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1. 发明申请

WO2007033243A2 SEMICONDUCTOR PACKAGE HAVING PLATE INTERCONNECTIONS 审中-公开
标题翻译：半导体封装具有板互连
公开(公告)号：WO2007033243A2
公开(公告)日：2007-03-22
申请号：PCT/US2006/035641
申请日：2006-09-12
申请人： ALPHA & OMEGA SEMICONDUCTOR LTD. , SUN, Ming , SHI, Lei , HO, Yueh-Se , LIU, Kai , ZHANG, Xiaotian
发明人： SUN, Ming , SHI, Lei , HO, Yueh-Se , LIU, Kai , ZHANG, Xiaotian
IPC分类号： H01L23/48 , H01L23/28
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having metalized source and gate areas separated by a passivation area, a patterned source connection coupling the source lead to the semiconductor die metalized source area, a patterned gate connection coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译：公开了一种半导体封装。封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，半导体管芯具有被钝化区域分开的金属化源极和栅极区域，将源极引线耦合到半导体管芯金属化源极的图案化源极连接区域，将栅极引线耦合到半导体管芯金属化栅极区域的图案化栅极连接，耦合到漏极引线的半导体管芯漏极区域以及覆盖半导体管芯和漏极，源极和栅极引线的至少一部分的密封剂。 / p>

2. 发明申请

WO2006135874A2 DFN SEMICONDUCTOR PACKAGE HAVING REDUCED ELECTRICAL RESISTANCE 审中-公开
标题翻译： DFN半导体封装具有降低的电阻
公开(公告)号：WO2006135874A2
公开(公告)日：2006-12-21
申请号：PCT/US2006/022909
申请日：2006-06-12
申请人： ALPHA & OMEGA SEMICONDUCTOR LTD. , SUN, Ming , ZHANG, Xiaotian , LIU, Kai
发明人： SUN, Ming , ZHANG, Xiaotian , LIU, Kai
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/05552 , H01L2224/05553 , H01L2224/0603 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49113 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2224/85 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A DFN semiconductor package is disclosed, the package includes a leadframe having a die bonding pad formed integrally with a drain lead, a source lead bonding area and a gate lead bonding area, the source lead bonding area and the gate lead bonding area being of increased area, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead bonding area and a die gate bonding area coupled to the gate lead bonding area, and an encapsulant at least partially covering the die, drain lead, gate lead bonding area and source lead bonding area.
摘要翻译：公开了一种DFN半导体封装，该封装包括具有与漏极引线，源极引线接合区域和栅极引线接合区域一体形成的管芯接合焊盘的引线框架，源极引线接合区域和栅极引线接合区域增加区域，耦合到管芯接合焊盘的管芯，耦合到源极引线接合区域的管芯源极接合区域和耦合到栅极引线接合区域的管芯栅极结合区域，以及至少部分地覆盖管芯，漏极引线，栅极引线接合面积和源极引线接合面积。

3. 发明申请

WO2006074312A2 DUAL FLAT NON-LEADED SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：双平面非引线半导体封装
公开(公告)号：WO2006074312A2
公开(公告)日：2006-07-13
申请号：PCT/US2006/000356
申请日：2006-01-05
申请人： ALPHA & OMEGA SEMICONDUCTOR LIMITED , LIU, Kai , ZHANG, Xiaotian , SUN, Ming , LUO, Leeshawn
发明人： LIU, Kai , ZHANG, Xiaotian , SUN, Ming , LUO, Leeshawn
IPC分类号： H01L23/495 , H01L23/48
CPC分类号： H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49113 , H01L2224/49171 , H01L2224/4943 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A DFN semiconductor package includes a Ieadframe having a die bonding pad formed integrally with a drain lead, a gate lead and a source lead, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead and a die gate bonding area coupled to the gate lead, and an encapsulant at least partially covering the die, drain lead, gate lead and source.
摘要翻译： DFN半导体封装包括具有与漏极引线，栅极引线和源极引线一体形成的管芯焊接焊盘的芯片，耦合到管芯焊盘的管芯，与源极引线耦合的管芯源极接合区域和管芯栅极接合区域，以及至少部分地覆盖管芯，漏极引线，栅极引线和源极的密封剂。

