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1. 发明授权

US07816937B2 Apparatus for testing a semiconductor package 失效
标题翻译：用于测试半导体封装的装置
公开(公告)号：US07816937B2
公开(公告)日：2010-10-19
申请号：US12167000
申请日：2008-07-02
申请人： Young-Ki Kwak , Chul-Woong Jang , Woon-Sup Choi , Jong-pil Park
发明人： Young-Ki Kwak , Chul-Woong Jang , Woon-Sup Choi , Jong-pil Park
IPC分类号： G01R31/02
CPC分类号： G01R31/2893
摘要： An apparatus for testing an object includes a test chamber, a guiding member, testing units and a transferring unit. The test chamber is configured to receive the object. The guiding member is arranged extending along a first direction in the test chamber. The testing units are movably connected to the guiding member to test electrical characteristics of the object. The transferring unit is arranged in the test chamber to load the object into one of the testing units and unload the object from one of the testing units. The testing units may be transferred to a position for repair without suspension of the apparatus. The object may be tested using another testing unit while the other testing unit is being repaired.
摘要翻译：用于测试物体的装置包括测试室，引导构件，测试单元和传送单元。测试室配置成接收物体。引导构件沿着测试室中的第一方向布置。测试单元可移动地连接到引导构件以测试物体的电特性。转移单元布置在测试室中以将物体装载到一个测试单元中，并从其中一个测试单元卸载物体。测试单元可以被转移到用于修理的位置，而不会悬挂设备。该对象可以使用另一个测试单元进行测试，而另一个测试单元正在修复。

2. 发明授权

US07227351B2 Apparatus and method for performing parallel test on integrated circuit devices 有权
标题翻译：在集成电路设备上执行并行测试的装置和方法
公开(公告)号：US07227351B2
公开(公告)日：2007-06-05
申请号：US10856461
申请日：2004-05-27
申请人： Woo-Il Kim , Hyun-Seop Shim , Hyoung-Young Lee , Young-Ki Kwak , Jeong-Ho Bang , Ki-Bong Ju
发明人： Woo-Il Kim , Hyun-Seop Shim , Hyoung-Young Lee , Young-Ki Kwak , Jeong-Ho Bang , Ki-Bong Ju
IPC分类号： G01R31/28
CPC分类号： G01R31/31905 , G11C2029/2602
摘要： Embodiments of the invention connect a plurality of devices under test (DUTS) in a parallel manner and a high test current is selectively applied to each DUT. The apparatus to test a plurality of DUTs includes a plurality of power sources providing the test current to a plurality of DUTs; and switching devices connected to the respective DUTs and power sources and selectively providing the test current. In addition, the apparatus has at least one control unit to control the switching devices. Furthermore, a group of DUTs from the plurality of DUTs is connected between two of the plurality of power sources in a parallel manner, and the test current is selectively provided to one DUT from the group of DUTs according to the operation of the switching devices.
摘要翻译：本发明的实施例以并行方式连接多个待测器件（DUTS），并且将高测试电流选择性地施加到每个DUT。测试多个DUT的装置包括向多个DUT提供测试电流的多个电源; 以及连接到各个DUT和电源的开关装置，并选择性地提供测试电流。此外，该装置具有至少一个控制单元来控制开关装置。此外，来自多个DUT的一组DUT以并行方式连接在多个电源中的两个之间，并且根据开关装置的操作，从DUT组中选择性地向一个DUT提供测试电流。

3. 发明授权

US08103927B2 Field mounting-type test apparatus and method for testing memory component or module in actual PC environment 有权
标题翻译：现场安装式试验装置及在实际PC环境中测试存储器组件或模块的方法
公开(公告)号：US08103927B2
公开(公告)日：2012-01-24
申请号：US12320919
申请日：2009-02-09
申请人： In-ho Choi , Woon-sup Choi , Sung-yeol Kim , Young-ki Kwak , Jae-il Lee , Chul-woong Jang , Ho-sun Yoo , In-su Yang , Seung-ho Jang
发明人： In-ho Choi , Woon-sup Choi , Sung-yeol Kim , Young-ki Kwak , Jae-il Lee , Chul-woong Jang , Ho-sun Yoo , In-su Yang , Seung-ho Jang
IPC分类号： G01R31/28
CPC分类号： G11C29/56 , G06F11/263
摘要： A field mounting-type test apparatus and method for enhancing competitiveness of a product by simulating various test conditions including a mounting environment for improving quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment thus reducing testing time and cost. The field mounting-type test apparatus includes a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT using the logic data.
摘要翻译：通过模拟包括用于提高存储装置的质量可靠性的安装环境的各种测试条件以及由于安装环境的变化而使整体损失最小化的现场安装型试验装置和方法，从而减少测试时间和成本。现场安装型测试装置包括大容量存储装置，其被配置为存储模拟被测器件（DUT）的安装环境的逻辑数据和被配置为使用逻辑数据测试DUT的测试器主框架。

