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1. 发明申请

WO2010036999A2 SUBSTRATE PROCESSING CHAMBER WITH OFF-CENTER GAS DELIVERY FUNNEL 审中-公开
标题翻译：具有离心式气体输送功能的基板处理室
公开(公告)号：WO2010036999A2
公开(公告)日：2010-04-01
申请号：PCT/US2009/058557
申请日：2009-09-28
申请人： APPLIED MATERIALS, INC. , MERRY, Nir , NGUYEN, Son T.
发明人： MERRY, Nir , NGUYEN, Son T.
IPC分类号： H01L21/205 , H01L21/00
CPC分类号： C23C16/45544 , C23C16/45502 , C23C16/45563
摘要： Methods and apparatus for processing substrates are disclosed herein. The process chamber includes a chamber body, a substrate support pedestal, a pump port and a gas injection funnel. The chamber body has an inner volume and the substrate support pedestal is disposed in the inner volume of the chamber body. The pump port is coupled to the inner volume and is disposed off-center from a central axis of the substrate support pedestal. The pump port provides azimuthally non-uniform pumping proximate to a surface of the substrate support pedestal and creates localized regions of high pressure and low pressure within the inner volume during use. The gas injection funnel is disposed in a ceiling of the chamber body and opposite the substrate support pedestal. The gas injection funnel is offset from the central axis of the substrate support pedestal and is disposed in a region of low pressure.
摘要翻译：本文公开了用于处理基板的方法和设备。处理腔室包括腔室主体，基板支撑基座，泵端口和气体注入漏斗。腔室主体具有内部容积，并且基板支撑基座设置在腔室主体的内部容积中。泵端口联接到内部容积并且被设置成偏离基板支撑基座的中心轴线的中心。泵端口在靠近衬底支撑基座的表面处提供方位角不均匀的泵送并且在使用期间在内部容积内产生局部高压和低压的区域。气体注入漏斗设置在腔室主体的顶部并且与基板支撑基座相对。气体注入漏斗从衬底支撑基座的中心轴线偏移并设置在低压区域中。

2. 发明申请

WO2010120805A3 MODIFICATION OF MAGNETIC PROPERTIES OF FILMS USING ION AND NEUTRAL BEAM IMPLANTATION 审中-公开
公开(公告)号：WO2010120805A3
公开(公告)日：2010-10-21
申请号：PCT/US2010/030924
申请日：2010-04-13
申请人： APPLIED MATERIALS, INC. , FOAD, Majeed, A. , MERRY, Nir
发明人： MERRY, Nir
IPC分类号： G11B5/84 , G11B5/82 , G11B5/73
摘要： Methods and apparatus for forming substrates having magnetically patterned surfaces is provided. A magnetic layer comprising one or more materials having magnetic properties is formed on the substrate. The magnetic layer is subjected to a patterning process in which selected portions of the surface of the magnetic layer are altered such that the altered portions have different magnetic properties from the non-altered portions without changing the topography of the substrate. A protective layer and a lubricant layer are deposited over the patterned magnetic layer. The patterning is accomplished through a number of alternative processes that expose substrates to energy of varying forms.

3. 发明申请

WO2010054206A2 IMPROVED PROCESS EQUIPMENT ARCHITECTURE 审中-公开
标题翻译：改进的过程设备结构
公开(公告)号：WO2010054206A2
公开(公告)日：2010-05-14
申请号：PCT/US2009/063568
申请日：2009-11-06
申请人： APPLIED MATERIALS, INC. , NEWMAN, Jacob , KANAWADE, Dinesh , SCHWARTZ, Miriam , MERRY, Nir , HAAG, Michael Thomas
发明人： NEWMAN, Jacob , KANAWADE, Dinesh , SCHWARTZ, Miriam , MERRY, Nir , HAAG, Michael Thomas
IPC分类号： H01L21/00 , H01L21/02
CPC分类号： H01L21/6719
摘要： Embodiments of the present invention relate to improvements to single-substrate, multi-chamber processing platform architecture for minimizing fabrication facility floor space requirements. Prior art systems require significant floor space around all sides to allow for adequate installation and servicing. Embodiments of the present invention provide platforms that allow for servicing the chambers and supporting systems via a front and rear of the platform allowing multiple, side-by-side platform placement within a fabrication facility, while providing improved serviceability of the platform components.
摘要翻译：本发明的实施例涉及用于最小化制造设施地面空间要求的单基板，多室处理平台架构的改进。现有技术的系统在所有侧面周围需要大量的地面空间以允许适当的安装和维修。本发明的实施例提供了平台，其允许经由平台的前部和后部维修腔室和支撑系统，从而允许在制造设施内多个并排平台布置，同时提供平台部件的改进的可维修性。 p>

