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1. 发明专利

JP5255109B2 Laser processing method, laser processing device and a method of manufacturing the same 有权
公开(公告)号：JP5255109B2
公开(公告)日：2013-08-07
申请号：JP2011265716
申请日：2011-12-05
申请人：浜松ホトニクス株式会社
发明人：誠中野 , 耕司久野 , 哲也筬島 , 卓井上 , 正芳熊谷
IPC分类号： B23K26/06 , B23K26/00 , B23K26/38 , B23K26/40
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method, a laser beam machining apparatus, and a method for producing the same, for surely forming a reformed region to be the starting point of cutting.SOLUTION: Laser beam L modulated by a reflection type spatial light modulator 203 is emitted to a workpiece so that the aberration of the laser beam L condensed on the inside of the workpiece 1 is controlled to be equal to or less than a predetermined value. Thus, the aberration of the laser beam L generated at the position where the condensing point P of the laser beam L is focused is reduced as far as possible, and the energy density of the laser beam L at the position is increased and the reformed region 7 having a high function as the starting point of cutting can be formed. Further, since the reflection type spatial light modulator 203 is used, utilization efficiency of the laser beam L can be improved compared with a transmission type spatial light modulator. The improvement of the utilization efficiency of the laser beam L is particularly important when the reformed region 7 to be the starting point of the cutting is formed on a plate-like workpiece 1.

2. 发明专利

JP5254761B2 Laser processing equipment 有权
公开(公告)号：JP5254761B2
公开(公告)日：2013-08-07
申请号：JP2008305143
申请日：2008-11-28
申请人：浜松ホトニクス株式会社
发明人：誠中野 , 卓井上
IPC分类号： B23K26/04 , B23K26/00 , B23K26/06 , B23K101/40 , G02F1/061
CPC分类号： B23K26/0057 , B23K26/03 , B23K26/046 , B23K26/048 , B23K26/0622 , B23K26/0853 , B23K26/40 , B23K2201/40 , B23K2203/50 , C03B33/0222
摘要： A laser machining device which can suppress the aberration of a laser beam converged into an object to be machined is provided. The device includes a laser light source for emitting a laser beam and a reflective spatial light modulator for modulating the laser beam emitted from the laser light source (202), while first mirrors for reflecting the laser beam are disposed between the laser light source and reflective spatial light modulator in an optical path of the laser beam and configured such as to be able to adjust the direction of reflection of the laser beam. Therefore, by regulating the direction of reflection of the laser beam at each of the mirrors, the device can adjust the position and incident angle of the laser beam incident on the reflective spatial light modulator as desired. Hence, the laser beam can precisely be made incident on the reflective spatial light modulator.

3. 发明专利

JP5148575B2 Laser processing method, and, laser processing equipment 有权
公开(公告)号：JP5148575B2
公开(公告)日：2013-02-20
申请号：JP2009213545
申请日：2009-09-15
申请人：浜松ホトニクス株式会社
发明人：誠中野 , 耕司久野 , 哲也筬島 , 卓井上 , 正芳熊谷
IPC分类号： B23K26/06 , B23K26/04 , B23K26/38 , B23K26/40 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method which can surely form a reformed region made into the starting point of cutting, to provide a laser beam machining apparatus, and to provide a method for producing the same. SOLUTION: The laser light L modulated by a reflection type spatial light modulator 203 is emitted to the workpiece 1 so that the aberration of laser light L condensed on the inside of a workpiece 1 is controlled to the prescribed one or below. Thus, the aberration of the laser light L generated at a position in which the condensing point P of the laser light L is focused is reduced as possible, the energy density of the laser light L at the position is increased, and a reformed region 7 having a high function as the starting point of cutting can be formed. Further, since the reflection type spatial light modulator 203 is used, the utilization efficiency of the laser light L can be improved compared with a transmission type spatial light modulator. The improvement of the utilization efficiency of the laser light L is particularly important in such a case that the reformed region 7 made into the starting point of cutting is formed on the plate-like workpiece 1. COPYRIGHT: (C)2010,JPO&INPIT

