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1. 发明申请

WO2009045217A1 PARASITIC PARTICLE SUPPRESSION IN THE GROWTH OF III-V NITRIDE FILMS USING MOCVD AND HVPE 审中-公开
标题翻译：使用MOCVD和HVPE在III-V硝酸盐膜生长过程中的PARASITIC颗粒抑制
公开(公告)号：WO2009045217A1
公开(公告)日：2009-04-09
申请号：PCT/US2007/080460
申请日：2007-10-04
申请人： APPLIED MATERIALS, INC. , BOUR, David , SMITH, Jacob , NIJHAWAN, Sandeep , WASHINGTON, Lori , EAGLESHAM, David
发明人： BOUR, David , SMITH, Jacob , NIJHAWAN, Sandeep , WASHINGTON, Lori , EAGLESHAM, David
IPC分类号： H01L21/302 , H01L21/306 , H01L21/461
CPC分类号： H01L21/0262 , C23C16/301 , C23C16/4401 , C30B25/02 , C30B29/403 , H01L21/02378 , H01L21/02381 , H01L21/02403 , H01L21/0242 , H01L21/02458 , H01L21/0254
摘要： A method of suppressing parasitic particle formation in a metal organic chemical vapor deposition process is described. The method may include providing a substrate to a reaction chamber, and introducing an organometallic precursor, a particle suppression compound and at least a second precursor to the reaction chamber. The second precursor reacts with the organometallic precursor to form a nucleation layer on the substrate. Also, a method of suppressing parasitic particle formation during formation of a III-V nitride layer is described. The method includes introducing a group III metal containing precursor to a reaction chamber. The group III metal precursor may include a halogen. A hydrogen halide gas and a nitrogen containing gas are also introduced to the reaction chamber. The nitrogen containing gas reacts with the group III metal precursor to form the III-V nitride layer on the substrate.
摘要翻译：描述了抑制金属有机化学气相沉积工艺中的寄生颗粒形成的方法。该方法可以包括向反应室提供底物，并将有机金属前体，颗粒抑制化合物和至少第二前体引入反应室。第二前驱体与有机金属前驱体反应以在基底上形成成核层。另外，描述了在形成III-V族氮化物层期间抑制寄生粒子形成的方法。该方法包括将含III族金属的前体引入反应室。 III族金属前体可以包括卤素。卤化氢气体和含氮气体也被引入反应室。含氮气体与III族金属前体反应以在衬底上形成III-V族氮化物层。

2. 发明申请

WO2007121270A1 EPITAXIAL GROWTH OF III-NITRIDE COMPOUND SEMICONDUCTORS STRUCTURES 审中-公开
标题翻译： III-NITRIDE化合物半导体结构的外延生长
公开(公告)号：WO2007121270A1
公开(公告)日：2007-10-25
申请号：PCT/US2007/066468
申请日：2007-04-11
申请人： APPLIED MATERIALS, INC. , NIJHAWAN, Sandeep , BOUR, David , WASHINGTON, Lori , SMITH, Jacob , STEVENS, Ronald , EAGLESHAM, David
发明人： NIJHAWAN, Sandeep , BOUR, David , WASHINGTON, Lori , SMITH, Jacob , STEVENS, Ronald , EAGLESHAM, David
IPC分类号： H01L21/00 , H01L33/00 , C30B25/02 , C30B29/40 , C30B35/00 , C23C16/30 , C23C16/54
CPC分类号： C30B25/14 , C30B29/403 , C30B35/00 , H01L21/0242 , H01L21/02458 , H01L21/0254 , H01L21/0262 , H01L21/67155
摘要： Apparatus and methods are described for fabricating a compound nitride semiconductor structure. Group-III and nitrogen precursors are flowed into a first processing chamber to deposit a first layer over a substrate with a thermal chemical-vapor-deposition process. The substrate is transferred from the first processing chamber to a second processing chamber. Group-III and nitrogen precursors are flowed into the second processing chamber to deposit a second layer over the first layer with a thermal chemical-vapor-deposition process. The first and second group-III precursors have different group-III elements.
摘要翻译：描述了用于制造复合氮化物半导体结构的装置和方法。 III族和氮气前体流入第一处理室，以通过热化学气相沉积工艺在衬底上沉积第一层。衬底从第一处理室转移到第二处理室。 III族和氮气前体流入第二处理室以通过热化学气相沉积工艺在第一层上沉积第二层。第一和第二组III前体具有不同的III族元素。

