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1. 发明授权

US09129949B2 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US09129949B2
公开(公告)日：2015-09-08
申请号：US13881654
申请日：2011-02-09
申请人： Shinsuke Asada , Kenjiro Nagao , Dai Nakajima , Yuetsu Watanabe , Yoshihito Asao , Takuya Oga , Masaki Kato
发明人： Shinsuke Asada , Kenjiro Nagao , Dai Nakajima , Yuetsu Watanabe , Yoshihito Asao , Takuya Oga , Masaki Kato
IPC分类号： H01L23/495 , H01L23/12 , H01L23/00 , H01L23/36 , H01L23/31
CPC分类号： H01L23/49568 , H01L23/3107 , H01L23/36 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06051 , H01L2224/06181 , H01L2224/291 , H01L2224/2919 , H01L2224/40137 , H01L2224/40139 , H01L2224/40247 , H01L2224/4103 , H01L2224/41051 , H01L2224/45015 , H01L2224/45124 , H01L2224/48139 , H01L2224/48247 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83411 , H01L2224/83455 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A power semiconductor module (100) includes: an electrode plate (2) in which a body portion (2a) and an external connection terminal portion (2b) are integrally formed, and the body portion (2a) is arranged on the same flat surface; a semiconductor chip (1) mounted on one surface (mounting surface) (2c) of the body portion (2a); and a resin package (3) in which the other surface (heat dissipation surface) (2d) of the body portion (2a) is exposed, and the body portion (2a) of the electrode plate (2) and the semiconductor chip (1) are sealed with resin. The heat dissipation surface (2d) is the same surface as the bottom (3a) of the resin package (3); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.
摘要翻译：功率半导体模块（100）包括：一体形成有主体部分（2a）和外部连接端子部分（2b）的电极板（2），并且主体部分（2a）布置在同一平面 ; 安装在主体部分（2a）的一个表面（安装表面）（2c）上的半导体芯片（1）; 和主体部（2a）的另一面（散热面）（2d）露出的树脂封装体（3）和电极板（2）的主体部分（2a）和半导体芯片（1））用树脂密封。散热面（2d）与树脂封装（3）的底部（3a）相同。因此，散热性和可靠性得到改善，并且可以实现尺寸的减小。

2. 发明申请

US20120236503A1 POWER SEMICONDUCTOR MODULE AND ITS ATTACHMENT STRUCTURE 有权
标题翻译：功率半导体模块及其附件结构
公开(公告)号：US20120236503A1
公开(公告)日：2012-09-20
申请号：US13204226
申请日：2011-08-05
申请人： Shinsuke ASADA , Yuetsu WATANABE , Yoshihito ASAO , Kenjiro NAGAO
发明人： Shinsuke ASADA , Yuetsu WATANABE , Yoshihito ASAO , Kenjiro NAGAO
IPC分类号： H05K7/20
CPC分类号： H01L23/49568 , H01L23/3107 , H01L23/4334 , H01L23/49562 , H01L23/49575 , H01L2924/0002 , H01L2924/00
摘要： A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.
摘要翻译：功率半导体模块包括：安装功率半导体器件的第一金属基板; 没有安装功率半导体器件的第二金属基板; 以及密封第一金属基板和第二金属基板的电绝缘树脂封装。第一金属基板的与功率半导体装置的安装面相反一侧的背面被制成露出树脂封装外部，形成散热面。

3. 发明申请

US20130221516A1 POWER SEMICONDUCTOR MODULE 有权
标题翻译：功率半导体模块
公开(公告)号：US20130221516A1
公开(公告)日：2013-08-29
申请号：US13881654
申请日：2011-02-09
申请人： Shinsuke Asada , Kenjiro Nagao , Dai Nakajima , Yuetsu Watanabe , Yoshihito Asao , Takuya Oga , Masaki Kato
发明人： Shinsuke Asada , Kenjiro Nagao , Dai Nakajima , Yuetsu Watanabe , Yoshihito Asao , Takuya Oga , Masaki Kato
IPC分类号： H01L23/495
CPC分类号： H01L23/49568 , H01L23/3107 , H01L23/36 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06051 , H01L2224/06181 , H01L2224/291 , H01L2224/2919 , H01L2224/40137 , H01L2224/40139 , H01L2224/40247 , H01L2224/4103 , H01L2224/41051 , H01L2224/45015 , H01L2224/45124 , H01L2224/48139 , H01L2224/48247 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83411 , H01L2224/83455 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A power semiconductor module (100) includes: an electrode plate (2) in which a body portion (2a) and an external connection terminal portion (2b) are integrally formed, and the body portion (2a) is arranged on the same flat surface; a semiconductor chip (1) mounted on one surface (mounting surface) (2c) of the body portion (2a); and a resin package (3) in which the other surface (heat dissipation surface) (2d) of the body portion (2a) is exposed, and the body portion (2a) of the electrode plate (2) and the semiconductor chip (1) are sealed with resin. The heat dissipation surface (2d) is the same surface as the bottom (3a) of the resin package (3); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.
摘要翻译：功率半导体模块（100）包括：一体形成有主体部分（2a）和外部连接端子部分（2b）的电极板（2），并且主体部分（2a）布置在同一平面 ; 安装在主体部分（2a）的一个表面（安装表面）（2c）上的半导体芯片（1）; 和主体部（2a）的另一面（散热面）（2d）露出的树脂封装体（3）和电极板（2）的主体部分（2a）和半导体芯片（1））用树脂密封。散热面（2d）与树脂封装（3）的底部（3a）相同。因此，散热性和可靠性得到改善，并且可以实现尺寸的减小。

