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1. 发明申请

US20050029094A1 Tungsten sputtering target and method of manufacturing the target 有权
标题翻译：钨溅射靶和制造目标的方法
公开(公告)号：US20050029094A1
公开(公告)日：2005-02-10
申请号：US10363257
申请日：2001-09-03
申请人： Koichi Watanabe , Yoichiro Yabe , Takashi Ishigami , Takashi Watanabe , Hitoshi Aoyama , Yasuo Kohsaka , Yukinobu Suzuki
发明人： Koichi Watanabe , Yoichiro Yabe , Takashi Ishigami , Takashi Watanabe , Hitoshi Aoyama , Yasuo Kohsaka , Yukinobu Suzuki
IPC分类号： C23C14/34 , C23C14/00
CPC分类号： C23C14/3414
摘要： The tungsten sputtering target of the present invention is characterized in that a half band width of a peak corresponding to a crystal plane (110) of the target is 0.35 or less when a surface of the target to be sputtered is analyzed by X-ray diffraction. Further, the method of manufacturing the tungsten sputtering target of the present invention is characterized by comprising the steps of: pressing a high purity tungsten powder to form a pressed compact; sintering the pressed compact to form a sintered body; working the sintered body to obtain a shape of a target; subjecting the target to a grinding work of at least one of rotary grinding and polishing; and subjecting the target to a finishing work of at least one of etching and reverse sputtering. According to the above structure, there can be provided a tungsten sputtering target and method of manufacturing the target capable of improving the in-plain uniformity in thickness of the W thin film formed on a substrate, and capable of effectively reducing the generation of the particles.
摘要翻译：本发明的钨溅射靶的特征在于，当通过X射线衍射分析待溅射靶的表面时，对应于靶的晶面（110）的峰的半带宽为0.35以下。此外，本发明的钨溅射靶的制造方法的特征在于包括以下步骤：将高纯度钨粉按压以形成压制成型体; 烧结压制成型体的烧结体; 加工烧结体以获得靶的形状; 使目标进行旋转研磨和抛光中的至少一个的研磨工作; 并对靶进行蚀刻和反溅镀中的至少一种的精加工。根据上述结构，可以提供一种钨溅射靶和能够提高形成在基板上的W薄膜的厚度均匀性均匀化的靶的方法，能够有效地减少粒子的产生。

2. 发明授权

US07718117B2 Tungsten sputtering target and method of manufacturing the target 有权
标题翻译：钨溅射靶和制造目标的方法
公开(公告)号：US07718117B2
公开(公告)日：2010-05-18
申请号：US10363257
申请日：2001-09-03
申请人： Koichi Watanabe , Yoichiro Yabe , Takashi Ishigami , Takashi Watanabe , Hitoshi Aoyama , Yasuo Kohsaka , Yukinobu Suzuki
发明人： Koichi Watanabe , Yoichiro Yabe , Takashi Ishigami , Takashi Watanabe , Hitoshi Aoyama , Yasuo Kohsaka , Yukinobu Suzuki
IPC分类号： B22F1/02 , C23C14/00
CPC分类号： C23C14/3414
摘要： A method of manufacturing a tungsten sputtering target includes pressing a high purity tungsten powder to form a pressed compact, first sintering the pressed compact at a temperature of 1450-1700° C. for one hour or longer after the pressed compact is heated at a heating-up rate of 2-5° C./min on the way to a maximum sintering temperature, second sintering the pressed compact to form a sintered body at a temperature of 1900° C. or higher for 5 hours or longer, working the sintered body to obtain a shape of a target, subjecting the target to a grinding work of at least one of rotary grinding and polishing, and subjecting the target to a finishing work of at least one of etching and reverse sputtering.
摘要翻译：制造钨溅射靶的方法包括：将高纯度钨粉压制成压制成形体，首先在压制成型体在加热加热后，在1450-1700℃的温度下烧结1小时以上的压制成形体在最高烧结温度的途中为2-5℃/分钟，在1900℃以上的温度下烧结压制成型体以烧结体5小时以上，加工烧结体以获得目标的形状，对所述目标进行旋转研磨和抛光中的至少一个的研磨加工，以及对所述靶进行蚀刻和反向溅射中的至少一种的精加工。