4. 发明申请

US20050007140A1 Apparatus and method for performing parallel test on integrated circuit devices 有权
标题翻译：在集成电路设备上执行并行测试的装置和方法
公开(公告)号：US20050007140A1
公开(公告)日：2005-01-13
申请号：US10856461
申请日：2004-05-27
申请人： Woo-Il Kim , Hyun-Seop Shim , Hyoung-Young Lee , Young-Ki Kwak , Jeong-Ho Bang , Ki-Bong Ju
发明人： Woo-Il Kim , Hyun-Seop Shim , Hyoung-Young Lee , Young-Ki Kwak , Jeong-Ho Bang , Ki-Bong Ju
IPC分类号： G01R31/28 , G01R31/319 , G11C29/00 , G01R31/26
CPC分类号： G01R31/31905 , G11C2029/2602
摘要： Embodiments of the invention connect a plurality of devices under test (DUTS) in a parallel manner and a high test current is selectively applied to each DUT. The apparatus to test a plurality of DUTs includes a plurality of power sources providing the test current to a plurality of DUTs; and switching devices connected to the respective DUTs and power sources and selectively providing the test current. In addition, the apparatus has at least one control unit to control the switching devices. Furthermore, a group of DUTs from the plurality of DUTs is connected between two of the plurality of power sources in a parallel manner, and the test current is selectively provided to one DUT from the group of DUTs according to the operation of the switching devices.
摘要翻译：本发明的实施例以并行方式连接多个待测器件（DUTS），并且将高测试电流选择性地施加到每个DUT。测试多个DUT的装置包括向多个DUT提供测试电流的多个电源; 以及连接到各个DUT和电源的开关装置，并选择性地提供测试电流。此外，该装置具有至少一个控制单元来控制开关装置。此外，来自多个DUT的一组DUT以并行方式连接在多个电源中的两个之间，并且根据开关装置的操作，从DUT组中选择性地向一个DUT提供测试电流。

5. 发明申请

US20090015287A1 APPARATUS FOR TESTING AN OBJECT 失效
标题翻译：用于测试物体的装置
公开(公告)号：US20090015287A1
公开(公告)日：2009-01-15
申请号：US12167000
申请日：2008-07-02
申请人： YOUNG-KI KWAK , Chul-Woong Jang , Woon-Sup Choi , Jong-pil Park
发明人： YOUNG-KI KWAK , Chul-Woong Jang , Woon-Sup Choi , Jong-pil Park
IPC分类号： G01R31/26
CPC分类号： G01R31/2893
摘要： An apparatus for testing an object includes a test chamber, a guiding member, testing units and a transferring unit. The test chamber is configured to receive the object. The guiding member is arranged extending along a first direction in the test chamber. The testing units are movably connected to the guiding member to test electrical characteristics of the object. The transferring unit is arranged in the test chamber to load the object into one of the testing units and unload the object from one of the testing units. The testing units may be transferred to a position for repair without suspension of the apparatus. The object may be tested using another testing unit while the other testing unit is being repaired.
摘要翻译：用于测试物体的装置包括测试室，引导构件，测试单元和传送单元。测试室配置成接收物体。引导构件沿着测试室中的第一方向布置。测试单元可移动地连接到引导构件以测试物体的电特性。转移单元布置在测试室中以将物体装载到一个测试单元中，并从其中一个测试单元卸载物体。测试单元可以被转移到用于修理的位置，而不会悬挂设备。该对象可以使用另一个测试单元进行测试，而另一个测试单元正在修复。

6. 发明申请

US20090300442A1 Field mounting-type test apparatus and method for testing memory component or module in actual PC environment 有权
标题翻译：现场安装式试验装置及在实际PC环境中测试存储器组件或模块的方法
公开(公告)号：US20090300442A1
公开(公告)日：2009-12-03
申请号：US12320919
申请日：2009-02-09
申请人： In-ho Choi , Woon-sup Choi , Sung-yeol Kim , Young-ki Kwak , Jae-il Lee , Chul-woong Jang , Ho-sun Yoo , In-su Yang , Seung-ho Jang
发明人： In-ho Choi , Woon-sup Choi , Sung-yeol Kim , Young-ki Kwak , Jae-il Lee , Chul-woong Jang , Ho-sun Yoo , In-su Yang , Seung-ho Jang
IPC分类号： G11C29/04 , G06F11/22 , G01R31/3177 , G06F11/25
CPC分类号： G11C29/56 , G06F11/263
摘要： Provided are a field mounting-type test apparatus and method, which can enhance competitiveness of a product by simulating various test conditions including a mounting environment so as to improve quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment so as to reduce testing time and cost. In accordance with example embodiments, the field mounting-type test apparatus may include a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT by using the logic data.
摘要翻译：提供了一种现场安装型测试装置和方法，其可以通过模拟包括安装环境在内的各种测试条件来提高产品的竞争力，从而提高存储器件的质量可靠性，并且通过最小化由于安装环境的变化引起的整体损耗以减少测试时间和成本。根据示例性实施例，现场安装型测试设备可以包括大容量存储设备，其被配置为存储模拟被测器件（DUT）的安装环境的逻辑数据和被配置为通过使用逻辑测试DUT的测试器主框架数据。

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