3. 发明申请

WO2009032021A2 ELECTROPLATING ON ROLL-TO-ROLL FLEXIBLE SOLAR CELL SUBSTRATES 审中-公开
标题翻译：在滚动到滚动的柔性太阳能电池基板上进行电镀
公开(公告)号：WO2009032021A2
公开(公告)日：2009-03-12
申请号：PCT/US2007/085959
申请日：2007-11-29
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , EAGLESHAM, David , GAY, Charles
发明人： LOPATIN, Sergey , EAGLESHAM, David , GAY, Charles
IPC分类号： C23C14/00 , H01L31/042
CPC分类号： C25D5/022 , C25D5/18 , C25D7/08 , C25D17/00 , C25D17/001 , H01L31/022425 , H01L31/02245 , H01L31/022466 , H01L31/03926 , H01L31/0465 , H01L31/0508 , H01L31/0512 , H01L31/0516 , H01L31/188 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. Solar cell substrates that may benefit from the invention include flexible substrates may have an active region that contains organic material, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, germanium, and gallium arsenide, cadmium telluride, cadmium sulfide, copper indium gallium selenide, copper indium selenide, gallilium indium phosphide, as well as heterojunction cells that are used to convert sunlight to electrical power. The flexible substrates may have a flexible base that is adapted to support the active region of the solar cell device.
摘要翻译：本发明的实施例考虑使用新颖的电镀方法和装置形成金属接触结构来形成低成本的柔性太阳能电池。本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。可以受益于本发明的太阳能电池基板包括柔性基板可以具有含有有机材料，单晶硅，多晶硅，多晶硅，锗和砷化镓，碲化镉，硫化镉，铜铟镓硒的有源区，硒化铜铟锡，磷化铟镓，以及用于将阳光转换成电力的异质结电池。柔性基板可以具有适于支撑太阳能电池装置的有源区域的柔性基座。

4. 发明申请

WO2008070568A2 APPARATUS AND METHOD FOR ELECTROPLATING ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：用于在太阳能电池基板上电镀的装置和方法
公开(公告)号：WO2008070568A2
公开(公告)日：2008-06-12
申请号：PCT/US2007/086145
申请日：2007-11-30
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , KOVARSKY, Nicolay Y. , EAGLESHAM, David , DUKOVIC, John O. , GAY, Charles
发明人： LOPATIN, Sergey , KOVARSKY, Nicolay Y. , EAGLESHAM, David , DUKOVIC, John O. , GAY, Charles
IPC分类号： C25D5/10 , C25D5/12 , H01L31/00
CPC分类号： H01L31/022425 , C23C28/021 , C23C28/023 , C23C28/025 , C23C28/028 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/34 , C23C28/36 , C25D5/022 , C25D5/08 , C25D5/50 , C25D17/00 , C25D17/001 , C25D17/02 , C25D17/06 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新颖的方法和设备形成使用电化学电镀工艺形成具有选择性形成的金属线的金属接触结构的低成本太阳能电池。本文描述的设备和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。在太阳能电池器件中形成的互连的电阻极大地影响了太阳能电池的效率。因此期望形成具有可靠且成本有效的低电阻连接的太阳能电池装置。因此，这里描述的本发明的一个或多个实施例适于使用包含诸如铜的常见金属的电化学电镀工艺形成低成本且可靠的互连层。

5. 发明申请

WO2008070528A2 PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：精密印刷通过太阳能电池基板上的电镀掩模进行电镀
公开(公告)号：WO2008070528A2
公开(公告)日：2008-06-12
申请号：PCT/US2007/085963
申请日：2007-11-29
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , DUKOVIC, John O. , EAGLESHAM, David , KOVARSKY, Nicolay Y. , BACHRACH, Robert , BUSCH, John , GAY, Charles
发明人： LOPATIN, Sergey , DUKOVIC, John O. , EAGLESHAM, David , KOVARSKY, Nicolay Y. , BACHRACH, Robert , BUSCH, John , GAY, Charles
IPC分类号： B05C13/02 , H01L21/469
CPC分类号： H01L31/022425 , H01L31/02008 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.
摘要翻译：本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。本文描述的装置和方法不需要执行经常昂贵的处理步骤来执行掩模准备和形成步骤，例如丝网印刷，光刻步骤和喷墨印刷步骤，以形成接触结构。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。本发明的实施例可以提供一种形成在一个或多个电化学沉积步骤期间利用可重复使用的掩模装置的太阳能电池装置的装置和方法。