4. 发明申请

WO2010054076A2 RAPID THERMAL PROCESSING CHAMBER WITH MICRO-POSITIONING SYSTEM 审中-公开
标题翻译：具有微定位系统的快速热处理室
公开(公告)号：WO2010054076A2
公开(公告)日：2010-05-14
申请号：PCT/US2009/063394
申请日：2009-11-05
申请人： APPLIED MATERIALS, INC. , SORABJI, Khurshed , RANISH, Joseph M. , ADERHOLD, Wolfgang , HUNTER, Aaron M. , KOELMEL, Blake R. , LERNER, Alexander N. , MERRY, Nir
发明人： SORABJI, Khurshed , RANISH, Joseph M. , ADERHOLD, Wolfgang , HUNTER, Aaron M. , KOELMEL, Blake R. , LERNER, Alexander N. , MERRY, Nir
IPC分类号： H01L21/324 , H01L21/68 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67259 , C23C16/46 , H01L21/324 , H01L21/67115 , H01L21/68 , H01L21/681 , H01L21/6835 , H01L21/68742
摘要： Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
摘要翻译：描述了用于平面衬底的快速热处理的方法和设备，包括轴向对准衬底与衬底支撑件或凭借凭经验确定的位置。该方法和设备包括确定衬底和衬底支撑的相对方向的传感器系统。

5. 发明申请

WO2010123711A2 SUBSTRATE COOL DOWN CONTROL 审中-公开
标题翻译：基板冷却控制
公开(公告)号：WO2010123711A2
公开(公告)日：2010-10-28
申请号：PCT/US2010/030741
申请日：2010-04-12
申请人： APPLIED MATERIALS, INC. , NEWMAN, Jacob , KANAWADE, Dinesh , BARANDICA, Henry , MERRY, Nir
发明人： NEWMAN, Jacob , KANAWADE, Dinesh , BARANDICA, Henry , MERRY, Nir
IPC分类号： H01L21/02
CPC分类号： G01K13/00 , G01J5/0003 , G01J5/0007 , G01J5/02 , G01J5/0255 , G01K11/18 , H01L21/67103 , H01L21/67248
摘要： Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.
摘要翻译：提供了精确的基板冷却控制的方法和装置。用于测量衬底温度的装置可包括用于支撑衬底的冷却板; 传感器，当设置在所述冷却板上时，提供对应于所述基板的温度的数据; 以及耦合到所述传感器的计算机，以从所述传感器数据确定所述基板的温度。用于测量衬底的温度的方法可以包括将待冷却的衬底设置到设置有冷却板的腔室，传感器以提供对应于衬底的温度的数据和耦合到传感器的计算机; 在经过预定的第一时间间隔之后感测衬底的第一温度; 将第一温度与预定温度进行比较; 以及确定所述第一温度是否大于，等于或小于所述预定温度。

6. 发明申请

WO2008016647A3 TEMPERATURE UNIFORMITY MEASUREMENTS DURING RAPID THERMAL PROCESSING 审中-公开
公开(公告)号：WO2008016647A3
公开(公告)日：2008-02-07
申请号：PCT/US2007/017190
申请日：2007-07-31
申请人： APPLIED MATERIALS, INC. , ADERHOLD, Wolfgang , HEGEDUS, Andreas , MERRY, Nir
发明人： ADERHOLD, Wolfgang , HEGEDUS, Andreas , MERRY, Nir
IPC分类号： G01J5/00 , G01N25/00
摘要： Methods and apparatus for measuring substrate uniformity is provided. The invention includes placing a substrate in a thermal processing chamber, rotating the substrate while the substrate is heated, measuring a temperature of the substrate at a plurality of radial locations as the substrate rotates, correlating each temperature measurement with a location on the substrate, and generating a temperature contour map for the substrate based on the correlated temperature measurements. Numerous other aspects are provided.