4. 发明申请

WO2009045342A1 SEMICONDUCTOR PACKAGE HAVING A BRIDGED PLATE INTERCONNECTION 审中-公开
标题翻译：具有桥接板互连的半导体封装
公开(公告)号：WO2009045342A1
公开(公告)日：2009-04-09
申请号：PCT/US2008/011202
申请日：2008-09-26
申请人： ALPHA AND OMEGA SEMICONDUCTOR LIMITED , SHI, Lei , SUN, Ming , LIU, Kai
发明人： SHI, Lei , SUN, Ming , LIU, Kai
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, and a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source contacts. A bridged source plate interconnection has a bridge portion, valley portions disposed on either side of the bridge portion, plane portions disposed on either side of the valley portions and the bridge portion; and a connection portion depending from one of the plane portions, the bridged source plate interconnection connecting the source lead with the plurality of metalized source contacts. The bridge portion is disposed in a plane above the plane of the valley portions while the plane portions are disposed in a plane intermediate the plane of the bridge portion and the plane of the valley portions.
摘要翻译：公开了半导体封装。封装包括具有漏极，源极和栅极引线的引线框架以及耦合到引线框架的半导体管芯，该半导体管芯具有多个金属化源极触点。桥接源极板互连具有桥接部分，设置在桥接部分的任一侧上的谷部分，设置在谷部分和桥部分两侧的平面部分; 以及从所述平面部分之一悬垂的连接部分，所述桥接源极板互连件将所述源极引线与所述多个金属化源极触点连接。桥面部分设置在平坦部分的平面上方的平面中，而平面部分设置在桥接部分的平面和谷部的平面之间的平面中。

5. 发明申请

WO2008137001A2 SEMICONDUCTOR PACKAGE HAVING DIMPLED PLATE INTERCONNECTIONS 审中-公开
标题翻译：具有切割板互连的半导体封装
公开(公告)号：WO2008137001A2
公开(公告)日：2008-11-13
申请号：PCT/US2008/005563
申请日：2008-04-30
申请人： ALPHA & OMEGA SEMICONDUCTOR LIMITED , SUN, Ming , SHI, Lei , LIU, Kai
发明人： SUN, Ming , SHI, Lei , LIU, Kai
IPC分类号： H01L23/48
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译：公开了半导体封装。封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有多个金属化源极区域和金属化栅极区域的半导体管芯，具有形成在其上的多个凹坑的图案化源极连接，源极引导到半导体芯片金属化源极区域，具有形成在其上的凹坑的图案化栅极连接将栅极引线耦合到半导体管芯金属化栅极区域，耦合到漏极引线的半导体管芯漏极区域和覆盖至少一部分的密封剂的半导体管芯和漏极，源极和栅极引线。

6. 发明申请

WO2018227485A1 METHOD, SYSTEM AND APPARATUS FOR FAULT DETECTION 审中-公开
公开(公告)号：WO2018227485A1
公开(公告)日：2018-12-20
申请号：PCT/CN2017/088474
申请日：2017-06-15
申请人： ABB SCHWEIZ AG , LIU, Kai
发明人： LIU, Kai
IPC分类号： G01R31/08
摘要： A method, system and apparatus for fault detection in line protection for a power transmission system. The method comprises the following steps: obtaining a sampled value of voltage at a measurement point, at which a protection device for the line protection is installed, on an electrical line (110); obtaining a sampled value of current at the measurement point (120); calculating an instantaneous measurement point voltage value specified by operation criterion of a protection device from the sampled value of voltage at the measurement point and the sampled value of current at the measurement point by using measurement differential equation according to a time domain lumped parameter model for the electrical line (130); calculating an instantaneous comparison voltage value specified by operation criterion of a protection device from the sampled value of voltage at the measurement point and the sampled value of current at the measurement point by using comparison differential equation according to a time domain lumped parameter model for the electrical line (140); and performing the fault detection based on the comparison result of the instantaneous measurement point voltage value and the instantaneous comparison voltage value (150). The method transfers the distance relay to the format of voltage comparison, calculate the voltage using differential equation instead of vector, and compare the amplitude of calculated voltages. It designs a time-domain distance protection which has strong ability to resist DC components and harmonics including high frequency harmonic and low frequency harmonic.