6. 发明申请

WO2008070290A1 PULSE PLATING OF A LOW STRESS FILM ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：在太阳能电池基板上的低应力膜的脉冲电镀
公开(公告)号：WO2008070290A1
公开(公告)日：2008-06-12
申请号：PCT/US2007/081530
申请日：2007-10-16
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , GAY, Charles , EAGLESHAM, David , DUKOVIC, John O. , KOVARSKY, Nicolay Y.
发明人： LOPATIN, Sergey , GAY, Charles , EAGLESHAM, David , DUKOVIC, John O. , KOVARSKY, Nicolay Y.
IPC分类号： H01L31/00
CPC分类号： H01L31/022425 , H01L31/02245 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell metal contact structure that has improved electrical and mechanical properties through the use of an electrochemical plating process. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connections that is reliable and cost effective. One or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing common metal, such as copper. However, generally the electroplated portions of the interconnecting layer may contain a substantially pure metal or a metal alloy layer. Methods are discussed herein that are used to form a solar cell containing conductive metal interconnect layer(s) that have a low intrinsic stress.
摘要翻译：本发明的实施例考虑到通过使用电化学电镀工艺形成具有改善的电气和机械性能的低成本太阳能电池金属接触结构。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。使用本文所述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。然而，通常互连层的电镀部分可以包含基本上纯的金属或金属合金层。本文讨论了用于形成含有具有低固有应力的导电金属互连层的太阳能电池的方法。

7. 发明申请

WO2007044555A2 SYSTEM AND METHOD FOR MAKING AN IMPROVED THIN FILM SOLAR CELL INTERCONNECT 审中-公开
标题翻译：用于制造改进的薄膜太阳能电池互连的系统和方法
公开(公告)号：WO2007044555A2
公开(公告)日：2007-04-19
申请号：PCT/US2006/039212
申请日：2006-10-06
申请人： APPLIED MATERIALS, INC. , BORDEN, Peter, G. , EAGLESHAM, David
发明人： BORDEN, Peter, G. , EAGLESHAM, David
IPC分类号： H02N6/00 , H01L31/00
CPC分类号： H01L31/046 , H01L31/0465 , Y02E10/50
摘要： In a module of photovoltaic cells, a method of forming the module interconnects includes a single cutting process after the deposition of all active layers. This simplifies the overall process to a set of vacuum steps followed by a set of interconnect steps, and may significantly module quality and yield. According to another aspect, an interconnect forming method includes self-aligned deposition of an insulator. This simplifies the process because no alignment is required. According to another aspect, an interconnect forming method includes a scribing process that results in a much narrower interconnect which may significantly boost cell efficiency, and allow for narrower cell sizes. According to another aspect, an interconnect includes an insulator layer that greatly reduces shunt current through the active layer, which can greatly improve cell efficiency.
摘要翻译：在光伏电池的模块中，形成模块互连的方法包括在沉积所有有源层之后的单个切割工艺。这将整个过程简化为一组真空步骤，随后是一组互连步骤，并且可以显着地模块质量和产量。根据另一方面，互连形成方法包括绝缘体的自对准沉积。这样就简化了过程，因为不需要对齐。根据另一方面，互连形成方法包括划线过程，其导致更窄的互连，其可以显着提高电池效率，并且允许更窄的电池尺寸。根据另一方面，互连包括绝缘体层，其大大减少了通过有源层的分流电流，这可以大大提高电池效率。

