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1. 发明申请

US20070251670A1 VAPOR CHAMBER HEAT SINK 失效
标题翻译：蒸气室散热器
公开(公告)号：US20070251670A1
公开(公告)日：2007-11-01
申请号：US11308764
申请日：2006-04-28
申请人： Xue-Wen Peng , Bing Chen , Jun-Hai Li
发明人： Xue-Wen Peng , Bing Chen , Jun-Hai Li
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A vapor chamber heat sink attached to a heat-generating electronic component includes a base (10) defining an opening therein. A plurality of fins (20) is mounted on the base. A heat pipe (30) thermally connects the electronic component and the fins. The heat pipe comprises a plate-type lower portion (32) contacting a bottom surface of the base and a bottom surface (22) of the fins and overlaying a top surface of the electronic component, a plate-type upper portion (34) parallel to the lower portion contacting a top surface (24) of the fins, and a connecting portion (36) interconnecting opposite two ends of the lower and upper portions. The heat pipe is configured in such a manner so as to enhance contact area and thermal conductivity between the heat pipe and the electronic component and between the heat pipe and the fins.
摘要翻译：附接到发热电子部件的蒸气室散热器包括在其中限定开口的基部（10）。多个翅片（20）安装在基座上。热管（30）热连接电子部件和翅片。所述热管包括与所述基座的底表面和所述翅片的底表面（22）接触并覆盖所述电子部件的顶表面的板式下部（32），平板型上部（34）平行连接到与翅片的顶表面（24）接触的下部，以及连接部分（36），其连接下部和上部的相对的两端。热管以这样的方式配置，以便增强热管和电子部件之间以及热管和翅片之间的接触面积和热导率。

2. 发明申请

US20070181287A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070181287A1
公开(公告)日：2007-08-09
申请号：US11307444
申请日：2006-02-08
申请人： Xue-Wen Peng , Bing Chen
发明人： Xue-Wen Peng , Bing Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/3672 , H01L23/4006 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, a first and second fin sets on the base, and a fan located atop the first and second fin sets. The base has a first face for contacting with an electronic device, and two sloped faces extending from the first face and toward each other. The first fin set defined a channel receiving the base therein. A plat extends from an end of the first face of the base. The second fin set is arranged on the plat of the base. The first face of the base has two grooves defined therein. A retaining member is attached to the first face of the base and has two retaining bars thereof fitted in the two grooves of the first face, respectively.
摘要翻译：散热装置包括基座，底座上的第一和第二翅片组以及位于第一和第二翅片组顶部的风扇。底座具有与电子设备接触的第一面和从第一面向彼此延伸的两个倾斜面。第一翅片组限定了在其中接收基部的通道。平台从基座的第一面的端部延伸。第二个翅片组布置在基座的平台上。底座的第一面具有限定在其中的两个凹槽。保持构件附接到基座的第一面，并且其两个保持杆分别装配在第一面的两个凹槽中。

3. 发明申请

US20060087817A1 Heat sink assembly 失效
标题翻译：散热器组件
公开(公告)号：US20060087817A1
公开(公告)日：2006-04-27
申请号：US11209928
申请日：2005-08-23
申请人： Xue-Wen Peng , Bing Chen
发明人： Xue-Wen Peng , Bing Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： A heat sink assembly includes a heat sink (10) deposited on a circuit board (100), a pair of bolts (30), and a clip (20) attached to the circuit board. The clip includes a pressing portion (22) engaging the circuit board, a first locking portion (26) and a second locking portion (28). The first locking portion defines an opening (42) and a slot (40) and the second locking portion defines a positioning groove (50). The clip further includes a clamping portion (70) linearly movably and rotatable mounted on the second locking portion. One bolt has a head engaging with the heat sink and a bead engaging with the first locking portion. The other bolt has a head engaging with the heat sink and a bead engaging with the clamping portion.
摘要翻译：散热器组件包括沉积在电路板（100）上的散热器（10），一对螺栓（30）和附接到电路板的夹子（20）。夹子包括接合电路板的按压部分（22），第一锁定部分（26）和第二锁定部分（28）。第一锁定部分限定开口（42）和狭槽（40），并且第二锁定部分限定定位槽（50）。夹具还包括可直线移动并可旋转地安装在第二锁定部分上的夹紧部分（70）。一个螺栓具有与散热器接合的头部和与第一锁定部分接合的胎圈。另一个螺栓具有与散热器接合的头部和与夹持部分接合的胎圈。

