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    • 2. 发明申请
    • CONTINUOUS CVD EQUIPMENT FOR FILMS AND CONTINUOUS CVD PROCESS
    • 连续CVD设备和连续CVD工艺
    • WO1997029149A1
    • 1997-08-14
    • PCT/JP1997000292
    • 1997-02-06
    • TOYO METALLIZING CO., LTD.TOHYAMA, ShunrokuMOCHIZUKI, KiyohitoYAMASHITA, MasayukiAOYAGI, Tsutomu
    • TOYO METALLIZING CO., LTD.
    • C08J07/18
    • B05D1/62C23C16/545
    • Continuous CVD equipment for continuously and stably forming an extremely thin organic coating having special functions such as water repellency on a continuously running film; and a continuous CVD process therefor. This equipment comprises a vacuum chamber, a vacuum pump connected to the vacuum chamber, and a heatable tank which is filled with an organic compound that can be plasma-polymerized to form a film and in which the compound is vaporized; the vacuum chamber being equipped therein with a feed roll system for feeding a film continuously and a wind-up roll system for winding up a CVD film; a special running area for conducting the CVD of the film fed from the feed roll system and a plasma-generating area adjacent to that area being provided between the feed roll system and the wind-up roll system; and the tank being connected to the inside of the vacuum chamber by a pipe to thereby enable the feeding of the vapor of the compound generated in the tank into the plasma-generating area. The CVD process is one for continuously forming an organic compound coating on a continuously running film by the use of the above equipment.
    • 连续CVD设备,连续稳定地形成具有特殊功能的极薄的有机涂层,例如连续运行的膜上的防水性; 及其连续CVD工艺。 该设备包括真空室,连接到真空室的真空泵,以及填充有可以被等离子体聚合以形成膜并且化合物蒸发的有机化合物的可加热罐; 真空室中装有用于连续供给薄膜的进料辊系统和用于卷绕CVD薄膜的卷绕辊系统; 用于进行从馈送辊系统馈送的膜的CVD的特殊运行区域和与该区域相邻的等离子体产生区域设置在馈送辊系统和卷绕辊系统之间; 并且罐通过管连接到真空室的内部,从而能够将在罐中产生的化合物的蒸气进料到等离子体产生区域中。 CVD工艺是通过使用上述设备在持续运行的膜上连续形成有机化合物涂层的方法。
    • 5. 发明申请
    • FLEXIBLE PRINTED WIRING BOARD
    • 柔性印刷接线板
    • WO1996038029A1
    • 1996-11-28
    • PCT/JP1996001350
    • 1996-05-22
    • TOYO METALLIZING CO., LTD.YAMASHITA, MasayukiNISHIGAWA, TadahiroTOHYAMA, Shunroku
    • TOYO METALLIZING CO., LTD.
    • H05K03/38
    • B32B15/08H05K1/0346H05K1/0373H05K3/388H05K2201/0154H05K2203/125
    • A durable two-layer flexible printed wiring board which is improved in the persistence of tenacious adhesion after heat loading, particularly so improved in the tenacious adhesion between the copper film and the polyimide film after electroless plating as not to cause delamination even after exposure to a temperature of as high as about 150 DEG C for a period of as long as 10 days. The board is characterized by having a first deposited metal layer, on one or both surfaces of a polyimide film containing 0.02 to 1 wt.% (based on the film) of tin, in which part or the whole of the deposited metal is dispersed in the film in the thicknesswise direction toward the inside of the film from the surface thereof and whose thickness is 10 to 300 ANGSTROM , inclusive of the layer wherein the metal is dispersed, and having a second deposited copper layer on the first deposited metal layer.
    • 一种耐用的双层柔性印刷线路板,其在热负荷后坚韧的粘附性得到改善,特别是在化学镀后的铜膜和聚酰亚胺膜之间的牢固粘附性得到改善,即使在曝光后也不会引起分层 温度高达约150℃,时间长达10天。 该板的特征在于在聚酰亚胺膜的一个或两个表面上具有第一沉积金属层,该聚酰亚胺膜含有0.02至1重量%(基于膜)的锡,其中部分或全部沉积的金属分散在 膜的厚度方向从其表面向膜内侧,厚度为10〜300,包括其中金属分散的层,并且在第一沉积金属层上具有第二沉积铜层。