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1. 发明申请

WO2009155117A2 METHOD AND APPARATUS FOR DETECTING THE SUBSTRATE TEMPERATURE IN A LASER ANNEAL SYSTEM 审中-公开
标题翻译：用于检测激光神经系统中底物温度的方法和装置
公开(公告)号：WO2009155117A2
公开(公告)日：2009-12-23
申请号：PCT/US2009/045699
申请日：2009-05-29
申请人： APPLIED MATERIALS, INC. , KOELMEL, Blake , MAYUR, Abhilash, J.
发明人： KOELMEL, Blake , MAYUR, Abhilash, J.
IPC分类号： H01L21/66 , H01L21/324
CPC分类号： H01L21/67248 , G01J5/048 , H01L21/67253 , H01L21/68742
摘要： Embodiments of the invention provide a method and an apparatus for detecting the temperature of a substrate surface. In one embodiment, a method for measuring the temperature is provided which includes exposing the surface of the substrate to a laser beam radiating from a laser source, radiating emitted light from a portion of the surface of the substrate, through the shadow ring, and towards a thermal sensor, and determining the temperature of the portion of the surface of the substrate from the emitted light. The substrate may be disposed on a substrate support within a treatment region and a shadow ring may be disposed between the laser source and the surface of the substrate. The shadow ring may be selectively opaque to the laser beam and transparent to the emitted light.
摘要翻译：本发明的实施例提供了一种用于检测衬底表面的温度的方法和装置。在一个实施例中，提供了一种用于测量温度的方法，其包括将衬底的表面暴露于从激光源辐射的激光束，从衬底表面的一部分通过阴影环辐射发射的光，并朝向热传感器，并且从所发射的光确定衬底的表面部分的温度。衬底可以设置在处理区域内的衬底支撑件上，并且阴影环可以设置在激光源和衬底的表面之间。阴影环可以选择性地对激光束不透明并且对于发射的光是透明的。

2. 发明申请

WO2009102600A1 MILLISECOND ANNEALING (DSA) EDGE PROTECTION 审中-公开
标题翻译： MILLISECOND ANNEALING（DSA）边缘保护
公开(公告)号：WO2009102600A1
公开(公告)日：2009-08-20
申请号：PCT/US2009/033102
申请日：2009-02-04
申请人： APPLIED MATERIALS, INC. , KOELMEL, Blake , MCINTOSH, Robert C. , LARMAGNAC, David D. L. , LERNER, Alexander N. , MAYUR, Abhilash J. , YUDOVSKY, Joseph
发明人： KOELMEL, Blake , MCINTOSH, Robert C. , LARMAGNAC, David D. L. , LERNER, Alexander N. , MAYUR, Abhilash J. , YUDOVSKY, Joseph
IPC分类号： H01L21/00 , H01L21/02 , H01L21/324
CPC分类号： H01L21/67115 , H01L21/268 , H01L21/68735 , H01L21/68742
摘要： A method and apparatus for thermally processing a substrate is provided. A substrate is disposed within a processing chamber configured for thermal processing by directing electromagnetic energy toward a surface of the substrate. An energy blocker is provided to block at least a portion of the energy directed toward the substrate. The blocker prevents damage to the substrate from thermal stresses as the incident energy approaches an edge of the substrate.
摘要翻译：提供了一种用于热处理衬底的方法和装置。衬底被布置在处理室内，其被配置用于通过将电磁能量引导到衬底的表面来进行热处理。提供能量阻挡器以阻挡朝向衬底的能量的至少一部分。当入射能量接近衬底的边缘时，阻挡剂防止由于热应力而损坏衬底。

