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1. 发明申请

US20120038813A1 CAMERA MODULE 审中-公开
标题翻译：相机模块
公开(公告)号：US20120038813A1
公开(公告)日：2012-02-16
申请号：US13185769
申请日：2011-07-19
申请人： Young-Gyu JUNG , Yung-Cheol Kong , Tai-Hyun Eum , Han-Sung Ryu , Yu-Jung Tae
发明人： Young-Gyu JUNG , Yung-Cheol Kong , Tai-Hyun Eum , Han-Sung Ryu , Yu-Jung Tae
IPC分类号： H04N5/225
CPC分类号： H04N5/2257 , H04N5/2254
摘要： A camera module includes an image sensor package including an image sensor chip and a chip cover layer protecting the image sensor chip, a first lens disposed above the image sensor package to be coupled with an upper surface of the chip cover layer, a second lens disposed over the first lens, and an infrared blocking film formed in direct contact with the upper surface of the chip cover layer or an upper surface of the second lens.
摘要翻译：相机模块包括图像传感器封装，其包括图像传感器芯片和保护图像传感器芯片的芯片覆盖层，设置在图像传感器封装上方以与芯片覆盖层的上表面耦合的第一透镜，第二透镜设置以及形成为与芯片覆盖层的上表面或第二透镜的上表面直接接触的红外阻挡膜。

2. 发明申请

US20080073734A1 Camera module and method of fabricating the same 有权
标题翻译：相机模块及其制造方法
公开(公告)号：US20080073734A1
公开(公告)日：2008-03-27
申请号：US11806584
申请日：2007-06-01
申请人： Yung-cheol Kong
发明人： Yung-cheol Kong
IPC分类号： H01L31/0232 , H01L21/00
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14621 , H01L27/14623 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module. Example embodiment camera modules may include a semiconductor package including an image sensor chip. A transparent substrate may include an upper plate portion and/or a supporting portion defined by a cavity under the upper plate portion, and the supporting portion may be attached on the semiconductor package. The upper plate portion may be spaced from the semiconductor package by the supporting portion. A lens member may be attached to the upper plate portion of the transparent substrate. A stop member may be formed on a top side of the transparent substrate and may expose a portion of the lens member.
摘要翻译：示例性实施例可以提供包括可以整体形成的高分辨率透镜构件和/或图像传感器芯片的相机模块，以及制造相机模块的方法。示例性实施例相机模块可以包括包括图像传感器芯片的半导体封装。透明基板可以包括上板部分和/或由上板部分下方的空腔限定的支撑部分，并且支撑部分可以附接在半导体封装上。上板部分可以通过支撑部分与半导体封装物间隔开。透镜构件可以附接到透明基板的上板部分。止挡构件可以形成在透明基板的顶侧上并且可以暴露透镜构件的一部分。

3. 发明申请

US20060006486A1 Image sensor package and method of manufacturing the same 有权
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US20060006486A1
公开(公告)日：2006-01-12
申请号：US11150825
申请日：2005-06-10
申请人： Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
发明人： Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
IPC分类号： H01L31/0203
CPC分类号： H01L27/14625 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.
摘要翻译：图像传感器封装组装方法包括提供其上安装有多个图像传感器的基板; 提供具有多个壳体的壳体带，所述多个壳体对应于所述基板上的所述图像传感器的布置而布置，每个所述壳体具有对应于相应图像传感器的有效表面的孔，以及封闭相应图像传感器的边缘的空腔 ; 在将所述壳体条附接到所述基底上之后，附接透明盖板，其将所述壳体的所述孔密封在所述壳体条上; 并通过连续地切割透明盖，壳体条和基底来分离图像传感器封装。可以实现提高产量和生产效率。

