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    • 6. 发明公开
    • 액정표시패널의 제조 방법
    • 制造液晶显示面板的方法
    • KR1020080050711A
    • 2008-06-10
    • KR1020060121291
    • 2006-12-04
    • 삼성전자주식회사
    • 김재성강훈
    • G02F1/136
    • G02F1/136286G02F1/1341G02F1/136227G02F2001/13625G02F2201/123H01L21/67069
    • A method for manufacturing an LCD(Liquid Crystal Display) panel is provided to conduct a dry etch process after a pixel electrode is formed to simplify an LCD manufacturing process. A first metal pattern including a gate line and a gate pad(GP) connected to the gate line is formed on a first substrate(100). A gate insulating layer(130) is formed on the first substrate including the first metal pattern. A second metal pattern including a data line(DL) intersecting the gate line to define a unit pixel and a data pad(DP) connected to the data line is formed on the gate insulating layer. An organic insulating layer(170) having a first hole(174) corresponding to the gate pad region and a second hole(DPH) exposing the data pad is formed on the first substrate on which the second metal pattern is formed. A pixel electrode(PE) corresponding to the unit pixel and a cover electrode(CE) for covering the data pad exposed by the second hole are formed on the organic insulating layer. A portion of the gate insulating layer, exposed by the first hole, is etched. A second substrate(200) is bonded to the first substrate.
    • 提供了一种用于制造LCD(液晶显示器)面板的方法,用于在形成像素电极之后进行干蚀刻工艺以简化LCD制造工艺。 在第一基板(100)上形成包括连接到栅极线的栅极线和栅极焊盘(GP)的第一金属图案。 在包括第一金属图案的第一基板上形成栅极绝缘层(130)。 在栅极绝缘层上形成包括与栅极线相交以限定单位像素的数据线(DL)和连接到数据线的数据焊盘(DP)的第二金属图案。 在其上形成有第二金属图案的第一基板上形成具有对应于栅极焊盘区域的第一孔(174)和暴露数据焊盘的第二孔(DPH)的有机绝缘层(170)。 在有机绝缘层上形成对应于单位像素的像素电极(PE)和用于覆盖由第二孔露出的数据焊盘的覆盖电极(CE)。 蚀刻由第一孔暴露的栅极绝缘层的一部分。 第二基板(200)被接合到第一基板。
    • 7. 发明公开
    • 베이크 장치 및 기판의 베이킹 방법.
    • 烘焙设备和烘焙方法
    • KR1020080000794A
    • 2008-01-03
    • KR1020060058589
    • 2006-06-28
    • 삼성전자주식회사
    • 강훈김재성정양호이희국
    • H01L21/324H01L21/477
    • H01L21/324H01L21/67098H01L21/687
    • A baking device and a substrate baking method are provided to decrease a temperature variation between a pin contact region and the rest region by changing a contact position between a support pin and a plate. A baking device includes a plate(11) and a support pin(12). At least one pin hole is formed on the plate, which receives power and supplies heat to a substrate(20). A photoresist film is coated on the substrate. The support pin is inserted into the pin hole, and arranges the substrate to be apart from the plate by a predetermined distance. The support pin includes a body portion(13) and a ball bearing(14). The body portion is coupled with the plate through the pin hole. A hemispherical groove is formed on an end portion of the main body, which is adjacent to the substrate. The ball bearing is arranged in the hemispherical groove.
    • 提供一种烘烤装置和基板烘烤方法,通过改变支撑销和板之间的接触位置来减小针接触区域与其余区域之间的温度变化。 烘烤装置包括板(11)和支撑销(12)。 在板上形成至少一个销孔,其接收动力并将热量供给到基板(20)。 光刻胶膜涂在基片上。 支撑销插入销孔,并将基板与板隔开预定距离。 支撑销包括主体部分(13)和滚珠轴承(14)。 主体部分通过销孔与板连接。 半导体槽形成在与基板相邻的主体的端部上。 球轴承布置在半球形凹槽中。