3. 发明申请

WO2012115682A1 EDGE RING FOR A THERMAL PROCESSING CHAMBER 审中-公开
标题翻译： EDGE环热处理室
公开(公告)号：WO2012115682A1
公开(公告)日：2012-08-30
申请号：PCT/US2011/046008
申请日：2011-07-29
申请人： APPLIED MATERIALS, INC. , KOELMEL, Blake , RANISH, Joseph M. , MAYUR, Abhilash J.
发明人： KOELMEL, Blake , RANISH, Joseph M. , MAYUR, Abhilash J.
IPC分类号： H01L21/683 , H01L21/324 , H01L21/02
CPC分类号： H01L21/67346 , F27D5/0037 , F27D11/12 , F27D2005/0081 , H01L21/67115 , H01L21/68735
摘要： Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more surface area increasing structures formed on an energy receiving surface of the edge ring.
摘要翻译：本发明的实施例提供了用于支撑具有提高的温度均匀性的衬底的边缘环。更具体地说，本发明的实施例提供了一种边缘环，其具有形成在边缘环的能量接收表面上的一个或多个表面积增加结构。

4. 发明申请

WO2009089248A2 APPARATUS AND METHOD OF ALIGNING AND POSITIONING A COLD SUBSTRATE ON A HOT SURFACE 审中-公开
标题翻译：在热表面上排列和定位冷衬底的装置和方法
公开(公告)号：WO2009089248A2
公开(公告)日：2009-07-16
申请号：PCT/US2009/030275
申请日：2009-01-07
申请人： APPLIED MATERIALS, INC. , KOELMEL, Blake , MAYUR, Abhilash, J. , MA, Kai , LERNER, Alexander N.
发明人： KOELMEL, Blake , MAYUR, Abhilash, J. , MA, Kai , LERNER, Alexander N.
IPC分类号： H01L21/68 , H01L21/32 , H01L21/20 , H01L21/30
CPC分类号： H01L21/67248 , C23C16/4586 , H01L21/68742
摘要： Embodiments of the invention contemplate a method, apparatus and system that are used to support and position a substrate on a surface that is at a different temperature than the initial, or incoming, substrate temperature. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein generally may also provide an inexpensive and simple way of accurately positioning a substrate on a substrate support that is positioned in a semiconductor processing chamber. Substrate processing chambers that can benefit from the various embodiments described herein include, but are not limited to RTP, CVD, PVD, ALD, plasma etching, and/or laser annealing chambers.
摘要翻译：本发明的实施例设想用于支撑和定位基底的方法，设备和系统，该基底处于与初始或进入的基底温度不同的温度的表面上。本发明的实施例还可以包括一种控制位于处理室中的衬底和衬底支撑件之间的热传递的方法。这里描述的设备和方法通常还可以提供将衬底精确定位在位于半导体处理室中的衬底支撑件上的便宜和简单的方式。可受益于本文所述的各种实施例的衬底处理室包括但不限于RTP，CVD，PVD，ALD，等离子体蚀刻和/或激光退火室。

5. 发明申请

WO2012115907A2 EDGE RING FOR A THERMAL PROCESSING CHAMBER 审中-公开
标题翻译：用于热处理室的边缘环
公开(公告)号：WO2012115907A2
公开(公告)日：2012-08-30
申请号：PCT/US2012/025818
申请日：2012-02-20
申请人： APPLIED MATERIALS, INC. , KOELMEL, Blake , RANISH, Joseph M. , MAYUR, Abhilash J.
发明人： KOELMEL, Blake , RANISH, Joseph M. , MAYUR, Abhilash J.
CPC分类号： H01L21/67346 , F27D5/0037 , F27D11/12 , F27D2005/0081 , H01L21/67115 , H01L21/68735
摘要： Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more surface area increasing structures formed on an energy receiving surface of the edge ring.
摘要翻译：本发明的实施例提供了一种用于支撑具有增加的温度均匀性的基板的边缘环。更具体地，本发明的实施例提供一种边缘环，其具有形成在边缘环的能量接收表面上的一个或多个表面积增加结构。

