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1. 发明申请

WO2017066077A1 METHOD AND APPARATUS FOR FORMING ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS 审中-公开
标题翻译：使用添加剂制造工艺形成先进抛光垫的方法和设备
公开(公告)号：WO2017066077A1
公开(公告)日：2017-04-20
申请号：PCT/US2016/055793
申请日：2016-10-06
申请人： APPLIED MATERIALS, INC.
发明人： GANAPATHIAPPAN, Sivapackia , FU, Boyi , CHOCKALINGAM, Ashwin , REDFIELD, Daniel , BAJAJ, Rajeev , ORILALL, Mahendra C. , NG, Hou T. , FUNG, Jason G. , YAMAMURA, Mayu
IPC分类号： B24D11/00 , B24D3/28 , B24B37/24 , B33Y10/00 , B24B37/26 , B24D11/04 , B24B37/22 , B33Y80/00 , B24D18/00
CPC分类号： B24B37/22 , B24B37/24 , B33Y10/00 , B33Y80/00
摘要： Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
摘要翻译：本公开的实施例涉及具有可调化学，材料和结构特性的高级抛光垫以及制造该抛光垫的新方法。根据本公开的一个或多个实施例，已经发现具有改进性能的抛光垫可以通过诸如三维（3D）印刷工艺的增材制造工艺来生产。本发明的实施例因此可以提供具有离散特征和几何形状的高级抛光垫，其由包括功能聚合物，官能低聚物，反应性稀释剂，加成聚合物前体化合物，催化剂和固化剂的至少两种不同材料形成。例如，高级抛光垫可以由多个聚合物层形成，通过自动顺序沉积至少一种聚合物前体组合物，随后进行至少一个固化步骤，其中每个层可以代表至少一种聚合物组合物和/ 或不同成分的区域。本公开的实施方式进一步提供了具有聚合物层的抛光垫，所述聚合物层可以是互穿聚合物网络。

2. 发明公开

EP3766097A1 PLANARIZATION FOR SEMICONDUCTOR DEVICE PACKAGE FABRICATION PROCESSES 审中-公开
公开(公告)号：EP3766097A1
公开(公告)日：2021-01-20
申请号：EP19766870.0
申请日：2019-02-15
申请人： Applied Materials, Inc.
发明人： CHEN, Han-Wen , VERHAVERBEKE, Steven , GOUK, Roman , CHO, Kyuil , FU, Boyi
IPC分类号： H01L23/31 , H01L23/29 , H01L21/56

3. 发明公开

EP3790706A1 HYDROPHILIC AND ZETA POTENTIAL TUNABLE CHEMICAL MECHANICAL POLISHING PADS 审中-公开
公开(公告)号：EP3790706A1
公开(公告)日：2021-03-17
申请号：EP19800510.0
申请日：2019-04-04
申请人： Applied Materials, Inc.
发明人： GANAPATHIAPPAN, Sivapackia , FU, Boyi , CHOCKALINGAM, Ashwin , VORA, Ankit , REDFIELD, Daniel , BAJAJ, Rajeev , PATIBANDLA, Nag B. , NG, Hou T. , MADHUSOODHANAN, Sudhakar
IPC分类号： B24B37/22 , B24B37/24 , B29C64/112 , B33Y10/00 , B33Y70/00

4. 发明申请

WO2019217012A1 HYDROPHILIC AND ZETA POTENTIAL TUNABLE CHEMICAL MECHANICAL POLISHING PADS 审中-公开
公开(公告)号：WO2019217012A1
公开(公告)日：2019-11-14
申请号：PCT/US2019/025879
申请日：2019-04-04
申请人： APPLIED MATERIALS, INC.
发明人： GANAPATHIAPPAN, Sivapackia , FU, Boyi , CHOCKALINGAM, Ashwin , VORA, Ankit , REDFIELD, Daniel , BAJAJ, Rajeev , PATIBANDLA, Nag B. , NG, Hou T. , MADHUSOODHANAN, Sudhakar
IPC分类号： B24B37/22 , B24B37/24 , B29C64/112 , B33Y10/00 , B33Y70/00
摘要： In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

5. 发明申请

WO2019023221A1 INTEGRATED ABRASIVE POLISHING PADS AND MANUFACTURING METHODS 审中-公开
公开(公告)号：WO2019023221A1
公开(公告)日：2019-01-31
申请号：PCT/US2018/043470
申请日：2018-07-24
申请人： APPLIED MATERIALS, INC.
发明人： KUMAR, Ashavani , CHOCKALINGAM, Ashwin , GANAPATHIAPPAN, Sivapackia , BAJAJ, Rajeev , FU, Boyi , REDFIELD, Daniel , PATIBANDLA, Nag B. , CORNEJO, Mario Dagio , SINHA, Amritanshu , ZHAO, Yan , ARNEPALLI, Ranga Rao , REDEKER, Fred C.
IPC分类号： B24D11/00 , B29C64/112 , B24B37/22 , B24D11/04 , B33Y10/00 , B33Y80/00 , C09G1/16
摘要： Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

