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    • 6. 发明申请
    • COMPOSITE SUBSTRATES FOR DIRECT HEATING AND INCREASED TEMPERATURE UNIFORMITY
    • 用于直接加热和增加温度均匀性的复合基材
    • WO2012021321A3
    • 2012-06-28
    • PCT/US2011046116
    • 2011-08-01
    • APPLIED MATERIALS INCSU JIEOLGADO DONALD J KKUTNEY MICHAEL C
    • SU JIEOLGADO DONALD J KKUTNEY MICHAEL C
    • H01L21/205H01L21/683
    • F27B17/0025C23C16/4586C23C16/46C30B23/063C30B25/105H01L21/67115H01L21/68764H01L21/68771H01L21/68785
    • Embodiments of the present invention generally relate to apparatus and methods for uniformly heating substrates. The apparatus include a transferable puck having at least one electrode and a dielectric coating. The transferable puck can be biased with a biasing assembly relative to a substrate, and transferred independently of the biasing assembly during a fabrication process while maintaining the bias relative to the substrate. The puck absorbs radiant heat from a heat source and uniformly conducts the heat to a substrate coupled to the puck. The puck has high emissivity and high thermal conductivity for absorbing and transferring the radiant heat to the substrate. The high thermal conductivity allows for a uniform temperature profile across the substrate, thereby increasing deposition uniformity. The method includes disposing a light-absorbing material on an optically transparent substrate, and radiating the light-absorbing material with a radiant heat source to heat the optically transparent substrate.
    • 本发明的实施例一般涉及用于均匀加热衬底的装置和方法。 该装置包括具有至少一个电极和介电涂层的可转移圆盘。 可转移的圆盘可以相对于基板偏压组件偏置,并且在制造过程中独立于偏置组件传递,同时保持相对于基板的偏压。 圆盘吸收来自热源的辐射热,并将热量均匀地传导到耦合到冰球的基底。 圆盘具有高辐射率和高导热性,用于吸收并将辐射热传递到基底。 高导热性允许跨基板的均匀温度分布,从而增加沉积均匀性。 该方法包括将光吸收材料设置在光学透明基板上,并且用辐射热源辐射光吸收材料以加热光学透明基板。
    • 8. 发明申请
    • SUBSTRATE SUPPORT ASSEMBLY FOR THIN FILM DEPOSITION SYSTEMS
    • 薄膜沉积系统的基板支撑组件
    • WO2012125771A3
    • 2012-11-15
    • PCT/US2012029134
    • 2012-03-14
    • APPLIED MATERIALS INCNGUYEN TUAN ANHOLGADO DONALD J KQUACH DAVID H
    • NGUYEN TUAN ANHOLGADO DONALD J KQUACH DAVID H
    • H01L21/683C23C16/458H01L21/205
    • C30B25/12C23C16/4583
    • Substrate support assemblies and deposition chambers employing such support assemblies to improve temperature uniformity during film depositions, such as epitaxial growths of group-V material stacks for LEDs. In one embodiment, the support assembly includes a first component having a first thermal resistance and a top surface upon which the substrate is to be disposed at a first location. The support assembly further includes a second component to be disposed over the first component to cover a second location of the susceptor while the substrate is disposed over the first location and having a second thermal resistance to insulate regions of the susceptor adjacent to the substrate by an amount approximating that of the substrate during a deposition process. In embodiments, the second component is removable from the first component and supports the substrate in absence of the first component during transfer of the substrate between multiple deposition systems.
    • 使用这种支撑组件的衬底支撑组件和沉积室改善膜沉积期间的温度均匀性,例如用于LED的V族材料堆叠的外延生长。 在一个实施例中,支撑组件包括具有第一热阻的第一部件和顶部表面,基板将被放置在第一位置。 所述支撑组件还包括第二部件,所述第二部件设置在所述第一部件上方以覆盖所述基座的第二位置,同时所述基板设置在所述第一位置上并且具有第二热阻以使所述基座的与所述基板相邻的区域绝缘 在沉积过程中的量与基底的量近似。 在实施例中,第二部件可从第一部件移除并且在多个沉积系统之间的衬底传送期间不存在第一部件时支撑衬底。