4. 发明授权

US07327576B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07327576B2
公开(公告)日：2008-02-05
申请号：US11166311
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
发明人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/0275
摘要： A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together. The evaporating segment and the condensing segment of the at least one heat pipe are movably received in the first and second heat dissipation units respectively before the heat dissipation device is installed to the electronic card device and dissipating heat generated therefrom, and are firmly secured in the first and second heat dissipation units respectively after the heat dissipation device is installed to the electronic card device and dissipate heat generated therefrom.
摘要翻译：一种用于安装和冷却电子卡装置（40）的散热装置包括第一和第二散热单元（10,20）和至少一个热管（30）。散热单元各自包括基板（12,22）和与基板接合的翅片板（14,24）。所述至少一个热管包括容纳在所述基板和所述第一散热单元的翅片之间的蒸发段（32），以及容纳在所述基板和所述翅片板之间的第二散热的冷凝段（34）从而将第一和第二散热单元连接在一起。所述至少一个热管的蒸发段和冷凝段分别可移动地容纳在第一和第二散热单元中，然后将散热装置安装到电子卡装置上并散发由其产生的热量，并牢固地固定在第一和第二散热单元分别在散热装置安装到电子卡装置上并散发由其产生的热量之后。

5. 发明申请

US20080007914A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20080007914A1
公开(公告)日：2008-01-10
申请号：US11309650
申请日：2006-09-05
申请人： Xue-Wen Peng , Bing Chen
发明人： Xue-Wen Peng , Bing Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for removing heat from an electronic component includes separated first and second heat sinks and a plate-type heat pipe. The first heat sink has a side oriented to the second heat sink and defines a notch in the side thereof. The second heat sink defines a channel therein. The heat pipe includes a heat-absorber at one end thereof and a heat-exhauster at an opposite end thereof. The heat-absorber is attached into the notch and has a main surface facing the second heat sink. The heat-exhauster is fittingly engaged into the channel of the second heat sink to position the second heat sink thereon. The heat-exhauster dissipates heat transferred from the heat-absorber to the second heat sink.
摘要翻译：用于从电子部件除去热量的散热装置包括分离的第一和第二散热器和板式热管。第一散热器具有朝向第二散热器的侧面并且在其侧面限定出凹口。第二散热器在其中限定通道。热管在其一端包括吸热体，在其另一端包括排热器。吸热器安装在凹口中并具有面向第二散热器的主表面。排热器适合地接合到第二散热器的通道中，以将第二散热器定位在其上。排热器将从吸热器传递的热量散发到第二散热器。

6. 发明授权

US07447023B2 Heat dissipation device for computer add-on cards 失效
标题翻译：计算机附加卡散热装置
公开(公告)号：US07447023B2
公开(公告)日：2008-11-04
申请号：US11608650
申请日：2006-12-08
申请人： Bing Chen , Xue-Wen Peng
发明人： Bing Chen , Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is to be mounted in a computer enclosure for dissipating heat generated by a VGA card (10). The heat dissipation device includes a heat sink (90), a fan (60) and a fan duct (50) connecting the heat sink (90) and the fan (60). The heat sink (90) contacts a heat-generating device (12) of the VGA card. The fan (60) has an inlet port (62) and an outlet port (63). The outlet port (63) communicates with an ambient air outside the computer enclosure. The fan duct (50) has two open ends (55,52). One open end (55) engages with the heat sink (90) and the other open end (52) engages with the inlet port (62) of the fan (60).
摘要翻译：散热装置将安装在计算机外壳中，用于散热由VGA卡（10）产生的热量。散热装置包括散热器（90），风扇（60）和连接散热器（90）和风扇（60）的风扇导管（50）。散热器（90）与VGA卡的发热装置（12）接触。风扇（60）具有入口（62）和出口（63）。出口端口（63）与计算机外壳外部的环境空气相通。风扇导管（50）具有两个开口端（55,52）。一个开口端（55）与散热器（90）接合，另一个开口端（52）与风扇（60）的入口（62）接合。

7. 发明授权

US07319588B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07319588B2
公开(公告)日：2008-01-15
申请号：US11307153
申请日：2006-01-25
申请人： Xue-Wen Peng , Bing Chen
发明人： Xue-Wen Peng , Bing Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation unit is attached to a top surface of the heat-generating component. The second heat dissipation unit has a main portion disposed beneath the printed circuit board and another portion extending from a level beneath the printed circuit board to another level above the printed circuit board. The heat pipe is wholly disposed above the printed circuit board and comprises an evaporating portion rotatably received in the channel of the first heat dissipation unit and a condensing portion rotatably received in the channel of the second heat dissipation unit.
摘要翻译：散热组件包括印刷电路板，每个在其中限定通道的第一和第二散热单元和热管。印刷电路板上安装有电子发热部件。第一散热单元附接到发热部件的顶表面。第二散热单元具有设置在印刷电路板下方的主要部分和从印刷电路板下方的水平面延伸到印刷电路板上方另一个高度的另一部分。热管完全设置在印刷电路板的上方，并包括可旋转地容纳在第一散热单元的通道中的蒸发部分和可旋转地容纳在第二散热单元的通道中的冷凝部分。