7. 发明申请

WO2008002780A2 BATCH PROCESSING PLATFORM FOR ALD AND CVD 审中-公开
标题翻译：用于ALD和CVD的批处理平台
公开(公告)号：WO2008002780A2
公开(公告)日：2008-01-03
申请号：PCT/US2007/071368
申请日：2007-06-15
申请人： APPLIED MATERIALS, INC. , WEBB, Aaron , BRAILOVE, Adam , YUDOVSKY, Joseph , MERRY, Nir , CONSTANT, Andrew , QUILES, Efrain , RICE, Michael, R. , ROSEN, Gary, J. , SHAH, Vinay
发明人： WEBB, Aaron , BRAILOVE, Adam , YUDOVSKY, Joseph , MERRY, Nir , CONSTANT, Andrew , QUILES, Efrain , RICE, Michael, R. , ROSEN, Gary, J. , SHAH, Vinay
IPC分类号： C23C16/00
CPC分类号： C23C16/54 , C23C16/4583 , H01L21/67173 , H01L21/67742 , H01L21/67757 , H01L21/67769 , Y10S414/14
摘要： A batch processing platform used for ALD or CVD processing is configured for high throughput and minimal footprint. In one embodiment, the processing platform comprises an atmospheric transfer region, at least one batch processing chamber with a buffer chamber and staging platform, and a transfer robot disposed in the transfer region wherein the transfer robot has at least one substrate transfer arm that comprises multiple substrate handling blades. The platform may include two batch processing chambers configured with a service aisle disposed therebetween to provide necessary service access to the transfer robot and the deposition stations. In another embodiment, the processing platform comprises at least one batch processing chamber, a substrate transfer robot that is adapted to transfer substrates between a FOUP and a processing cassette, and a cassette transfer region containing a cassette handler robot. The cassette handler robot may be a linear actuator or a rotary table.
摘要翻译：用于ALD或CVD处理的批处理平台被配置为高吞吐量和最小占用空间。在一个实施例中，处理平台包括大气转移区域，至少一个具有缓冲腔室和分级平台的批处理腔室，以及设置在转移区域中的传送机器人，其中传送机器人具有至少一个基板传送臂，基板处理刀片。该平台可以包括两个批处理腔室，该两个批处理腔室配置有布置在其间的服务通道以向传送机器人和沉积站提供必要的服务访问。在另一个实施例中，处理平台包括至少一个批处理腔室，适于在FOUP和处理盒之间传送基板的基板传送机器人，以及包含盒处理器机器人的盒传送区域。盒式搬运机器人可以是线性执行器或旋转工作台。

8. 发明申请

WO2007027458A3 BATCH DEPOSITION TOOL AND COMPRESSED BOAT 审中-公开
公开(公告)号：WO2007027458A3
公开(公告)日：2007-03-08
申请号：PCT/US2006/032413
申请日：2006-08-17
申请人： APPLIED MATERIALS, INC. , YUDOVSKY, Joseph , COOK, Robert C. , MERRY, Nir
发明人： YUDOVSKY, Joseph , COOK, Robert C. , MERRY, Nir
IPC分类号： C23F1/00
摘要： Aspects of the invention include methods and apparatus for processing a batch of substrates. In one embodiment, a compressed substrate boat is configured to reduce pumping volume in a batch processing chamber. The compressed substrate boat comprises a stationary substrate boat and a movable substrate boat, each may be loaded/unloaded independently. The movable substrate boat and the stationary substrate boat may be interleaving with one another such that the distance between the substrates is reduced. In another embodiment, a substrate boat having removable substrate holder is configured to provide susceptors without dramatically increasing pumping volume. The removable substrate holder may be loaded/unloaded away from the substrate boat with susceptors. The removable substrate holder is engaged with the substrate boat such that substrates thereon are interleaving with the susceptors. Embodiments of the present invention reduces pumping volume and increases throughput, hence reduces cost of ownership during batch processing.