8. 发明申请

WO2008014248A2 THIN FILM PHOTOVOLTAIC MODULE WIRING FOR IMPROVED EFFICIENCY 审中-公开
标题翻译：薄膜太阳能电池组件提升效率
公开(公告)号：WO2008014248A2
公开(公告)日：2008-01-31
申请号：PCT/US2007/074199
申请日：2007-07-24
申请人： APPLIED MATERIALS, INC. , BORDEN, Peter, G. , EAGLESHAM, David
发明人： BORDEN, Peter, G. , EAGLESHAM, David
IPC分类号： H01L31/00
CPC分类号： H01L31/0465 , Y02E10/50
摘要： The present invention relates to configuring and wiring together cells in TF PV modules. According to one aspect, cells are fabricated on one plane on a top surface of a substrate, with wiring patterned on a parallel plane, and vias formed to provide connections between the cell plane and wiring plane. In one embodiment, the wiring plane is on the back surface of the substrate and vias are formed through the substrate. In another embodiment, the wiring plane is on the top surface of the substrate underneath the cell plane and an insulating layer, with the vias formed through the insulating layer. In another embodiment, the cell plane formed on the top surface includes superstrate cells that are illuminated through a transparent substrate, with an insulator between the cell plane and an upper wiring plane. According to another aspect, the heavy bus bar connections in the wiring plane can carry large currents and do not block light impinging on the cells. According to further aspects, the wiring plane enables use of parallel cell connections that provide immunity to shading, as described above. Moreover, these connections can be wired in a variety of methods, allowing use of series-parallel arrangements so that, for example, local regions could be parallel connected while larger regions series connected.
摘要翻译：本发明涉及将光伏组件中的电池配置和接线在一起。根据一个方面，在衬底的顶表面上的一个平面上制造电池，其中布线在平行平面上图案化，并且形成通孔以提供电池平面和布线平面之间的连接。在一个实施例中，布线平面位于基板的背面，并且穿过基板形成通孔。在另一个实施例中，布线平面位于单元平面下方的基板的顶表面和绝缘层，通孔通过绝缘层形成。在另一个实施例中，形成在顶表面上的单元平面包括通过透明基板照射的透明单元，在单元平面和上布线平面之间具有绝缘体。根据另一方面，布线平面中的重型母线连接可以承载大电流并且不阻挡撞击电池的光。根据另外的方面，如上所述，布线平面能够使用提供对阴影的免疫力的并行单元连接。此外，这些连接可以以各种方式进行布线，允许使用串联并联布置，使得例如，当较大区域串联连接时，局部区域可以并联连接。

9. 发明申请

WO2008118222A2 SELECTIVE ELECTROLESS DEPOSITION FOR SOLAR CELLS 审中-公开
标题翻译：太阳能电池的选择性化学沉积
公开(公告)号：WO2008118222A2
公开(公告)日：2008-10-02
申请号：PCT/US2007/085873
申请日：2007-11-29
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , SHANMUGASUNDRAM, Arulkumar , BACHRACH, Robert, Z. , GAY, Charles , EAGLESHAM, David
发明人： LOPATIN, Sergey , SHANMUGASUNDRAM, Arulkumar , BACHRACH, Robert, Z. , GAY, Charles , EAGLESHAM, David
IPC分类号： H01L31/00
CPC分类号： H01L31/022425 , H01L31/022433 , H01L31/02245 , Y02E10/50
摘要： A metal contact structure of a solar cell substrate includes a contact with a conductive layer or a capping layer that is formed using an electroless plating process. The contact may be disposed within a hole formed through the solar cell substrate or on a non-light-receiving surface of the solar cell substrate. The electroless plating process for the conductive layer uses a seed layer that includes an activation layer for electroless plating.
摘要翻译：太阳能电池基板的金属接触结构包括与使用无电电镀工艺形成的导电层或覆盖层的接触。接触件可以设置在穿过太阳能电池基板形成的孔内或太阳能电池基板的非光接收表面上。用于导电层的化学镀工艺使用包括用于化学镀的活化层的晶种层。

10. 发明申请

WO2007115100A2 METHOD FOR FORMING THIN FILM PHOTOVOLTAIC INTERCONNECTS USING SELF ALIGNED PROCESS 审中-公开
标题翻译：使用自对准过程形成薄膜光伏互连的方法
公开(公告)号：WO2007115100A2
公开(公告)日：2007-10-11
申请号：PCT/US2007/065515
申请日：2007-03-29
申请人： APPLIED MATERIALS, INC. , BORDEN, Peter, G. , EAGLESHAM, David
发明人： BORDEN, Peter, G. , EAGLESHAM, David
IPC分类号： A61B5/00 , A61B5/05
CPC分类号： H01L31/0322 , H01L31/0463 , Y02E10/541
摘要： Processing steps that are useful for forming interconnects in a photovoltaic module are described herein. According to one aspect, a method according to the invention includes processing steps that are similar to those performed in conventional integrated circuit fabrication. For example, the method can include etches to form a conductive step adjacent to the grooves that can be used to form interconnects between cells. According to another aspect the method for forming the conductive step can be self-aligned, such as by positioning a mirror above the module and exposing photoresist from underneath the substrate at an angle one or more times, and etching to expose the conductive step.
摘要翻译：本文描述了可用于在光伏模块中形成互连的处理步骤。根据一个方面，根据本发明的方法包括与常规集成电路制造中执行的步骤相似的处理步骤。例如，该方法可以包括蚀刻以形成邻近凹槽的导电步骤，其可用于在单元之间形成互连。根据另一方面，用于形成导电步骤的方法可以是自对准的，例如通过在模块上方定位反射镜并以一个或多个角度从基底下方曝光光致抗蚀剂，以及蚀刻以暴露导电步骤。

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