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1. 发明申请

WO2016043924A1 METHOD AND APPARATUS FOR HIGH EFFICIENCY POST CMP CLEAN USING ENGINEERED VISCOUS FLUID 审中-公开
标题翻译：使用工程粘度流体高效CMP后清洗的方法和装置
公开(公告)号：WO2016043924A1
公开(公告)日：2016-03-24
申请号：PCT/US2015/046216
申请日：2015-08-21
申请人： APPLIED MATERIALS, INC.
发明人： MIKHAYLICHENKO, Ekaterina , BROWN, Brian J. , REDEKER, Fred C.
IPC分类号： H01L21/304 , H01L21/302
CPC分类号： C11D1/146 , C11D3/3753 , C11D3/3773 , C11D11/0047 , C11D17/003 , H05K3/0085
摘要： Embodiments of the present apparatus and methods for post CMP clean. More particularly, embodiments provide apparatus and methods for removing nano sized particles. One embodiment provides a method for cleaning a substrate. The method includes exposing the substrate to a viscoelastic fluid to remove small particles from the substrate. The viscoelastic fluid comprising a viscosity adjustor and an aqueous base.
摘要翻译：本发明的CMP清洗装置和方法的实施例。更具体地，实施方案提供了用于去除纳米尺寸颗粒的装置和方法。一个实施例提供了一种清洁衬底的方法。该方法包括将基底暴露于粘弹性流体以从基底去除小颗粒。该粘弹性流体包括粘度调节剂和碱性水溶液。

2. 发明公开

EP3571009A1 A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS 审中-实审
公开(公告)号：EP3571009A1
公开(公告)日：2019-11-27
申请号：EP18741588.0
申请日：2018-01-19
申请人： Applied Materials, Inc.
发明人： TOLLES, Robert D. , MENK, Gregory E. , DAVEY, Eric , WANG, You , TRAN, Huyen Karen , REDEKER, Fred C. , KAKIREDDY, Veera Raghava Reddy , MIKHAYLICHENKO, Ekaterina , GURUSAMY, Jay
IPC分类号： B24B21/06 , B24B21/12 , B24B37/12 , B24B37/26 , B24D11/00

3. 发明申请

WO2022256221A1 ASYMMETRY CORRECTION VIA VARIABLE RELATIVE VELOCITY OF A WAFER 审中-公开
公开(公告)号：WO2022256221A1
公开(公告)日：2022-12-08
申请号：PCT/US2022/031093
申请日：2022-05-26
申请人： APPLIED MATERIALS, INC.
发明人： ZHANG, Jimin , BROWN, Brian J. , LAU, Eric , MIKHAYLICHENKO, Ekaterina , OH, Jeonghoon , ALONZO, Gerald J.
IPC分类号： B24B37/04 , B24B37/10 , B24B37/28 , H01L21/67
摘要： Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.

4. 发明申请

WO2022132310A1 PAD CARRIER FOR HORIZONTAL PRE-CLEAN MODULE 审中-公开
公开(公告)号：WO2022132310A1
公开(公告)日：2022-06-23
申请号：PCT/US2021/056678
申请日：2021-10-26
申请人： APPLIED MATERIALS, INC.
发明人： GOLUBOVSKY, Edward , RANGARAJAN, Jagan , MIKHAYLICHENKO, Ekaterina
IPC分类号： B24B37/30 , B24B41/06 , B24B53/017 , H01L21/67
摘要： A horizontal pre-clean module includes a chamber including a basin and a lid which collectively define a processing area, a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including a substrate receiving surface, a pad conditioning station disposed proximate to the rotatable vacuum table, a pad carrier positioning arm having a first end and a second end distal from the first end, a pad carrier assembly coupled to the first end of the pad carrier positioning arm, and an actuator coupled to the second end of the pad carrier positioning arm and configured to swing the pad carrier assembly between a first position over the rotatable vacuum table and a second position over the pad conditioning station. The pad carrier assembly includes a gimbal base and a pad carrier coupled to the gimbal base, the gimbal base and the pad carrier are configured to support a buffing pad by a mechanical clamping mechanism and a suction clamping mechanism.

