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    • 4. 发明专利
    • Laser processing equipment and laser processing method
    • JP5322765B2
    • 2013-10-23
    • JP2009110906
    • 2009-04-30
    • 浜松ホトニクス株式会社
    • 晴康 伊藤直也 松本
    • B23K26/04B23K26/06B23K26/067G02B27/28
    • PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus that improves efficiency of utilizing a laser beam. SOLUTION: The laser beam machining apparatus 1 includes a laser beam source 10, a polarization control element 14, a spatial light phase modulator 18, and a condensing lens 40. The spatial light phase modulator 18 phase-modulates a first polarizing component h1 that is coincident with the polarization direction of the spatial light phase modulator, among the laser beams from the polarization control element 14, and outputs the phase-modulated first polarizing component h1 as modulated light hm, outputs a second polarizing component h2 whose polarization direction is orthogonal to the polarization direction of the spatial light phase modulator as non-modulated light ho without phase-modulating the second polarizing component h2, and controls the phase of the modulated light hm so that the condensing position B of the modulated light hm is different from the condensing position A of the non-modulated light ho. The polarization control element 14 changes polarization of the laser beam from the laser beam source 10 and controls the polarization of the laser beam that is made incident on the spatial light phase modulator 18 so that intensity of the modulated light hm and that of the non-modulated light ho are equal to or above the threshold value of a workpiece 50 respectively. COPYRIGHT: (C)2011,JPO&INPIT