8. 发明申请

US20080074846A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20080074846A1
公开(公告)日：2008-03-27
申请号：US11309759
申请日：2006-09-22
申请人： Xue-Wen Peng , Bing Chen
发明人： Xue-Wen Peng , Bing Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20936 , F28D15/0275 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device cooling a power adapter (50) includes first and second heat dissipation units (10), (20), at least one heat pipe (30) connecting the first and second heat dissipation units and a plurality of positioning elements (60) securing the first and second heat dissipation units on the power adapter. The positioning elements extend through the first heat dissipation unit and bottom ends of the positioning elements are screwed into the second heat dissipation unit. Top ends of the positioning elements are secured to the first heat dissipation unit. Therefore, the power adapter is tightly sandwiched between the first heat dissipation unit and the second heat dissipation unit by the positioning elements. Spring forces are exerted by the positioning elements on the first heat dissipation unit toward the second heat dissipation unit.
摘要翻译：冷却电力适配器（50）的散热装置包括第一和第二散热单元（10），（20），连接第一和第二散热单元的至少一个热管（30）和多个定位元件（60 ）将电源适配器上的第一和第二散热单元固定。定位元件延伸穿过第一散热单元，定位元件的底端被拧入第二散热单元。定位元件的顶端被固定到第一散热单元。因此，电力适配器通过定位元件紧密地夹在第一散热单元和第二散热单元之间。弹簧力由第一散热单元上的定位元件朝向第二散热单元施加。

9. 发明申请

US20070171616A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070171616A1
公开(公告)日：2007-07-26
申请号：US11307153
申请日：2006-01-25
申请人： Xue-Wen Peng , Bing Chen
发明人： Xue-Wen Peng , Bing Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation unit is attached to a top surface of the heat-generating component. The second heat dissipation unit has a main portion disposed beneath the printed circuit board and another portion extending from a level beneath the printed circuit board to another level above the printed circuit board. The heat pipe is wholly disposed above the printed circuit board and comprises an evaporating portion rotatably received in the channel of the first heat dissipation unit and a condensing portion rotatably received in the channel of the second heat dissipation unit.
摘要翻译：散热组件包括印刷电路板，每个在其中限定通道的第一和第二散热单元和热管。印刷电路板上安装有电子发热部件。第一散热单元附接到发热部件的顶表面。第二散热单元具有设置在印刷电路板下方的主要部分和从印刷电路板下方的水平面延伸到印刷电路板上方另一个高度的另一部分。热管完全设置在印刷电路板的上方，并包括可旋转地容纳在第一散热单元的通道中的蒸发部分和可旋转地容纳在第二散热单元的通道中的冷凝部分。

10. 发明授权

US07190591B2 Heat sink assembly 失效
标题翻译：散热器组件
公开(公告)号：US07190591B2
公开(公告)日：2007-03-13
申请号：US11209928
申请日：2005-08-23
申请人： Xue-Wen Peng , Bing Chen
发明人： Xue-Wen Peng , Bing Chen
IPC分类号： H05K7/20 , A44B21/00 , A47B97/00
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： A heat sink assembly includes a heat sink (10) deposited on a circuit board (100), a pair of bolts (30), and a clip (20) attached to the circuit board. The clip includes a pressing portion (22) engaging the circuit board, a first locking portion (26) and a second locking portion (28). The first locking portion defines an opening (42) and a slot (40) and the second locking portion defines a positioning groove (50). The clip further includes a clamping portion (70) linearly movably and rotatable mounted on the second locking portion. One bolt has a head engaging with the heat sink and a bead engaging with the first locking portion. The other bolt has a head engaging with the heat sink and a bead engaging with the clamping portion.
摘要翻译：散热器组件包括沉积在电路板（100）上的散热器（10），一对螺栓（30）和附接到电路板的夹子（20）。夹子包括接合电路板的按压部分（22），第一锁定部分（26）和第二锁定部分（28）。第一锁定部分限定开口（42）和狭槽（40），并且第二锁定部分限定定位槽（50）。夹具还包括可直线移动并可旋转地安装在第二锁定部分上的夹紧部分（70）。一个螺栓具有与散热器接合的头部和与第一锁定部分接合的胎圈。另一个螺栓具有与散热器接合的头部和与夹持部分接合的胎圈。

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