5. 发明申请

WO2015048576A1 PROCESSES AND APPARATUS FOR CLEANING, RINSING, AND DRYING SUBSTRATES 审中-公开
标题翻译：清洁，冲洗和干燥基材的工艺和装置
公开(公告)号：WO2015048576A1
公开(公告)日：2015-04-02
申请号：PCT/US2014/057904
申请日：2014-09-26
申请人： APPLIED MATERIALS, INC
发明人： BROWN, Brian J. , MIKHAYLICHENKO, Ekaterina , FRANKEL, Jonathan
IPC分类号： H01L21/302 , H01L21/02
CPC分类号： H01L21/67057 , H01L21/67028
摘要： In some embodiments, a module is provided that is configured to clean, rinse, and dry a substrate. Module includes a tank having upper and lower tank regions, the upper tank region having an opening through which a substrate is removed from the tank, a first fluid supply configured to supply a first fluid to a surface of a substrate as the substrate is removed from the tank, and a first suction mechanism, positioned below the first fluid supply, wherein the first suction mechanism is configured to suction fluid supplied from the first fluid supply so as to deter the suctioned fluid from reaching the lower tank region and a drying vapor supply positioned above the first fluid supply and configured to supply a drying vapor to a surface of a substrate being removed from the tank. Numerous other aspects are provided.
摘要翻译：在一些实施例中，提供了被配置为清洁，漂洗和干燥基底的模块。模块包括具有上部和下部罐区域的罐，上部罐区域具有一个开口，一个衬底从罐中移出;一个第一流体供应装置，用于在基板被从所述罐和位于所述第一流体供应源下方的第一抽吸机构，其中所述第一抽吸机构构造成抽吸从所述第一流体供应源供应的流体，以便阻止所述被抽吸的流体到达所述下部罐区域，并且所述干燥蒸气供应源位于第一流体供应器上方并被配置为将干燥蒸气供应到从罐移除的基板的表面。提供了许多其他方面。

6. 发明申请

WO2022103528A1 SUBSTRATE HANDLING IN A MODULAR POLISHING SYSTEM WITH SINGLE SUBSTRATE CLEANING CHAMBERS 审中-公开
公开(公告)号：WO2022103528A1
公开(公告)日：2022-05-19
申请号：PCT/US2021/053857
申请日：2021-10-06
申请人： APPLIED MATERIALS, INC.
发明人： BROWN, Brian J. , MIKHAYLICHENKO, Ekaterina , JI, Jin , RANGARAJAN, Jagan
IPC分类号： H01L21/67 , H01L21/677 , H01L21/687
摘要： Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems, and more particular, to modular polishing systems used in the manufacturing of semiconductor devices. In one embodiment, a polishing system includes a first portion having a plurality of polishing stations disposed therein, and a second portion coupled to the first portion, the second portion comprising a substrate cleaning system. The substrate cleaning system comprises a wet-in / dry-out substrate cleaning module comprising a chamber housing which defines a chamber volume. The polishing system further includes a substrate handler located in the second portion, where the substrate handler is positioned to transfer substrates to or from the wet-in / dry-out substrate cleaning module through one or more openings formed in one or more sidewalls of the chamber housing.

7. 发明申请

WO2016100938A1 SYSTEMS AND METHODS FOR RINSING AND DRYING SUBSTRATES 审中-公开
标题翻译：用于冲洗和干燥基材的系统和方法
公开(公告)号：WO2016100938A1
公开(公告)日：2016-06-23
申请号：PCT/US2015/066924
申请日：2015-12-18
申请人： APPLIED MATERIALS, INC.
发明人： MIKHAYLICHENKO, Ekaterina , BROWN, Brian J. , HANSON, Kyle M. , FRANCISCHETTI, Vincent S.
IPC分类号： H01L21/302
CPC分类号： H01L21/02054 , B08B3/08 , H01L21/67028 , H01L21/67034 , H01L21/67057 , H01L21/67733 , H01L21/67736 , H01L21/67751
摘要： In some embodiments, a system is provided that includes (1) a loading position; (2) a drying position; (3) a movable tank configured to (a) hold at least one substrate; (b) hold a cleaning chemistry so as to expose a substrate within the movable tank to the cleaning chemistry; and (c) translate between the loading position and the drying position; and (4) a drying station located at the drying position and configured to rinse and dry a substrate as the substrate is unloaded from the movable tank when the movable tank is at the drying position. Numerous other aspects are provided.
摘要翻译：在一些实施例中，提供一种系统，其包括（1）装载位置; （2）干燥位置; （3）可移动罐，其构造成（a）保持至少一个基板; （b）保持清洁化学品，以将可移动罐内的基材暴露于清洁化学品; 和（c）在装载位置和干燥位置之间平移; 和（4）位于干燥位置处的干燥站，其构造为当可移动罐处于干燥位置时基底从可移动罐卸载时冲洗和干燥基底。提供了许多其他方面。

