会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明申请
    • COMPOSITIONS AND METHODS FOR MODIFYING A SURFACE SUITED FOR SEMICONDUCTOR FABRICATION
    • 用于修改用于半导体制造的表面的组合物和方法
    • WO2009023387A3
    • 2009-04-02
    • PCT/US2008069396
    • 2008-07-08
    • 3M INNOVATIVE PROPERTIES CO
    • HARDY L CHARLESKRANZ HEATHER KWOOD THOMAS EKAISAKI DAVID AGAGLIARDI JOHN JCLARK JOHN CSAVU PATRICIA MCLARK PHILIP G
    • H01L21/304
    • H01L21/31053B24B37/044B24B37/245C09G1/02H01L21/3212
    • The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKa greater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.
    • 本公开涉及用于改性或精制适于半导体制造的晶片表面的组合物和方法。 组合物包括可用于改性适于制造半导体器件的晶片表面的工作液体。 在一些实施方案中,工作液体是基本上不含松散磨料颗粒的初始组分的水溶液,组分包括水,表面活性剂和显示至少一个pKa大于7的pH缓冲液。在某些实施方案中,pH缓冲剂包括 碱性pH调节剂和酸性络合剂,并且工作液体的pH为约7至约12.在另外的实施方案中,本公开提供了包含适于改性晶片表面的表面活性剂的固定磨料制品,以及方法 制造固定的磨料制品。 另外的实施例描述了可用于修改晶片表面的方法。