4. 发明授权

US06667626B2 Probe card, and testing apparatus having the same 失效
公开(公告)号：US06667626B2
公开(公告)日：2003-12-23
申请号：US10080582
申请日：2002-02-25
申请人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yuetsu Watanabe
发明人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yuetsu Watanabe
IPC分类号： G01R3102
CPC分类号： G01R1/07342 , G01R1/0675 , G01R1/07385
摘要： Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.

5. 发明授权

US6078241A Noise absorber 有权
标题翻译：消声器
公开(公告)号：US6078241A
公开(公告)日：2000-06-20
申请号：US263769
申请日：1999-03-05
申请人： Yuetsu Watanabe , Hiroyuki Uemura
发明人： Yuetsu Watanabe , Hiroyuki Uemura
IPC分类号： H01F27/06 , H01F17/06 , H03H1/00 , H05K9/00 , H01F27/02 , H01F27/26
CPC分类号： H03H1/0007 , H05K9/0066
摘要： A noise absorber capable of preventing a cable from becoming damaged with a high degree of reliability while demonstrating outstanding noise absorbing characteristics is provided with a cover 1 and a pair of ferrites 21 and 22. The cover 1 is constituted through the combination of a first cover 11 and a second cover 12. The first cover 11 is provided with a ferrite storage portion 110 and a cable storage portion 111. The second cover 12 is provided with a ferrite storage portion 120 and a cable storage portion 121 . The ferrite storage portion 110 is formed at an internal surface of the first cover 11 and the ferrite storage portion 120 is formed at an internal surface of the second cover 12. The cable storage portion 111 is formed adjacent to the ferrite storage portion 110 at a side thereof, whereas the cable storage portion 121 is formed adjacent to the ferrite storage portion 120 at a side thereof. The pair of ferrites 21 and 22 are provided in the ferrite storage portions 110 and 120 at the first cover 11 and the second cover 12 respectively and are combined so as to form between them a cable passage constituted of indented grooves 211 and 222. The indented grooves 211 and 222 and the cable storage portions 111 and 121 constitute a continuous cable guide passage.
摘要翻译：具有能够防止电缆以高可靠性破坏的噪音吸收器，同时具有出色的噪音吸收特性，其具有盖1和一对铁氧体21和22.盖1通过组合第一盖 11和第二盖12.第一盖11设置有铁氧体存储部110和电缆存储部111.第二盖12设置有铁氧体存储部120和电缆存储部121。铁氧体存储部110形成在第一盖11的内表面，铁氧体存储部120形成在第二盖12的内表面。电缆存储部111与铁氧体存储部110相邻地形成在而电缆存储部分121在其一侧与铁氧体存储部分120相邻地形成。一对铁氧体21和22分别设置在第一盖11和第二盖12的铁氧体存储部分110和120中，并且在它们之间形成由凹槽211和222构成的电缆通道。缩进槽211和222以及电缆存储部分111和121构成连续的电缆引导通道。