4. 发明专利

JPWO2014156689A1 レーザ加工装置及びレーザ加工方法有权
标题翻译：一种激光加工设备和激光加工方法
公开(公告)号：JPWO2014156689A1
公开(公告)日：2017-02-16
申请号：JP2015508284
申请日：2014-03-13
申请人：浜松ホトニクス株式会社
发明人：大祐河口 , 大祐河口 , 中野　誠 , 誠中野 , 良太杉尾 , 良太杉尾 , 翼廣瀬 , 翼廣瀬 , 佳祐荒木 , 佳祐荒木
IPC分类号： H01L21/301 , B23K26/064 , B23K26/53
CPC分类号： B23K26/0057 , B23K26/0643 , B23K26/0648 , B23K26/0736 , B23K26/40 , B23K2203/50 , B28D5/00 , C03B33/0222 , C03B33/07 , G02B3/08 , G02B5/001 , Y02P40/57
摘要：加工対象物(1)にレーザ光(L)を集光させることにより、切断予定ライン(5)に沿って加工対象物(1)の内部に改質領域(7)を形成し、レーザ光を出射するレーザ光源と、レーザ光源により出射されたレーザ光(L)を変調する空間光変調器(203)と、空間光変調器(203)により変調されたレーザ光を加工対象物(1)に集光する集光光学系(204)と、を備え、空間光変調器(203)は、アキシコンレンズパターンを変調パターンとして表示することにより、レーザ光照射方向に沿って近接して並ぶ複数位置に集光点が形成されるようにレーザ光を集光させることで、加工品質を向上させる。
摘要翻译：激光光（L）通过在所述对象（1）冷凝，内部，以形成改质区域（7）的切割沿（5）（1），激光束的对象的线的一个激光光源，用于发射一个空间光调制器，用于调制由所述激光光源（L）和（203）中，通过在对象中的空间光调制器（203）调制的激光束发射的激光（1）聚光光学系统，用于会聚（204）包括一空间光调制器（203），通过显示轴锥透镜图案作为调制图案，多个沿所述激光束的照射方向设置在接近位置的通过聚焦从而形成焦点的激光束，以提高加工质量。

5. 发明专利

JP5468628B2 Laser processing method 有权
公开(公告)号：JP5468628B2
公开(公告)日：2014-04-09
申请号：JP2012020200
申请日：2012-02-01
申请人：浜松ホトニクス株式会社
发明人：誠中野 , 卓井上 , 晴康伊藤 , 直也松本
IPC分类号： B23K26/38 , B23K26/06 , B23K26/40 , B28D5/00 , C03B33/09 , H01L21/301
CPC分类号： B23K26/0057 , B23K26/0676 , B23K26/40 , B23K2203/50
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method which can shorten takt time in laser beam machining, and a method for manufacturing semiconductor equipment. SOLUTION: A laser beam L is modulated by means of a reflective spatial light modulator. While the modulated laser beam L is focused on an object 1 to be machined, the laser beam L is moved on the object 1 to be machined. At this time, the laser beam L is modulated by the spatial light modulator so that reformed spots S and S are formed, with the laser beam L focused on two separate places along the direction D in which the laser beam L is moved on the object 1 to be machined. COPYRIGHT: (C)2011,JPO&INPIT