7. 发明申请

WO2012061680A2 RELAY NODE INTERFACE RELATED LAYER 2 MEASUREMENTS AND RELAY NODE HANDLING IN NETWORK LOAD BALANCING 审中-公开
标题翻译：继电器节点接口相关层2网络负载平衡中的测量和继电器节点处理
公开(公告)号：WO2012061680A2
公开(公告)日：2012-05-10
申请号：PCT/US2011/059277
申请日：2011-11-04
申请人： INTERDIGITAL PATENT HOLDINGS, INC. , LIU, Kai , WANG, Peter, S. , TAMAKI, Nobuyuki , STERN-BERKOWITZ, Janet, A. , TERRY, Stephen, E.
发明人： LIU, Kai , WANG, Peter, S. , TAMAKI, Nobuyuki , STERN-BERKOWITZ, Janet, A. , TERRY, Stephen, E.
IPC分类号： H04W24/10
CPC分类号： H04W36/30 , H04W24/10 , H04W36/0094 , H04W36/22 , H04W84/047
摘要： A method for performing radio usage measurements to support radio link operations and/or load balancing may be performed at an evolved Node B (eNB). The method may include determining a first radio usage parameter. The first radio usage parameter may be a measurement of radio usage between an eNB and at least one wireless transmit receive unit (WTRU). The method may further include determining a second radio usage parameter. The second radio usage parameter may be a measurement of radio usage between the eNB and at least one relay node (RN) served by the eNB. The method may further include utilizing at least one of the first radio usage parameter or the second radio usage parameter to evaluate at least one of evolved universal terrestrial radio access (E-UTRA) radio link operations, radio resource management (RRM), network operations and maintenance (OAM), and self-organizing networks (SON) functions or functionalities.
摘要翻译：用于执行无线电使用测量以支持无线电链路操作和/或负载平衡的方法可以在演进节点B（eNB）处执行。该方法可以包括确定第一无线电使用参数。第一无线电使用参数可以是eNB与至少一个无线发射接收单元（WTRU）之间的无线电使用的测量。该方法还可以包括确定第二无线电使用参数。第二无线电使用参数可以是eNB与由eNB服务的至少一个中继节点（RN）之间的无线电使用的测量。该方法还可以包括利用第一无线电使用参数或第二无线电使用参数中的至少一个来评估演进的通用地面无线电接入（E-UTRA）无线电链路操作，无线电资源管理（RRM），网络操作和维护（OAM）和自组织网络（SON）功能或功能。

8. 发明申请

WO2011079210A1 FERFORMING MEASUREMENTS IN WIRELESS COMMUNICATIONS USING MULTIPLE CARRIERS 审中-公开
标题翻译：在使用多载波的无线通信中实现测量
公开(公告)号：WO2011079210A1
公开(公告)日：2011-06-30
申请号：PCT/US2010/061843
申请日：2010-12-22
申请人： INTERDIGITAL PATENT HOLDINGS, INC. , MARINIER, Paul , PELLETIER, Ghyslain , LIU, Kai , OLESEN, Robert, L. , WANG, Peter, S.
发明人： MARINIER, Paul , PELLETIER, Ghyslain , LIU, Kai , OLESEN, Robert, L. , WANG, Peter, S.
IPC分类号： H04W36/00
CPC分类号： H04W24/10 , H04W36/0083 , H04W76/27
摘要： Methods and systems to configure and/or reconfigure measurement configuration in wireless communications with one or more cells are disclosed. Measurement configuration reporting may be reconfigured based on events associated with the one or more serving cells and/or one or more serving component carriers, among others. Measurement configuration and measurement configuration reporting may also be reconfigured based on events associated with one or more serving component carriers.
摘要翻译：公开了在与一个或多个小区的无线通信中配置和/或重新配置测量配置的方法和系统。可以基于与一个或多个服务小区和/或一个或多个服务分量载波等相关联的事件重新配置测量配置报告。还可以基于与一个或多个服务分量载波相关联的事件来重新配置测量配置和测量配置报告。