6. 发明授权

US5920250A Noise absorber 失效
标题翻译：消声器
公开(公告)号：US5920250A
公开(公告)日：1999-07-06
申请号：US041039
申请日：1998-03-12
申请人： Yuetsu Watanabe , Hiroyuki Uemura
发明人： Yuetsu Watanabe , Hiroyuki Uemura
IPC分类号： H01F27/06 , H01F17/06 , H03H1/00 , H05K9/00 , H01F27/02 , H01F27/26
CPC分类号： H03H1/0007 , H05K9/0066
摘要： A noise absorber capable of preventing a cable from becoming damaged with a high degree of reliability while demonstrating outstanding noise absorbing characteristics is provided with a cover 1 and a pair of ferrites 21 and 22. The cover 1 is constituted through the combination of a first cover 11 and a second cover 12. The first cover 11 is provided with a ferrite storage portion 110 and a cable storage portion 111. The second cover 12 is provided with a ferrite storage portion 120 and a cable storage portion 121. The ferrite storage portion 110 is formed at an internal surface of the first cover 11 and the ferrite storage portion 120 is formed at an internal surface of the second cover 12. The cable storage portion 111 is formed adjacent to the ferrite storage portion 110 at a side thereof, whereas the cable storage portion 121 is formed adjacent to the ferrite storage portion 120 at a side thereof. The pair of ferrites 21 and 22 are provided in the ferrite storage portions 110 and 120 at the first cover 11 and the second cover 12 respectively and are combined so as to form between them a cable passage constituted of indented grooves 211 and 222. The indented grooves 211 and 222 and the cable storage portions 111 and 121 constitute a continuous cable guide passage.
摘要翻译：具有能够防止电缆以高可靠性破坏的噪音吸收器，同时具有出色的噪音吸收特性，其具有盖1和一对铁氧体21和22.盖1通过组合第一盖 11和第二盖12.第一盖11设置有铁氧体存储部110和电缆存储部111.第二盖12设置有铁氧体存储部120和电缆存储部121.铁氧体存储部110 形成在第一盖11的内表面，并且铁氧体存储部分120形成在第二盖12的内表面。电缆存储部分111在其一侧与铁氧体存储部分110相邻地形成，而电缆存储部分121在其一侧与铁氧体存储部分120相邻地形成。一对铁氧体21和22分别设置在第一盖11和第二盖12的铁氧体存储部分110和120中，并且在它们之间形成由凹槽211和222构成的电缆通道。缩进槽211和222以及电缆存储部分111和121构成连续的电缆引导通道。

7. 发明授权

US08749977B2 Power semiconductor module and its attachment structure 有权
标题翻译：功率半导体模块及其附件结构
公开(公告)号：US08749977B2
公开(公告)日：2014-06-10
申请号：US13204226
申请日：2011-08-05
申请人： Shinsuke Asada , Yuetsu Watanabe , Yoshihito Asao , Kenjiro Nagao
发明人： Shinsuke Asada , Yuetsu Watanabe , Yoshihito Asao , Kenjiro Nagao
IPC分类号： H05K7/20 , H01L23/10
CPC分类号： H01L23/49568 , H01L23/3107 , H01L23/4334 , H01L23/49562 , H01L23/49575 , H01L2924/0002 , H01L2924/00
摘要： A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.
摘要翻译：功率半导体模块包括：安装功率半导体器件的第一金属基板; 没有安装功率半导体器件的第二金属基板; 以及密封第一金属基板和第二金属基板的电绝缘性树脂封装。第一金属基板的与功率半导体装置的安装面相反一侧的背面被制成露出树脂封装外部，形成散热面。

8. 发明授权

US06885204B2 Probe card, and testing apparatus having the same 失效
标题翻译：探头卡和测试装置具有相同的功能
公开(公告)号：US06885204B2
公开(公告)日：2005-04-26
申请号：US10649930
申请日：2003-08-28
申请人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yuetsu Watanabe
发明人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yuetsu Watanabe
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , H01L21/66 , G01R31/02
CPC分类号： G01R1/07342 , G01R1/0675 , G01R1/07385
摘要： Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.
摘要翻译：多个探针被布置成与一个具有探针卡的电极焊盘接触，多个探针针头以相同的电位并联连接，并配置成使得流过探针的电流量至少减半，从而减少焦耳热产生的热量，并防止组成电极焊盘的铝的熔化。因此，可以提供一种探针卡，其中熔融材料对探针的粘附被抑制，并且其中防止由于熔化和粘附的材料的氧化引起的增加的接触电阻。

9. 发明授权

US06515230B1 Noise absorber and case for noise absorber 有权
标题翻译：噪音消除器和噪音吸收器
公开(公告)号：US06515230B1
公开(公告)日：2003-02-04
申请号：US09517573
申请日：2000-03-02
申请人： Masaharu Hirakawa , Yuetsu Watanabe
发明人： Masaharu Hirakawa , Yuetsu Watanabe
IPC分类号： H01F2702
CPC分类号： H01F17/06 , H01F27/263 , H01F2017/065 , H04B15/02 , H05K5/0013 , H05K9/0018
摘要： A case for a noise absorber including a first case member and a second case member. The first case member includes a first cable guide and a second cable guide at opposite sides and a first core housing provided therebetween. The second case member includes a third cable guide and a fourth cable guide at opposite sides and a second core housing provided therebetween. The first case member and the second case member are interlocked and a hinge arrangement movably connects one of the sides of the first case member with one of the sides of the second case member. A magnetic core having a cable through passage can be housed inside the case to provide a noise absorber.
摘要翻译：一种用于包括第一壳体构件和第二壳体构件的噪声抑制器的壳体。第一壳体构件包括在相对侧的第一缆索引导件和第二缆索引导件，以及设置在其间的第一芯体壳体。第二壳体构件包括在相对侧的第三缆索引导件和第四缆索引导件，以及设置在其间的第二芯体壳体。第一壳体构件和第二壳体构件互锁，并且铰链装置将第一壳体构件的一个侧面与第二壳体构件的侧面中的一个可移动地连接。具有电缆穿过通道的磁芯可以容纳在壳体内以提供噪声吸收器。

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