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    • 5. 发明申请
    • WIRELESS CHIP AND MANUFACTURING METHOD THEREOF
    • 无线芯片及其制造方法
    • US20120322212A1
    • 2012-12-20
    • US13596376
    • 2012-08-28
    • Koji DAIRIKIJunya MARUYAMATomoko TAMURAEiji SUGIYAMAYoshitaka DOZEN
    • Koji DAIRIKIJunya MARUYAMATomoko TAMURAEiji SUGIYAMAYoshitaka DOZEN
    • H01L21/56
    • H01L27/1255H01L29/78621H01L29/78627H01L29/78648
    • It is an object of the present invention to reduce the cost of a wireless chip, further, to reduce the cost of a wireless chip by enabling the mass production of a wireless chip, and furthermore, to provide a downsized and lightweight wireless chip. A wireless chip in which a thin film integrated circuit peeled from a glass substrate or a quartz substrate is formed between a first base material and a second base material is provided according to the invention. As compared with a wireless chip formed from a silicon substrate, the wireless chip according to the invention realizes downsizing, thinness, and lightweight. The thin film integrated circuit included in the wireless chip according to the invention at least has an n-type thin film transistor having an LDD (Lightly Doped Drain) structure, a p-type thin film transistor having a single drain structure, and a conductive layer functioning as an antenna.
    • 本发明的目的在于降低无线芯片的成本,并且通过实现无线芯片的批量生产,进一步降低无线芯片的成本,此外,提供小型化,轻量化的无线芯片。 根据本发明,提供一种其中从玻璃基板或石英基板剥离的薄膜集成电路形成在第一基材和第二基材之间的无线芯片。 与由硅基板形成的无线芯片相比,根据本发明的无线芯片实现了小型化,薄型化和轻量化。 包括在根据本发明的无线芯片中的薄膜集成电路至少具有具有LDD(轻掺杂漏极)结构的n型薄膜晶体管,具有单个漏极结构的p型薄膜晶体管和导电 层作为天线起作用。