4. 发明授权

US08902356B2 Image sensor module having image sensor package 有权
标题翻译：图像传感器模块具有图像传感器封装
公开(公告)号：US08902356B2
公开(公告)日：2014-12-02
申请号：US13049767
申请日：2011-03-16
申请人： Byoung-Rim Seo , Beoung-Ouk Min , Tae-Je Cho , Yung-Cheol Kong , Dong-Min Kim , Ji-Woong Park
发明人： Byoung-Rim Seo , Beoung-Ouk Min , Tae-Je Cho , Yung-Cheol Kong , Dong-Min Kim , Ji-Woong Park
IPC分类号： H04N5/225 , H01L27/146
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An image sensor module includes a circuit board, an image sensor package and an optical system. The circuit board has an upper surface and a lower surface, the substrate having a window. The image sensor package includes a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window. The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip.
摘要翻译：图像传感器模块包括电路板，图像传感器封装和光学系统。电路板具有上表面和下表面，基板具有窗口。图像传感器封装包括安装基板和安装在安装基板上的图像传感器芯片，图像传感器封装被粘附到电路板的下表面，使得图像传感器芯片通过窗口露出。光学系统设置在电路板的上表面上以将来自物体的光引导到图像传感器芯片。

5. 发明授权

US08053714B2 Image sensor module, camera module including the same and electronic device including the camera module 有权
标题翻译：图像传感器模块，包括相机的摄像机模块和包括相机模块的电子设备
公开(公告)号：US08053714B2
公开(公告)日：2011-11-08
申请号：US12361774
申请日：2009-01-29
申请人： Yung-Cheol Kong
发明人： Yung-Cheol Kong
IPC分类号： H01L27/00 , H01L29/66 , G01N21/86 , G02B7/02
CPC分类号： H04N5/2254 , G02B7/08 , H01L27/14618 , H01L27/14685 , H01L2224/13 , H04N5/2257 , H04N5/23212
摘要： An image sensor module may include an image sensor, a variable thickness member and a lens member. The image sensor may include a light receiver configured to receive a light. Further, a driving voltage may be applied to the image sensor. The variable thickness member may be arranged on the image sensor adjacent to the light receiver. Further, the variable thickness member may have a variable thickness along an optical axis of the light in accordance with the driving voltage through the image sensor.
摘要翻译：图像传感器模块可以包括图像传感器，可变厚度构件和透镜构件。图像传感器可以包括被配置为接收光的光接收器。此外，可以向图像传感器施加驱动电压。可变厚度构件可以布置在与光接收器相邻的图像传感器上。此外，可变厚度构件可以根据通过图像传感器的驱动电压沿着光的光轴具有可变的厚度。

6. 发明授权

US07972889B2 Methods of fabricating camera modules including aligning lenses on transparent substrates with image sensor chips 有权
标题翻译：制造相机模块的方法，包括在具有图像传感器芯片的透明基板上对准透镜
公开(公告)号：US07972889B2
公开(公告)日：2011-07-05
申请号：US12457322
申请日：2009-06-08
申请人： Yung-cheol Kong
发明人： Yung-cheol Kong
IPC分类号： H01L31/18
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14621 , H01L27/14623 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module. Example embodiment camera modules may include a semiconductor package including an image sensor chip. A transparent substrate may include an upper plate portion and/or a supporting portion defined by a cavity under the upper plate portion, and the supporting portion may be attached on the semiconductor package. The upper plate portion may be spaced from the semiconductor package by the supporting portion. A lens member may be attached to the upper plate portion of the transparent substrate. A stop member may be formed on a top side of the transparent substrate and may expose a portion of the lens member.
摘要翻译：示例性实施例可以提供包括可以整体形成的高分辨率透镜构件和/或图像传感器芯片的相机模块，以及制造相机模块的方法。示例性实施例相机模块可以包括包括图像传感器芯片的半导体封装。透明基板可以包括上板部分和/或由上板部分下方的空腔限定的支撑部分，并且支撑部分可以附接在半导体封装上。上板部分可以通过支撑部分与半导体封装物间隔开。透镜构件可以附接到透明基板的上板部分。止挡构件可以形成在透明基板的顶侧上并且可以暴露透镜构件的一部分。