6. 发明申请

WO2013162842A1 WAFER EDGE MEASUREMENT AND CONTROL 审中-公开
标题翻译： WAFER边缘测量和控制
公开(公告)号：WO2013162842A1
公开(公告)日：2013-10-31
申请号：PCT/US2013/035168
申请日：2013-04-03
申请人： APPLIED MATERIALS, INC. , KOELMEL, Blake
发明人： KOELMEL, Blake
IPC分类号： H01L21/68 , H01L21/683
CPC分类号： H01L21/681 , H01L21/67259
摘要： Devices and methods are provided for positioning and/or rotating a substrate without solid contact, such as by floating the wafer on a thin layer of gas. Since there is no solid contact with components of a processing chamber, features on the wafer are used to determine wafer position and rotational speed. Closed loop control systems are provided with capacitive sensors to monitor the position of the edge of the wafer in a horizontal plane. Control systems may also monitor the position of a wafer feature as it rotates, such as a notch in the edge of the wafer. Because the presence of a notch can disrupt sensors facing the edge of the wafer, methods and devices to reduce or eliminate this disruption are also provided.
摘要翻译：提供了用于定位和/或旋转衬底而没有固体接触的装置和方法，例如通过将晶片浮在薄层气体上。由于与处理室的部件没有固体接触，所以使用晶片上的特征来确定晶片位置和转速。闭环控制系统设置有电容传感器，以在水平面内监测晶片边缘的位置。控制系统还可以监视晶片特征在其旋转时的位置，例如晶片边缘中的凹口。由于存在凹口可能会破坏面向晶片边缘的传感器，因此还提供了减少或消除此破坏的方法和设备。

7. 发明申请

WO2009094275A3 APPARATUS AND METHOD FOR SUPPORTING, POSITIONING AND ROTATING A SUBSTRATE IN A PROCESSING CHAMBER 审中-公开
公开(公告)号：WO2009094275A3
公开(公告)日：2009-07-30
申请号：PCT/US2009/030996
申请日：2009-01-14
申请人： APPLIED MATERIALS, INC. , KOELMEL, Blake , LERNER, Alexander, N. , RANISH, Joseph, M. , SANGAM, Kedarnath , SORABJI, Khurshed
发明人： KOELMEL, Blake , LERNER, Alexander, N. , RANISH, Joseph, M. , SANGAM, Kedarnath , SORABJI, Khurshed
IPC分类号： H01L21/683 , H01L21/687 , H01L21/205 , H01L21/324
摘要： Embodiments of the invention contemplate a method, apparatus and system that are used to support, position, and rotate a substrate during processing. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein remove the need for complex, costly and often unreliable components that would be required to accurately position and rotate a substrate during one or more processing steps, such as an rapid thermal processing (RTP) process, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, atomic layer deposition (ALD) process, dry etching process, wet clean, and/or laser annealing process.

8. 发明申请

WO2013119975A1 SPIKE ANNEAL RESIDENCE TIME REDUCTION IN RAPID THERMAL PROCESSING CHAMBERS 审中-公开
标题翻译：快速热处理炉中SPIKE ANNEAL RESIDENCE TIME减少
公开(公告)号：WO2013119975A1
公开(公告)日：2013-08-15
申请号：PCT/US2013/025377
申请日：2013-02-08
申请人： APPLIED MATERIALS, INC. , LI, Jiping , KOELMEL, Blake , HUNTER, Aaron Muir , ADERHOLD, Wolfgang R.
发明人： LI, Jiping , KOELMEL, Blake , HUNTER, Aaron Muir , ADERHOLD, Wolfgang R.
IPC分类号： H01L21/205 , H01L21/324
CPC分类号： H01L21/67109 , F27B17/0025 , H01L21/67115
摘要： The present invention generally relates to methods of cooling a substrate during rapid thermal processing. The methods generally include positioning a substrate in a chamber and applying heat to the substrate. After the temperature of the substrate is increased to a desired temperature, the substrate is rapidly cooled. Rapid cooling of the substrate is facilitated by increasing a flow rate of a gas through the chamber. Rapid cooling of the substrate is further facilitated by positioning the substrate in close proximity to a cooling plate. The cooling plate removes heat from substrate via conduction facilitated by gas located therebetween. The distance between the cooling plate and the substrate can be adjusted to create a turbulent gas flow therebetween, which further facilitates removal of heat from the substrate. After the substrate is sufficiently cooled, the substrate is removed from the chamber.
摘要翻译：本发明一般涉及在快速热处理期间冷却衬底的方法。所述方法通常包括将衬底定位在腔室中并将热量施加到衬底上。在将基板的温度升高到所需温度之后，快速冷却基板。通过增加通过室的气体的流速来促进衬底的快速冷却。通过将衬底定位在靠近冷却板的方式进一步促进衬底的快速冷却。冷却板通过由位于其间的气体促进的传导从衬底去除热量。可以调节冷却板和基板之间的距离以在它们之间产生湍流气流，这进一步有助于从基板去除热量。在衬底充分冷却之后，将衬底从腔室中取出。