6. 发明申请

WO2020050932A1 FORMULATIONS FOR ADVANCED POLISHING PADS 审中-公开
公开(公告)号：WO2020050932A1
公开(公告)日：2020-03-12
申请号：PCT/US2019/044710
申请日：2019-08-01
申请人： APPLIED MATERIALS, INC.
发明人： GANAPATHIAPPAN, Sivapackia , VORA, Ankit , FU, Boyi , HARIHARAN, Venkat , YAMAMURA, Mayu , CORNEJO, Mario , ABRAMSON, Igor , YANG, Mo , REDFIELD, Daniel , BAJAJ, Rajeev , PATIBANDLA, Nag B.
IPC分类号： C08F265/06 , C08F220/36 , C08F220/10 , C08F2/48 , C08J9/14 , B24B37/24 , B24D3/32 , C08F220/34
摘要： Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

7. 发明申请

WO2018236583A1 METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING APPLICATIONS 审中-公开
公开(公告)号：WO2018236583A1
公开(公告)日：2018-12-27
申请号：PCT/US2018/036277
申请日：2018-06-06
申请人： APPLIED MATERIALS, INC.
发明人： CHEN, Han-Wen , VERHAVERBEKE, Steven , GOUK, Roman , SEE, Guan Huei , GU, Yu , SUNDARRAJAN, Arvind , CHO, Kyuil , NEIKIRK, Colin Costano , FU, Boyi
IPC分类号： H01L21/02 , H01L21/56
摘要： Embodiments of the present disclosure generally describe methods for minimizing the occurrence and the extent of die shift during the formation of a reconstituted substrate in fan-out wafer level packaging processes. Die shift is a process defect that occurs when a die (device) moves from its intended position within a reconstituted substrate during the formation thereof. Generally, the methods disclosed herein include depositing a device immobilization layer and/or a plurality of device immobilization beads over and/or adjacent to a plurality of singular devices (individual dies), and the carrier substrate they are positioned on, before forming a reconstituted substrate with an epoxy molding compound. The device immobilization layer and/or the plurality of device immobilization beads immobilize the plurality of singular devices and prevents them from shifting on the carrier substrate during the molding process.

8. 发明申请

WO2016061585A1 POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS 审中-公开
标题翻译：添加剂制造工艺生产的抛光垫
公开(公告)号：WO2016061585A1
公开(公告)日：2016-04-21
申请号：PCT/US2015/056254
申请日：2015-10-19
申请人： APPLIED MATERIALS, INC.
发明人： BAJAJ, Rajeev , REDFIELD, Daniel , ORILALL, Mahendra C. , FU, Boyi , KHANNA, Aniruddh Jagdish , FUNG, Jason G. , CORNEJO, Mario , CHOCKALINGAM, Ashwin , YAMAMURA, Mayu Felicia , KAKIREDDY, Raghava , KUMAR, Ashavani , HARIHARAN, Venkatachalam , MENK, Gregory E. , REDEKER, Fred C. , PATIBANDLA, Nag B. , NG, Hou Tee , DAVENPORT, Rob , SINHA, Amritanshu
IPC分类号： H01L21/304
CPC分类号： B24B37/26 , B24B37/22
摘要： Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
摘要翻译：本公开的实施例涉及具有可调化学，材料和结构特性的高级抛光垫以及制造该抛光垫的新方法。根据本公开的一个或多个实施例，已经发现具有改进性能的抛光垫可以通过诸如三维（3D）印刷工艺的增材制造工艺来生产。本公开的实施方式因此可以提供具有离散特征和几何形状的高级抛光垫，其由包括功能聚合物，官能低聚物，反应性稀释剂和固化剂的至少两种不同材料形成。例如，高级抛光垫可以由多个聚合物层形成，通过自动顺序沉积至少一种树脂前体组合物，随后进行至少一个固化步骤，其中每个层可以代表至少一种聚合物组合物和/ 或不同成分的区域。

9. 发明申请

WO2019089344A1 APPARATUS AND METHODS FOR PACKAGING SEMICONDUCTOR DIES 审中-公开
公开(公告)号：WO2019089344A1
公开(公告)日：2019-05-09
申请号：PCT/US2018/057504
申请日：2018-10-25
申请人： APPLIED MATERIALS, INC.
发明人： FU, Boyi , CHEN, Han-Wen , CHO, Kyuil , GANAPATHIAPPAN, Sivapackia , GOUK, Roman , VERHAVERBEKE, Steven , PATIBANDLA, Nag B. , ZHAO, Yan , NG, Hou T. , VORA, Ankit , ZHANG, Daihua
IPC分类号： H01L21/56 , H01L21/67
摘要： Aspects of the disclosure generally relate to methods of immobilizing die on a substrate. In one method one or more immobilization features are formed in a selected pattern on a substrate. A die is positioned in contact with the one or more immobilization features and the substrate. The one or more immobilization features are cured, and a mold layer is formed on top of the cured one or more immobilization features and the die so as to encapsulate the die.

10. 发明申请

WO2019028324A1 POLISHING PAD WITH WINDOW AND MANUFACTURING METHODS THEREOF 审中-公开
公开(公告)号：WO2019028324A1
公开(公告)日：2019-02-07
申请号：PCT/US2018/045122
申请日：2018-08-03
申请人： APPLIED MATERIALS, INC.
发明人： FU, Boyi , GANAPATHIAPPAN, Sivapackia , REDFIELD, Daniel , BAJAJ, Rajeev , CHOCKALINGAM, Ashwin , BENVEGNU, Dominic J. , CORNEJO, Mario Dagio , YAMAMURA, Mayu , PATIBANDLA, Nag B. , VORA, Ankit
IPC分类号： B24B37/013 , B24B37/20 , B24B37/24
摘要： Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

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