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    • 2. 发明申请
    • METHOD OF FORMING A POWER SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE
    • 形成功率半导体器件和功率半导体器件的方法
    • US20110089483A1
    • 2011-04-21
    • US12999143
    • 2008-06-30
    • Jean Michel ReynesEvgueniy StafanovYann Weber
    • Jean Michel ReynesEvgueniy StafanovYann Weber
    • H01L29/78H01L21/336
    • H01L29/7811H01L29/0619H01L29/0878H01L29/66333H01L29/66348H01L29/66712H01L29/66734H01L29/7395H01L29/7397H01L29/7802H01L29/7813
    • A method of forming a power semiconductor device comprises forming a first semiconductor layer of a first conductivity type extending across the power semiconductor device; forming an epitaxial layer of the first conductivity type over the first semiconductor layer, the epitaxial layer having a doping concentration that increases from a first surface of the epitaxial layer towards the first semiconductor layer; forming a body region of a second conductivity type in the epitaxial layer extending from the first surface of the epitaxial layer into the epitaxial layer, wherein a junction between the body region and the epitaxial layer is at or substantially adjacent to a region of the epitaxial layer having a maximum doping concentration; and forming a gate region such that the gate region is adjacent at least a portion of the body region. In operation of the semiconductor device, the portion of the body region adjacent the gate region functions as a channel region of the semiconductor device.
    • 一种形成功率半导体器件的方法包括:形成跨过功率半导体器件延伸的第一导电类型的第一半导体层; 在所述第一半导体层上形成第一导电类型的外延层,所述外延层具有从所述外延层的第一表面朝向所述第一半导体层增加的掺杂浓度; 在从所述外延层的所述第一表面延伸到所述外延层中的所述外延层中形成第二导电类型的体区,其中所述体区和所述外延层之间的接合处于或基本上邻近所述外延层的区域 具有最大掺杂浓度; 以及形成栅极区域,使得栅极区域与身体区域的至少一部分相邻。 在半导体器件的工作中,与栅极区相邻的体区的部分用作半导体器件的沟道区。
    • 4. 发明授权
    • Method of forming a power semiconductor device and power semiconductor device
    • 形成功率半导体器件和功率半导体器件的方法
    • US08592894B2
    • 2013-11-26
    • US12999143
    • 2008-06-30
    • Jean Michel ReynesEvgueniy StafanovYann Weber
    • Jean Michel ReynesEvgueniy StafanovYann Weber
    • H01L29/78H01L21/336
    • H01L29/7811H01L29/0619H01L29/0878H01L29/66333H01L29/66348H01L29/66712H01L29/66734H01L29/7395H01L29/7397H01L29/7802H01L29/7813
    • A method of forming a power semiconductor device comprises forming a first semiconductor layer of a first conductivity type extending across the power semiconductor device; forming an epitaxial layer of the first conductivity type over the first semiconductor layer, the epitaxial layer having a doping concentration that increases from a first surface of the epitaxial layer towards the first semiconductor layer; forming a body region of a second conductivity type in the epitaxial layer extending from the first surface of the epitaxial layer into the epitaxial layer, wherein a junction between the body region and the epitaxial layer is at or substantially adjacent to a region of the epitaxial layer having a maximum doping concentration; and forming a gate region such that the gate region is adjacent at least a portion of the body region. In operation of the semiconductor device, the portion of the body region adjacent the gate region functions as a channel region of the semiconductor device.
    • 一种形成功率半导体器件的方法包括:形成跨过功率半导体器件延伸的第一导电类型的第一半导体层; 在所述第一半导体层上形成第一导电类型的外延层,所述外延层具有从所述外延层的第一表面朝向所述第一半导体层增加的掺杂浓度; 在从所述外延层的所述第一表面延伸到所述外延层中的所述外延层中形成第二导电类型的体区,其中所述体区和所述外延层之间的接合处于或基本上邻近所述外延层的区域 具有最大掺杂浓度; 以及形成栅极区域,使得栅极区域与身体区域的至少一部分相邻。 在半导体器件的工作中,与栅极区相邻的体区的部分用作半导体器件的沟道区。