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    • 1. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US07968399B2
    • 2011-06-28
    • US12106088
    • 2008-04-18
    • Yoshinori KitamuraShigeki Sugimoto
    • Yoshinori KitamuraShigeki Sugimoto
    • H01L21/8249
    • H01L27/11521H01L21/28273H01L27/115H01L27/11524
    • Disclosed is a semiconductor device comprising a semiconductor substrate including first and second element-formation regions partitioned by an isolation trench, first and second lower gate insulating films formed on the first and second element-formation regions, first and second floating gates formed on the first and second lower gate insulating films, an isolation insulating film formed at least in the isolation trench and has a depression formed in an upper surface thereof, an upper gate insulating film formed on the first and second floating gates, and a control gate line including an opposed portion opposed to the first and second floating gates, with the upper gate insulating film being interposed, and a portion located inside the depression, the first floating gate including a side surface opposed to the second floating gate and entirely aligns with a side surface included in the first element-formation region and defined by the isolation trench.
    • 公开了一种半导体器件,包括半导体衬底,该半导体衬底包括由隔离沟槽分隔开的第一和第二元件形成区域,形成在第一和第二元件形成区域上的第一和第二下部栅极绝缘膜,形成在第一和第二元件形成区域上的第一和第二浮置栅极 和第二下栅极绝缘膜,隔离绝缘膜,至少形成在所述隔离沟槽中,并且在其上表面上形成有凹部,形成在所述第一和第二浮栅上的上栅极绝缘膜,以及控制栅极线, 与第一和第二浮动栅极相对的相对部分,其中上部栅极绝缘膜被插入,并且位于凹部内部的部分,第一浮动栅极包括与第二浮动栅极相对的侧表面,并且与包括的侧表面完全对准 在第一元件形成区域中并由隔离沟槽限定。
    • 3. 发明申请
    • Casing Structure for Refrigeration System and Method for Producing Casing Therefor
    • 制冷系统套管结构及其套管生产方法
    • US20090241588A1
    • 2009-10-01
    • US11992662
    • 2006-09-29
    • Yoshinori KitamuraHiroki Ishihara
    • Yoshinori KitamuraHiroki Ishihara
    • F25D11/00B21D53/06
    • F25D23/065B65D90/00F25D23/067Y10T29/49359
    • A component mounting plate (s1) of a casing for a refrigeration system includes an inner sub-plate (2), an outer sub-plate (3) and a heat insulating layer (4) filled with a heat insulating material, such as urethane. The inner sub-plate (2) is formed with a mounting hole (31) through which a mounting bolt (30) for mounting a component (16) to the inner sub-plate (2) passes. The heat insulating layer (4) contains a nut (40) disposed to correspond to the mounting hole (31) and an L-piece (41) disposed to correspond to the mounting hole (31) and including an extension (43) and a seat (42) with the nut (40) welded thereto. The L-piece is disposed in the heat insulating layer (4) with the seat (42) in contact with the inner sub-plate (2) and the extension (43) extending towards the outer sub-plate (3).
    • 用于制冷系统的壳体的部件安装板(s1)包括内部副板(2),外部副板(3)和填充有绝热材料(例如聚氨酯)的绝热层(4) 。 内部副板(2)形成有安装孔(31),用于将部件(16)安装到内侧副板(2)的安装螺栓(30)穿过该安装孔。 绝热层(4)包括与安装孔(31)相对设置的螺母(40)和与安装孔(31)对应设置的L形件(41),其包括延伸部(43)和 座(42)与螺母(40)焊接在一起。 L形件设置在绝热层(4)中,座(42)与内子板(2)接触,延伸部(43)朝向外子板(3)延伸。
    • 7. 发明授权
    • Ultra-high multi-story buildings and construction thereof
    • 超高层多层建筑及其建筑
    • US5377465A
    • 1995-01-03
    • US820887
    • 1992-03-18
    • Takuji KoboriShigeru BanToshihiko KubotaOsamu NohiraNorihide KoshikaKoji KondoSadaaki MasudaYoshinori KitamuraHideo TanakaHiroomi SatoA. Scott Howe
    • Takuji KoboriShigeru BanToshihiko KubotaOsamu NohiraNorihide KoshikaKoji KondoSadaaki MasudaYoshinori KitamuraHideo TanakaHiroomi SatoA. Scott Howe
    • E04B1/34E04H1/00
    • E04B1/3404
    • An extra super multi-story building having one piece of extra super multi-story of about 200 story construction, two pieces of extra super multi-stories of about 150 story construction and one piece of extra super multi-story of about 100 story construction. Each extra super multi-story includes two through four pieces of tower-like super multi-stories of about 50 story construction and of about 50 m in diameter (floor area: about 200 m.sup.2 /story). A sky lobby is provided about every 50 stories connecting the extra super multi-stories. Four shuttle elevators lead from the ground to the sky lobbies, and a sightseeing tower and high-rise garden (sky dome) are provided at the rooftop of the extra super multi-story building. Main facilities such as offices, hotels and residences are arranged in each extra multi-story. In addition, in order to be able to construct the extra super multi-story building, the individual extra super multi-story buildings are monolithically connected with one another by girders every several ten stories, and a space truss is constructed on the outside of each extra super multi-story building.
    • PCT No.PCT / JP91 / 00341 Sec。 371日期:1992年3月18日 102(e)1992年3月18日PCT 1991年3月13日PCT公布。 WO91 / 18161 PCT出版物 日期:1991年11月28日。超级多层建筑有超过200层的超级多层建筑,超过150层的超级多层次的超级多层建筑, 大概100层建筑故事。 每个额外的超级多层楼包括大约50层建筑和直径约50米(占地面积:约200平方米/层)的两层至四层塔式超级多层楼。 每隔50层提供一个天空大厅,连接超级多层次的超级故事。 四座穿梭电梯从地面到天空大堂,另外还有超级多层建筑的屋顶设有观光塔和高层花园(天空圆顶)。 主要设施如办公室,酒店和住宅都安排在每个额外的多层次。 另外,为了能够构建超级多层建筑,个别的超级多层建筑每隔十层就通过大梁相互整体连接起来,并在每个楼层的外面建造一个空间桁架 超级多层建筑。
    • 9. 发明授权
    • LED drive circuit
    • LED驱动电路
    • US08604716B2
    • 2013-12-10
    • US12625647
    • 2009-11-25
    • Hiromasa ItoYoshinori Kitamura
    • Hiromasa ItoYoshinori Kitamura
    • G05F1/00
    • H05B33/0821
    • An LED drive circuit that sufficiently exhibits the performance of an LED element to obtain a favorable luminance at room temperature, includes a constant-current circuit including an LED element, a constant-current output unit, and a temperature sensing element having a negative resistance-temperature coefficient. The LED element is connected to the constant-current output unit in series. The constant-current output unit is connected to the LED element in parallel. Due to changes in the resistance value of the constant-current output unit caused by changes in temperature, the value of a current passing through the LED element is increased at room temperature and the value of a current passing through the temperature sensing element is reduced at high temperature.
    • 充分展现LED元件的性能以在室温下获得良好亮度的LED驱动电路包括具有LED元件,恒流输出单元和具有负电阻的恒温电流输出单元的恒流电路, 温度系数。 LED元件串联连接到恒流输出单元。 恒流输出单元并联连接到LED元件。 由于由温度变化引起的恒流输出单元的电阻值的变化,通过LED元件的电流值在室温下增加,并且通过温度感测元件的电流值减小为 高温。