3. 发明授权

US06855236B2 Components for vacuum deposition apparatus and vacuum deposition apparatus therewith, and target apparatus 有权
标题翻译：用于真空沉积设备的组件和其真空沉积设备，以及目标设备
公开(公告)号：US06855236B2
公开(公告)日：2005-02-15
申请号：US09926041
申请日：2000-12-28
申请人： Michio Sato , Takashi Nakamura , Yoichiro Yabe
发明人： Michio Sato , Takashi Nakamura , Yoichiro Yabe
IPC分类号： C23C4/00 , C23C4/02 , C23C4/08 , C23C4/18 , C23C14/56 , C23C16/44 , C23C16/00 , C23C14/34
CPC分类号： H01J37/32477 , C23C4/00 , C23C4/02 , C23C4/08 , C23C4/18 , C23C14/564 , C23C16/4404 , H01J37/32559
摘要： A component for a vacuum deposition apparatus comprises a component body and a spray deposit formed on a surface of a component body. A spray deposit has surface roughness in which a mean spacing S of tops of local peak of profile is in the range from 50 to 150 μm, and distances to a bottom of profile valley line Rv and to a top of profile peak line are in the ranges from 20 to 70 μm, respectively. Furthermore, a spray deposit has a low hardness coat selected from an Al base spray deposit of Hv 30 (Vickers hardness) or less, a Cu base spray deposit of Hv 100 or less, a Ni base spray deposit of Hv 200 or less, a Ti base spray deposit of Hv 300 or less, a Mo base spray deposit of Hv 300 or less and a W base spray deposit of Hv 500 or less. Such component for a vacuum deposition apparatus may suppress, with stability and effectiveness, peeling of deposition material adhering on a component during deposition. In addition, the number of apparatus cleaning and of exchange of components may be largely reduced. A target comprises a similar spray deposit. A vacuum deposition apparatus is one in which above component for a vacuum deposition apparatus is applied in a holder of a sample to be deposited, a deposition material source holder, a preventive component and so on.
摘要翻译：用于真空沉积设备的部件包括在组件主体的表面上形成的组件体和喷涂层。喷雾沉积物具有表面粗糙度，其中局部峰的峰顶的平均间隔S在50至150μm的范围内，并且轮廓谷线Rv的底部和轮廓峰线的顶部的距离在分别为20至70毫米。此外，喷雾沉积物具有低硬度涂层，其选自Hv 30（维氏硬度）以下的Al基底喷雾沉积物，Hv 100以下的Cu基喷雾沉积物，Hv为200以下的Ni基喷雾沉积物，Hv为200以下的Ni基喷雾沉积物 Hv 300以下的Ti基喷雾沉积物，Hv 300以下的Mo基喷雾沉积物和Hv 500以下的W基喷雾沉积物。用于真空沉积装置的这种部件可以在沉积期间抑制附着在部件上的沉积材料的稳定性和有效性。此外，可以大大减少设备清洁和部件更换的次数。目标包括类似的喷雾沉积物。真空沉积装置是将上述用于真空沉积装置的部件应用于待沉积样品的保持器，沉积材料源保持器，预防部件等的真空沉积装置。

4. 发明授权

US06225741B1 Package film for EL panel, its manufacture, and EL panel and LCD module employing the film 有权
标题翻译： EL面板封装膜，其制造方法，以及使用封装膜的EL面板和LCD模块
公开(公告)号：US06225741B1
公开(公告)日：2001-05-01
申请号：US09142978
申请日：1999-02-03
申请人： Mitsuo Nakamura , Yoichiro Yabe
发明人： Mitsuo Nakamura , Yoichiro Yabe
IPC分类号： H01J162
CPC分类号： H05B33/12 , G02F1/133604 , G02F2201/503 , H05B33/02 , H05B33/04
摘要： An EL panel package film comprises, for example, a PCTFE film or a PET film having a moistureproof layer. This EL panel package film has irregularities of 3 &mgr;m or more in arithmetic average roughness (Ra) and 10 &mgr;m or more in maximum height (Ry) specified in JIS G 0601 on at least one of its surfaces. The EL panel is configured by using the EL panel package film having such surface irregularities as a package film on at least a light emitting surface side. Oscillations produced due to the polarity inversion of an alternate voltage applied to the EL panel are absorbed and dispersed by the irregularities formed on the package film surface. A LCD module has such an EL panel as the backlight. Noise from the LCD cell surface is reduced.
摘要翻译： EL面板封装膜包括例如PCTFE膜或具有防潮层的PET膜。该EL面板封装膜在其至少一个表面上具有JIS G 0601规定的算术平均粗糙度（Ra）和最大高度（10m）以上的3μm以上的凹凸。 EL面板通过在至少发光面侧使用具有这种表面凹凸的EL面板封装薄膜作为封装薄膜来构成。由于施加到EL面板的交替电压的极性反转而产生的振荡被形成在封装膜表面上的凹凸吸收并分散。 LCD模块具有如背光源的EL面板。来自LCD单元表面的噪音降低。

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