9. 发明申请

WO2010027687A1 MODULAR FLEXIBLE SOFTWARE ARCHITECTURE FOR TV 审中-公开
标题翻译：用于电视的模块化灵活软件架构
公开(公告)号：WO2010027687A1
公开(公告)日：2010-03-11
申请号：PCT/US2009/054433
申请日：2009-08-20
申请人： SONY CORPORATION , SONY ELECTRONICS INC. , DAWSON, Thomas, P. , LIU, Aixin , LIU, Kai , NGUYEN, Andy , WONG, Ling, Jun
发明人： DAWSON, Thomas, P. , LIU, Aixin , LIU, Kai , NGUYEN, Andy , WONG, Ling, Jun
IPC分类号： G06F13/14
CPC分类号： H04N5/4401 , G06F8/65 , G06F9/44526 , H04N21/436 , H04N21/4431 , H04N21/4433
摘要： Rather than have a unique code set per TV product, a common code base is provided to service multiple products and even multiple product lines. Embedded systems can be upgraded through a network connection. The software architecture provides a flexible approach to supporting multiple product offerings through a plug in modular middle ware and to providing standardized hardware acceleration for both 2D and 3D graphics. The plug-in capability provides for feature additions and upgrades after sale.
摘要翻译：
不是每个电视产品都有唯一的代码集，而是提供一个共同的代码库来为多个产品甚至多条产品线提供服务。嵌入式系统可以通过网络连接进行升级。该软件架构提供了一种灵活的方法，通过插入模块化中间件来支持多种产品，并为2D和3D图形提供标准化的硬件加速。插件功能提供了功能添加和售后升级。

10. 发明申请

WO2008128474A1 CLUTCHLESS TRANSMISSION APPARATUS FOR CONTROLLING GEAR-POSITION SHIFTING AND CONTROL METHOD THEREOF 审中-公开
标题翻译：用于控制齿轮位移的无切换传动装置及其控制方法
公开(公告)号：WO2008128474A1
公开(公告)日：2008-10-30
申请号：PCT/CN2008/070752
申请日：2008-04-18
申请人： BYD COMPANY LIMITED , XU, Xunjin , LIU, Kai , GONG, Jian , ZHOU, Xuguang , ZU, Bo , YANG, Guangming , QI, Axi , TANG, Xiaohua , ZHOU, Bo
发明人： LIU, Kai , GONG, Jian , ZHOU, Xuguang , ZU, Bo , YANG, Guangming , QI, Axi , TANG, Xiaohua , ZHOU, Bo
IPC分类号： B60W10/08 , B60W10/10 , F16H59/46
CPC分类号： B60W10/06 , B60W10/11 , B60W30/19 , B60W2510/1015 , B60W2710/0644 , B60W2710/0666 , F16H59/46 , F16H61/0403 , F16H63/502 , F16H2306/44 , F16H2306/46 , F16H2306/48 , F16H2306/50 , Y10T477/677
摘要： A clutchless transmission apparatus and control method thereof. The transmission apparatus comprises a motor(10) and a transmission(20), said motor(10) is connected to said transmission(20) and supplies power to said transmission(20) via an input shaft of the transmission(20), wherein said apparatus further comprises a control device(30), which is electrically connected to said motor(10) and said transmission(20), wherein said control device(30) is configured to determine whether a gear-position shifting is required based on rotation speed of said transmission(20), if a gear-position shifting is required, regulates torque of said motor(10) to control said transmission(20) to disengage, and then regulates the rotation speed of said motor(10) based on the rotation speed of said transmission(20) to control said transmission(20) to engage for shifting gear-position. The clutchless transmission apparatus provided in the present invention doesn't need a clutch during gear-position shifting, and therefore it is light, simple, easy to maintain and control, and can be used in a wide range of application.
摘要翻译：一种无离合器传动装置及其控制方法。传动装置包括马达（10）和变速器（20），所述马达（10）连接到所述变速器（20），并通过变速器（20）的输入轴向所述变速器（20）供电，其中所述设备还包括电连接到所述电动机（10）和所述变速器（20）的控制装置（30），其中所述控制装置（30）构造成基于旋转来确定是否需要换档位置换档所述变速器（20）的速度，如果需要换档位置，则调节所述电动机（10）的扭矩以控制所述变速器（20）脱离，然后基于所述变速器（10）的转速来调节所述变速器所述变速器（20）的转速控制所述变速器（20）啮合以便换挡位置。本发明中提供的无离合器传动装置在档位移动期间不需要离合器，因此它轻巧，简单，易于维护和控制，并且可以在广泛的应用中使用。

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