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    • 8. 发明申请
    • WAFER EDGE MEASUREMENT AND CONTROL
    • WAFER边缘测量和控制
    • WO2013162842A1
    • 2013-10-31
    • PCT/US2013/035168
    • 2013-04-03
    • APPLIED MATERIALS, INC.KOELMEL, Blake
    • KOELMEL, Blake
    • H01L21/68H01L21/683
    • H01L21/681H01L21/67259
    • Devices and methods are provided for positioning and/or rotating a substrate without solid contact, such as by floating the wafer on a thin layer of gas. Since there is no solid contact with components of a processing chamber, features on the wafer are used to determine wafer position and rotational speed. Closed loop control systems are provided with capacitive sensors to monitor the position of the edge of the wafer in a horizontal plane. Control systems may also monitor the position of a wafer feature as it rotates, such as a notch in the edge of the wafer. Because the presence of a notch can disrupt sensors facing the edge of the wafer, methods and devices to reduce or eliminate this disruption are also provided.
    • 提供了用于定位和/或旋转衬底而没有固体接触的装置和方法,例如通过将晶片浮在薄层气体上。 由于与处理室的部件没有固体接触,所以使用晶片上的特征来确定晶片位置和转速。 闭环控制系统设置有电容传感器,以在水平面内监测晶片边缘的位置。 控制系统还可以监视晶片特征在其旋转时的位置,例如晶片边缘中的凹口。 由于存在凹口可能会破坏面向晶片边缘的传感器,因此还提供了减少或消除此破坏的方法和设备。