9. 发明申请

WO2006055984A2 SUBSTRATE PROCESSING APPARATUS USING A BATCH PROCESSING CHAMBER 审中-公开
标题翻译：使用批处理室的基板处理装置
公开(公告)号：WO2006055984A2
公开(公告)日：2006-05-26
申请号：PCT/US2005/042762
申请日：2005-11-22
申请人： APPLIED MATERIALS, INC. , THAKUR, Randhir, P.s. , GHANAYEM, Steve, G. , YUDOVSKY, Joseph , WEBB, Aaron , BRAILOVE, Adam, A. , MERRY, Nir , SHAH, Vinay, K. , HEGEDUS, Andreas, G.
发明人： THAKUR, Randhir, P.s. , GHANAYEM, Steve, G. , YUDOVSKY, Joseph , WEBB, Aaron , BRAILOVE, Adam, A. , MERRY, Nir , SHAH, Vinay, K. , HEGEDUS, Andreas, G.
IPC分类号： C12M3/00
CPC分类号： H01L21/67109 , C23C16/4412 , C23C16/45546 , C23C16/45593 , C23C16/4584 , C23C16/481 , C23C16/54 , H01L21/67017 , H01L21/67115 , H01L21/67167 , H01L21/6719 , H01L21/67207 , H01L21/67745 , H01L21/67757 , H01L21/67781
摘要： Aspects of the invention include a method and apparatus for processing a substrate using a multi-chamber processing system ( e.g., a cluster tool) adapted to process substrates in one or more batch and/or single substrate processing chambers to increase the system throughput. In one embodiment, a system is configured to perform a substrate processing sequence that contains batch processing chambers only, or batch and single substrate processing chambers, to optimize throughput and minimize processing defects. In one embodiment, a batch processing chamber is used to increase the system throughput by performing a process recipe step that is disproportionately long compared to other process recipe steps in the substrate processing sequence. Aspects of the invention also include an apparatus and method for delivering a precursor to a processing chamber so that a repeatable ALD or CVD deposition process can be performed.
摘要翻译：本发明的方面包括使用适于在一个或多个批次和/或单个基板处理室中处理基板以增加系统吞吐量的多室处理系统（例如，集群工具）来处理基板的方法和装置。在一个实施例中，系统被配置为执行仅包含批处理室的衬底处理序列，或批处理和单个衬底处理室，以优化生产量并最小化处理缺陷。在一个实施例中，批处理室用于通过执行与衬底处理序列中的其它工艺配方步骤相比长度不成比例的工艺配方步骤来增加系统通过量。本发明的方面还包括用于将前体输送到处理室的装置和方法，使得可以执行可重复的ALD或CVD沉积工艺。

10. 发明申请

WO2013012675A2 METHODS AND APPARATUS FOR PROCESSING SUBSTRATES USING MODEL-BASED CONTROL 审中-公开
标题翻译：使用基于模型的控制处理基板的方法和设备
公开(公告)号：WO2013012675A2
公开(公告)日：2013-01-24
申请号：PCT/US2012/046452
申请日：2012-07-12
申请人： APPLIED MATERIALS, INC. , PORTHOUSE, Keith, Brian , LANE, John, W. , GREGOR, Mariusch , MERRY, Nir , RICE, Michael, R. , MINKOVICH, Alex , LI, Hongbin , DZILNO, Dmitry, A.
发明人： PORTHOUSE, Keith, Brian , LANE, John, W. , GREGOR, Mariusch , MERRY, Nir , RICE, Michael, R. , MINKOVICH, Alex , LI, Hongbin , DZILNO, Dmitry, A.
IPC分类号： H01L21/205 , H01L21/3065 , H01L21/02
CPC分类号： G05D16/2046 , G05B17/02 , H01L21/67017 , H01L21/67253
摘要： Methods and apparatus are disclosed herein. In some embodiments, methods of controlling process chambers may include predetermining a relationship between pressure in a processing volume and a position of an exhaust valve as a function of a process parameter; setting the process chamber to a first state having a first pressure in the processing volume and a first value of the process parameter, wherein the exhaust valve is set to a first position based on the predetermined relationship to produce the first pressure at the first value; determining a pressure control profile to control the pressure as the process chamber is changed to a second state having a second pressure and a second process parameter value from the first state; and applying the pressure control profile to control the pressure by varying the position of the exhaust valve while changing the process chamber to the second state.
摘要翻译：这里公开了方法和装置。在一些实施例中，控制处理室的方法可以包括根据处理参数预先确定处理容积中的压力与排气阀的位置之间的关系; 将所述处理室设定为第一状态，所述第一状态具有所述处理容积中的第一压力和所述处理参数的第一值，其中基于所述预定关系将所述排气阀设定到第一位置以在所述第一值处产生所述第一压力; 当所述处理室从所述第一状态变为具有第二压力和第二处理参数值的第二状态时，确定压力控制分布以控制所述压力; 并且通过在将处理室改变到第二状态的同时改变排气阀的位置来施加压力控制曲线以控制压力。

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