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1. 发明申请

US20080096321A1 SEMICONDUCTOR CHIP PACKAGE MANUFACTURING METHOD AND STRUCTURE THEREOF 有权
标题翻译：半导体芯片封装制造方法及结构
公开(公告)号：US20080096321A1
公开(公告)日：2008-04-24
申请号：US11871319
申请日：2007-10-12
申请人： Chian-Chi LIN , Chih-Huang CHANG , Yueh-Lung LIN
发明人： Chian-Chi LIN , Chih-Huang CHANG , Yueh-Lung LIN
IPC分类号： H01L21/02
CPC分类号： H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L2224/02371 , H01L2924/15311
摘要： A semiconductor chip package manufacturing method and a structure thereof are provided. The manufacturing method includes: providing a base having an image sensor chip and an encapsulant, in which the image sensor chip has pads and an active area; placing a transparent insulator on the active area; forming an insulation layer on an upper surface of the base; opening a plurality of openings to expose the pads; forming a plurality of through holes penetrating the insulation layer and the encapsulant outside of the image sensor chips; forming a metal layer on surfaces of the insulation layer, the openings, the pads and the through holes, and on a lower surface of the base, so as to extend the pads to the lower surface of the base; patterning the metal layer to expose a top area of the transparent insulator and remove a partial area of the metal layer on the lower surface of the base to form contacts; and sawing the base to form a package structure containing a single image sensor chip.
摘要翻译：提供半导体芯片封装的制造方法及其结构。该制造方法包括：提供具有图像传感器芯片和密封剂的基座，其中图像传感器芯片具有焊盘和有源区域; 在有源区域放置透明绝缘体; 在所述基座的上表面上形成绝缘层; 打开多个开口以露出所述垫; 在所述图像传感器芯片外部形成穿过所述绝缘层和所述密封剂的多个通孔; 在绝缘层，开口，焊盘和通孔的表面上以及在基底的下表面上形成金属层，以将焊盘延伸到基座的下表面; 图案化金属层以暴露透明绝缘体的顶部区域并去除基底的下表面上的金属层的部分区域以形成接触; 并锯切基底以形成包含单个图像传感器芯片的封装结构。

2. 发明授权

US06768332B2 Semiconductor wafer and testing method for the same 有权
公开(公告)号：US06768332B2
公开(公告)日：2004-07-27
申请号：US10385565
申请日：2003-03-12
申请人： Yueh Lung Lin , Ho Ming Tong , Yao Hsin Feng , Su Tao , Chi Cheng Pan , Kuo Pin Yang , Sung Ching Hung
发明人： Yueh Lung Lin , Ho Ming Tong , Yao Hsin Feng , Su Tao , Chi Cheng Pan , Kuo Pin Yang , Sung Ching Hung
IPC分类号： G10R3126
CPC分类号： G01R31/2884
摘要： A semiconductor wafer includes a plurality of areas and an array of dice disposed within each of the areas. The feature of the present invention is that at least two fiducial marks are disposed in each of the areas. The present invention further provides a method of testing a sawed semiconductor wafer.

3. 发明授权

US07790505B2 Semiconductor chip package manufacturing method and structure thereof 有权
标题翻译：半导体芯片封装制造方法及其结构
公开(公告)号：US07790505B2
公开(公告)日：2010-09-07
申请号：US11871319
申请日：2007-10-12
申请人： Chian-Chi Lin , Chih-Huang Chang , Yueh-Lung Lin
发明人： Chian-Chi Lin , Chih-Huang Chang , Yueh-Lung Lin
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L2224/02371 , H01L2924/15311
摘要： A semiconductor chip package manufacturing method and a structure thereof are provided. The manufacturing method includes: providing a base having an image sensor chip and an encapsulant, in which the image sensor chip has pads and an active area; placing a transparent insulator on the active area; forming an insulation layer on an upper surface of the base; opening a plurality of openings to expose the pads; forming a plurality of through holes penetrating the insulation layer and the encapsulant outside of the image sensor chips; forming a metal layer on surfaces of the insulation layer, the openings, the pads and the through holes, and on a lower surface of the base, so as to extend the pads to the lower surface of the base; patterning the metal layer to expose a top area of the transparent insulator and remove a partial area of the metal layer on the lower surface of the base to form contacts; and sawing the base to form a package structure containing a single image sensor chip.
摘要翻译：提供半导体芯片封装的制造方法及其结构。该制造方法包括：提供具有图像传感器芯片和密封剂的基座，其中图像传感器芯片具有焊盘和有源区域; 在有源区域放置透明绝缘体; 在所述基座的上表面上形成绝缘层; 打开多个开口以露出所述垫; 在所述图像传感器芯片外部形成穿过所述绝缘层和所述密封剂的多个通孔; 在绝缘层，开口，焊盘和通孔的表面上以及在基底的下表面上形成金属层，以将焊盘延伸到基座的下表面; 图案化金属层以暴露透明绝缘体的顶部区域并去除基底的下表面上的金属层的部分区域以形成接触; 并锯切基底以形成包含单个图像传感器芯片的封装结构。

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