9. 发明申请

WO2012166322A1 APPARATUS AND METHODS FOR SUPPORTING AND CONTROLLING A SUBSTRATE 审中-公开
标题翻译：用于支撑和控制基板的装置和方法
公开(公告)号：WO2012166322A1
公开(公告)日：2012-12-06
申请号：PCT/US2012/037473
申请日：2012-05-11
申请人： APPLIED MATERIALS, INC. , KOELMEL, Blake , RANISH, Joseph M.
发明人： KOELMEL, Blake , RANISH, Joseph M.
IPC分类号： H01L21/683 , H01L21/205
CPC分类号： H01L21/67109 , H01L21/6838
摘要： Embodiments of the present invention provide apparatus and methods for supporting and controlling a substrate during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus includes a chamber body defining an inner volume, a substrate support disposed in the inner volume, and an auxiliary force assembly configured to apply an auxiliary force to the substrate. Another embodiment provides a gas delivery assembly configured to adjust a thermal mass of a fluid flow delivered to position, control and/or rotate a substrate.
摘要翻译：本发明的实施例提供了用于在热处理期间支撑和控制基板的装置和方法。本发明的一个实施例提供一种用于处理衬底的装置。该装置包括限定内部容积的室主体，设置在内部容积中的基板支撑件以及被配置成向基板施加辅助力的辅助力组件。另一个实施例提供一种气体输送组件，其构造成调节输送到位置的流体流的热质量，控制和/或旋转基底。

10. 发明申请

WO2008141105A1 AN APPARATUS AND METHOD FOR SUPPORTING, POSITIONING AND ROTATING A SUBSTRATE IN A PROCESSING CHAMBER 审中-公开
标题翻译：用于支撑，定位和旋转加工室中的基板的装置和方法
公开(公告)号：WO2008141105A1
公开(公告)日：2008-11-20
申请号：PCT/US2008/063105
申请日：2008-05-08
申请人： APPLIED MATERIALS, INC. , KOELMEL, Blake , LERNER, Alexander N. , RANISH, Joseph M. , SANGAM, Kedarnath , SORABJI, Khurshed
发明人： KOELMEL, Blake , LERNER, Alexander N. , RANISH, Joseph M. , SANGAM, Kedarnath , SORABJI, Khurshed
IPC分类号： B05C13/00
CPC分类号： H01L21/6838 , H01L21/67115
摘要： An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.
摘要翻译：提供了用于支撑，定位和旋转衬底的装置和方法。在一个实施例中，用于支撑衬底的支撑组件包括上基板和下基板。衬底浮在上层底板上的薄层空气上。定位组件包括多个空气轴承边缘辊或气流袋，其用于将衬底定位在上部基板的上方所期望的取向。多个倾斜的孔或气流袋被配置在上基板中，用于使气体流过其中以旋转基板以确保在加工期间的均匀加热。

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