishing rate adjustment includes obtaining spectra for different zones on a substrate.
    • 用于基于频谱的化学机械抛光监测的装置和方法,包括基于光谱的终点,基于光谱的抛光速率调整,冲洗光学头(53)的顶表面或具有窗口的垫(30)。 基于频谱的终点使用参考频谱,该参考频谱是针对特定的基于频谱的端点确定逻辑进行经验选择的,以便通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 可以使用差异迹线或索引值序列来确定抛光终点。 冲洗系统在光学头(53)的顶表面上产生层流气流。 真空喷嘴(308)和真空源(312)构造成使得气体流是层流的。 窗口包括软塑料部分和结晶或玻璃状部分。 基于光谱的抛光速率调节包括获得基底上不同区域的光谱。
    • 9. 发明申请
    • ENDPOINT METHOD USING PEAK LOCATION OF MODIFIED SPECTRA
    • 使用修改光谱的峰位置的端点方法
    • WO2011139575A3
    • 2012-02-23
    • PCT/US2011033320
    • 2011-04-20
    • APPLIED MATERIALS INCDAVID JEFFREY DRUESIN GARRETT HOLEE HARRY QBENVEGNU DOMINIC J
    • DAVID JEFFREY DRUESIN GARRETT HOLEE HARRY QBENVEGNU DOMINIC J
    • H01L21/304
    • B24B37/013H01L22/12H01L22/26
    • A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
    • 在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测,在抛光期间测量来自基底的第一光谱,在初始时间之后测量的第一光谱 开始抛光,在抛光期间测量来自衬底的第二光谱序列,在初始时间之后测量的第二光谱序列,对于第二光谱序列中的每个第二光谱,从第二光谱去除第一光谱以产生序列 修改的第三光谱,确定在第三光谱序列中的每个第三光谱的所选光谱特征的特征值,以产生该特征值的序列,以及基于以下步骤确定抛光终点或抛光速率的调整: 值序列。