6. 发明专利

JP5575200B2 Laser processing device and a method of manufacturing the same 有权
公开(公告)号：JP5575200B2
公开(公告)日：2014-08-20
申请号：JP2012217019
申请日：2012-09-28
申请人：浜松ホトニクス株式会社
发明人：誠中野 , 耕司久野 , 哲也筬島 , 卓井上 , 正芳熊谷
IPC分类号： B23K26/53 , B23K26/00 , B23K26/046 , B23K26/064
摘要： PROBLEM TO BE SOLVED: To provide a laser processing apparatus and a method for manufacturing the same that can surely form a modified region which is to be a cutoff start point.SOLUTION: The laser beam L modulated by a reflection type spatial light modulator 203 is irradiated to a processing target 1 so that the aberration of the laser beam L concentrated inside the processing target 1 becomes a predetermined aberration or less. Therefore, the aberration of the laser beam L generated at the position where the condensing point P of the laser beam L is minimized a much as possible and the energy density the laser beam L at this position is enhanced so that a modified region 7 whose function as the cutoff starting point is high can be formed. Moreover, as a reflection type spatial light modulator 203 is used, utilization efficiency of the laser beam L can be improved compared with a transmissive type spatial light modulator. Such improvement of utilization efficiency of the laser beam L is especially important when the modified region 7, which is to be the cutoff starting point, is formed into a processing target 1 of tabular form.

7. 发明专利

JP5451238B2 Laser processing method 有权
公开(公告)号：JP5451238B2
公开(公告)日：2014-03-26
申请号：JP2009181003
申请日：2009-08-03
申请人：浜松ホトニクス株式会社
发明人：一弘渥美 , 雅春星川 , 浩之岩城 , 誠中野
IPC分类号： B23K26/064 , B23K26/00
CPC分类号： B23K26/40 , B23K2203/50
摘要： Provided is a laser machining method by which a precisely modified region can be stably formed in an object to be machined. The laser beam (L) is modulated by a spatial light modulator and is converged onto the object to be machined. Upon convergence, the position of the laser beam (L) is detected and the position of a modulation pattern (H) in the spatial light modulator is changed on the basis of the detected position of the laser beam (L). Therefore, even if the position of the laser beam (L) incident upon the spatial light modulator is deviated, or the like, it is possible to change the position of the modulation pattern (H) in accordance with the deviation, so that the laser beam (L) can be always appropriately modulated by the spatial light modulator. Thus, it is possible to stably suppress aberrations of the laser beam (L) converged onto the object to be machined.

8. 发明专利

JP5094995B2 Laser processing method 有权
公开(公告)号：JP5094995B2
公开(公告)日：2012-12-12
申请号：JP2011163539
申请日：2011-07-26
申请人：浜松ホトニクス株式会社
发明人：誠中野 , 卓井上 , 晴康伊藤 , 直也松本
IPC分类号： B23K26/38 , B23K26/00 , B23K26/40 , B23K101/40 , H01L21/301
CPC分类号： B23K26/0057 , B23K26/0676 , B23K26/40 , B23K2203/50
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method which can shorten takt time in laser beam machining, and a method for manufacturing semiconductor equipment. SOLUTION: A laser beam L is modulated by means of a reflective spatial light modulator. While the modulated laser beam L is focused on an object 1 to be machined, the laser beam L is moved on the object 1 to be machined. At this time, the laser beam L is modulated by the spatial light modulator so that reformed spots S and S are formed, with the laser beam L focused on two separate places along the direction D in which the laser beam L is moved on the object 1 to be machined. COPYRIGHT: (C)2011,JPO&INPIT

