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1. 发明申请

WO1996038029A1 FLEXIBLE PRINTED WIRING BOARD 审中-公开
标题翻译：柔性印刷接线板
公开(公告)号：WO1996038029A1
公开(公告)日：1996-11-28
申请号：PCT/JP1996001350
申请日：1996-05-22
申请人： TOYO METALLIZING CO., LTD. , YAMASHITA, Masayuki , NISHIGAWA, Tadahiro , TOHYAMA, Shunroku
发明人： TOYO METALLIZING CO., LTD.
IPC分类号： H05K03/38
CPC分类号： B32B15/08 , H05K1/0346 , H05K1/0373 , H05K3/388 , H05K2201/0154 , H05K2203/125
摘要： A durable two-layer flexible printed wiring board which is improved in the persistence of tenacious adhesion after heat loading, particularly so improved in the tenacious adhesion between the copper film and the polyimide film after electroless plating as not to cause delamination even after exposure to a temperature of as high as about 150 DEG C for a period of as long as 10 days. The board is characterized by having a first deposited metal layer, on one or both surfaces of a polyimide film containing 0.02 to 1 wt.% (based on the film) of tin, in which part or the whole of the deposited metal is dispersed in the film in the thicknesswise direction toward the inside of the film from the surface thereof and whose thickness is 10 to 300 ANGSTROM , inclusive of the layer wherein the metal is dispersed, and having a second deposited copper layer on the first deposited metal layer.
摘要翻译：一种耐用的双层柔性印刷线路板，其在热负荷后坚韧的粘附性得到改善，特别是在化学镀后的铜膜和聚酰亚胺膜之间的牢固粘附性得到改善，即使在曝光后也不会引起分层温度高达约150℃，时间长达10天。该板的特征在于在聚酰亚胺膜的一个或两个表面上具有第一沉积金属层，该聚酰亚胺膜含有0.02至1重量％（基于膜）的锡，其中部分或全部沉积的金属分散在膜的厚度方向从其表面向膜内侧，厚度为10〜300，包括其中金属分散的层，并且在第一沉积金属层上具有第二沉积铜层。

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