7. 发明申请

US20120105706A1 PHOTOGRAPHIC MODULES AND METHODS OF FORMING THE SAME 审中-公开
标题翻译：摄影模块及其形成方法
公开(公告)号：US20120105706A1
公开(公告)日：2012-05-03
申请号：US13347921
申请日：2012-01-11
申请人： Yung-Cheol KONG
发明人： Yung-Cheol KONG
IPC分类号： H01L31/0232 , H04N5/225
CPC分类号： H04N5/2254 , H01L23/3121 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： Methods of forming camera modules include forming a chip structure including a molding pattern surrounding a chip and sidewalls of the chip. A lens module is formed, and the lens module is coupled to an upper part of the chip structure.
摘要翻译：形成相机模块的方法包括形成芯片结构，其包括围绕芯片的芯片和侧壁的模制图案。形成透镜模块，并且透镜模块耦合到芯片结构的上部。

8. 发明申请

US20120009718A1 IMAGE SENSOR MODULE, METHOD OF MANUFACTURING THE SAME, CAMERA MODULE INCLUDING THE SAME AND ELECTRONIC DEVICE INCLUDING THE CAMERA MODULE 有权
标题翻译：图像传感器模块，其制造方法，包括其的摄像机模块和包括摄像机模块的电子设备
公开(公告)号：US20120009718A1
公开(公告)日：2012-01-12
申请号：US13240158
申请日：2011-09-22
申请人： Yung-Cheol KONG
发明人： Yung-Cheol KONG
IPC分类号： H01L31/18
CPC分类号： H04N5/2254 , G02B7/08 , H01L27/14618 , H01L27/14685 , H01L2224/13 , H04N5/2257 , H04N5/23212
摘要： An image sensor module may include an image sensor, a variable thickness member and a lens member. The image sensor may include a light receiver configured to receive a light. Further, a driving voltage may be applied to the image sensor. The variable thickness member may be arranged on the image sensor adjacent to the light receiver. Further, the variable thickness member may have a variable thickness along an optical axis of the light in accordance with the driving voltage through the image sensor.
摘要翻译：图像传感器模块可以包括图像传感器，可变厚度构件和透镜构件。图像传感器可以包括被配置为接收光的光接收器。此外，可以向图像传感器施加驱动电压。可变厚度构件可以布置在与光接收器相邻的图像传感器上。此外，可变厚度构件可以根据通过图像传感器的驱动电压沿着光的光轴具有可变的厚度。

9. 发明授权

US07863702B2 Image sensor package and method of manufacturing the same 有权
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US07863702B2
公开(公告)日：2011-01-04
申请号：US11150825
申请日：2005-06-10
申请人： Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
发明人： Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
IPC分类号： H01L29/78
CPC分类号： H01L27/14625 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.
摘要翻译：图像传感器封装组装方法包括提供其上安装有多个图像传感器的基板; 提供具有多个壳体的壳体带，所述多个壳体对应于所述基板上的所述图像传感器的布置而布置，每个所述壳体具有对应于相应图像传感器的有效表面的孔，以及封闭相应图像传感器的边缘的空腔 ; 在将所述壳体条附接到所述基底上之后，附接透明盖板，其将所述壳体的所述孔密封在所述壳体条上; 并通过连续地切割透明盖，壳体条和基底来分离图像传感器封装。可以实现提高产量和生产效率。

10. 发明申请

US20100129954A1 PHOTOGRAPHIC MODULES AND METHODS OF FORMING THE SAME 审中-公开
标题翻译：摄影模块及其形成方法
公开(公告)号：US20100129954A1
公开(公告)日：2010-05-27
申请号：US12624551
申请日：2009-11-24
申请人： Yung-Cheol KONG
发明人： Yung-Cheol KONG
IPC分类号： H01L31/18 , H01L21/78
CPC分类号： H04N5/2254 , H01L23/3121 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： Methods of forming camera modules include forming a chip structure including a molding pattern surrounding a chip and sidewalls of the chip. A lens module is formed, and the lens module is coupled to an upper part of the chip structure.
摘要翻译：形成相机模块的方法包括形成芯片结构，其包括围绕芯片的芯片和侧壁的模制图案。形成透镜模块，并且透镜模块耦合到芯片结构的上部。

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