9. 发明专利

JP4402708B2 Laser processing method, laser processing device and a method of manufacturing the same 有权
标题翻译：空值
公开(公告)号：JP4402708B2
公开(公告)日：2010-01-20
申请号：JP2007203529
申请日：2007-08-03
申请人：浜松ホトニクス株式会社
发明人：誠中野 , 耕司久野 , 卓井上 , 正芳熊谷 , 哲也筬島
IPC分类号： B23K26/38 , B23K26/00 , B23K26/04 , B23K26/06 , B23K26/40 , B28D5/00 , C03B33/09
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/0057 , B23K26/046 , B23K26/0624 , B23K26/064 , B23K26/0861 , B23K26/128 , B23K26/40 , B23K26/402 , B23K26/53 , B23K2203/50 , B23K2203/56 , B28D1/221 , B28D5/00 , C03B33/0222 , H01L23/544 , H01L2223/54453 , Y10T29/49826
摘要： An object to be processed 1 is irradiated with a laser light L modulated by a reflection type spatial light modulator 203 such that aberration of the laser light L converged inside the object 1 becomes a predetermined aberration or less. Therefore, aberration of the laser light L generated at a position on which a converging point P of the laser light L is located is made as small as possible, to enhance the energy density of the laser light L at that position, which makes it possible to form a modified region 7 with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator 203 is used, it is possible to improve the utilization efficiency of the laser light L as compared with a transmissive type spatial light modulator. Such improvement of the utilization efficiency of the laser light L is particularly important in the case in which the modified region 7 serving as a starting point for cutting is formed in the plate-shaped object 1.
摘要翻译：用由反射型空间光调制器203调制的激光L照射待处理物体1，使得会聚在物体1内的激光L的像差成为预定像差或更小。因此，在激光L的会聚点P所在的位置处产生的激光L的像差尽可能地小，以增强该位置处的激光L的能量密度，这使得它成为可能形成作为切割起点的高功能的改质区域7。此外，由于使用反射型空间光调制器203，与透射型空间光调制器相比，可以提高激光L的利用效率。这样的激光L的利用效率的提高对于在板状物体1中形成作为切割起点的改质区域7的情况是特别重要的。

10. 发明专利

JPWO2014156692A1 レーザ加工装置及びレーザ加工方法审中-公开
标题翻译：一种激光加工设备和激光加工方法
公开(公告)号：JPWO2014156692A1
公开(公告)日：2017-02-16
申请号：JP2015508286
申请日：2014-03-13
申请人：浜松ホトニクス株式会社
发明人：大祐河口 , 大祐河口 , 中野　誠 , 誠中野 , 良太杉尾 , 良太杉尾 , 翼廣瀬 , 翼廣瀬 , 佳祐荒木 , 佳祐荒木
IPC分类号： B23K26/53 , B23K26/067 , H01L21/301
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/0057 , B23K26/03 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0853 , B23K26/53 , B23K2203/52 , B23K2203/54 , B23K2203/56
摘要：超短パルス光のレーザ光を加工対象物(1)に集光させることにより加工対象物(1)に改質領域(7)を形成する発明であって、レーザ光(L)を出射するレーザ光源(202)と、レーザ光源(202)により出射されたレーザ光(L)を加工対象物(1)に集光する集光光学系(4)と、集光光学系(4)により加工対象物(1)に集光されるレーザ光(L)に収差を付与する収差付与部(203)と、を備え、レーザ光(L)の光軸方向において、加工対象物(1)にレーザ光(L)を集光させることに起因して当該集光位置で発生する収差である集光発生収差の範囲を基準収差範囲とした場合、収差付与部(203)は、光軸方向において基準収差範囲よりも長い長尺範囲を収差の範囲として有し、且つ光軸方向におけるレーザ光の強度分布が長尺範囲にて連続する強弱を有するように、レーザ光に第1収差を付与することで、加工品質を向上させる。
摘要翻译：在对象形成改质区域的发明（1）（7）由聚焦超短脉冲光的激光束在所述对象（1），发射激光的激光（L）光源（202），通过在聚焦光由聚光光学系统聚光光学系统（4），处理对象工件（1）的激光源（202）（L）发射的激光束（4）对象激光束聚焦（1）的像差赋予单元赋予像差（L）（203）中，设置有上，在激光束（L）时，激光的光轴的方向上在所述对象（1）如果（L）由于被冷凝作为参考像差范围冷凝器中产生的像差的范围是其在光会聚位置产生的像差，像差赋予部（203），在光轴方向上的参考像差具有更长的长范围比其像差量的范围内，并且具有激光束的强度分布的强度与长范围在光轴方向上连续，以赋予在所述激光束的第一像差而在，提高加工质量。

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