8. 发明申请

WO2016100242A1 SUBSTRATE RINSING SYSTEMS AND METHODS 审中-公开
标题翻译：基板冲压系统和方法
公开(公告)号：WO2016100242A1
公开(公告)日：2016-06-23
申请号：PCT/US2015/065648
申请日：2015-12-14
申请人： APPLIED MATERIALS, INC.
发明人： FRANKEL, Jonathan S. , BROWN, Brian J. , FRANCISCHETTI, Vincent S. , MCHUGH, Paul , HANSON, Kyle M. , MIKHAYLICHENKO, Ekaterina
IPC分类号： H01L21/302
CPC分类号： H01L21/67051 , B05B1/046 , H01L21/02052 , H01L21/67057
摘要： An example waterfall apparatus includes (1) a first portion of a first width having (a) a first plenum, a second plenum, and a restricted fluid path therebetween; (b) a first coupling surface; and (c) an inlet opening that creates a fluid path between the first coupling surface and the first plenum; and (2) a second portion of a second width larger than the first width and having (a) a second coupling surface; and (b) an inlet aligned with the first portion inlet opening. The first and second coupling surfaces form a slot that extends along at least a portion of a length of the waterfall apparatus and that connects to the second plenum. Fluid introduced into the second portion inlet fills the first plenum, travels through the restricted fluid path to the second plenum, and exits the slot between the first and second portions to form a rinsing fluid waterfall.
摘要翻译：示例性瀑布装置包括（1）第一宽度的第一部分，其具有（a）第一增压室，第二增压室和它们之间的限制流体路径; （b）第一耦合表面; 和（c）入口开口，其在所述第一联接表面和所述第一增压室之间产生流体路径; 和（2）第二宽度大于第一宽度的第二部分，并且具有（a）第二联接表面; 和（b）与第一部分入口开口对准的入口。第一和第二联接表面形成沿着瀑布装置的长度的至少一部分延伸并连接到第二增压室的槽。引入第二部分入口的流体填充第一集气室，穿过受限制的流体路径到达第二集气室，并且离开第一和第二部分之间的槽，以形成冲洗流体瀑布。

9. 发明申请

WO2022271492A1 SPRAY SYSTEM FOR SLURRY REDUCTION DURING CHEMICAL MECHANICAL POLISHING (CMP) 审中-公开
公开(公告)号：WO2022271492A1
公开(公告)日：2022-12-29
申请号：PCT/US2022/033476
申请日：2022-06-14
申请人： APPLIED MATERIALS, INC.
发明人： CHOU, Chih Chung , IYER, Anand Nilakantan , MIKHAYLICHENKO, Ekaterina , LEE, Christopher Heung-Gyun , RONDUM, Erik , CHEUNG, Tiffany Yu-nung , CHANG, Shou-Sung
IPC分类号： B24B57/02 , B24B37/10 , B24B53/017 , H01L21/67 , B24B37/042 , H01L21/30625
摘要： Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein, In particular, embodiments herein relate to a CMP polishing method including urging a substrate against a surface of a pad of a polishing system using a carrier assembly. A fluid is dispensed onto the pad from a fluid delivery assembly at a variable flow rate and a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle. The frequency refers to a number of pulses of the fluid at the first flow rate per rotation of the pad. The term duty cycle refers to a percentage of the pad exposed to fluid per rotation of the pad. The carrier assembly is translated across a surface of the pad while rotating the carrier assembly about a rotational axis.

10. 发明申请

WO2022098527A1 HORIZONTAL BUFFING MODULE 审中-公开
公开(公告)号：WO2022098527A1
公开(公告)日：2022-05-12
申请号：PCT/US2021/056410
申请日：2021-10-25
申请人： APPLIED MATERIALS, INC.
发明人： GOLUBOVSKY, Edward , SAKATA, Clinton , RANGARAJAN, Jagan , MIKHAYLICHENKO, Ekaterina , ZUNIGA, Steven M.
IPC分类号： B24B37/20 , B24B37/12 , B24B53/017 , B24B37/30 , H01L21/67
摘要： A horizontal pre-clean (HPC) module for a chemical mechanical polishing (CMP) processing system is disclosed. The HPC module includes a chamber having a basin and a lid which collectively define a processing area. The module includes a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including an array of channels defined in a supporting surface thereof. The module includes a pad conditioning station disposed proximate to the rotatable vacuum table. The module includes a pad carrier positioning arm coupled to a pad carrier assembly. The module includes an actuator coupled to the pad carrier positioning arm and configured to position the pad carrier assembly between a first position over the rotatable vacuum table and a second position over the pad conditioning station.

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