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1. 发明申请

US20140117174A1 ELECTRONIC DEVICE SUPPORT 审中-公开
标题翻译：电子设备支持
公开(公告)号：US20140117174A1
公开(公告)日：2014-05-01
申请号：US13663587
申请日：2012-10-30
申请人： TSAI-JEN TAN , WEN-PIN YANG
发明人： TSAI-JEN TAN , WEN-PIN YANG
IPC分类号： F16M11/22
CPC分类号： A47B23/007 , A47B23/041 , F16M11/048 , F16M11/10 , F16M11/2028 , F16M11/38 , F16M13/022
摘要： An electronic device support for installing a clamping means to clamp and hold an electronic device is introduced. The electronic device support includes a rod and two bases. The rod is in an arc shape; each base has a connecting portion; both ends of the rod are installed at the connecting portions respectively. In the electronic device support, the arc shape rod is combined with the bases, so that the electronic device can be raised and fixed appropriately by the electronic device support to achieve the effects of facilitating a user who lies in bed to use the electronic device without holding the electronic device as well as facilitating the user to leave the bed.
摘要翻译：引入了用于安装用于夹紧和保持电子装置的夹持装置的电子装置支撑件。电子设备支撑件包括杆和两个基座。杆是弧形的; 每个基座具有连接部分; 杆的两端分别安装在连接部分。在电子设备支撑件中，弧形杆与基座组合，使得电子设备可以通过电子设备支撑件适当地升高和固定，以实现便于躺在床上的用户使用电子设备的效果，而无需握住电子设备以及便于用户离开床。

2. 发明申请

US20130223094A1 DISPLAY MODULE 有权
标题翻译：显示模块
公开(公告)号：US20130223094A1
公开(公告)日：2013-08-29
申请号：US13780940
申请日：2013-02-28
申请人： Wen-Pin YANG , Chen-Lung CHEN
发明人： Wen-Pin YANG , Chen-Lung CHEN
IPC分类号： F21V8/00
CPC分类号： G02B6/0031 , G02B6/0085
摘要： A display module has a display panel and a backlight module disposed on one side of the display panel. The backlight module includes a heat sink, a light bar, a light guide plate, a first reflective sheet, and a second reflective sheet. The light bar abuts against one side of the heat sink. The first reflective sheet is disposed adjacent to a bottom surface of the light guide plate, and the second reflective sheet is disposed adjacent to an edge of a light-emitting surface of the light guide plate. The second reflective sheet has a first part and a second part forming an included angle with the first part, the first part is attached to the heat sink or the light bar, and the second part overlaps a part of the light-emitting surface of the light guide plate.
摘要翻译：显示模块具有设置在显示面板一侧的显示面板和背光模块。背光模块包括散热器，灯条，导光板，第一反射片和第二反射片。灯条与散热器的一侧相接。第一反射片与导光板的底面相邻配置，第二反射片与导光板的发光面的边缘相邻配置。第二反射片具有与第一部分形成夹角的第一部分和第二部分，第一部分附接到散热片或光棒，第二部分与发光表面的一部分重叠导光板。

3. 发明授权

US07667003B2 Antibody directed to human mist (mast cell immunoreceptor signal transducer) 有权
标题翻译：针对人类雾的抗体（肥大细胞免疫受体信号转导体）
公开(公告)号：US07667003B2
公开(公告)日：2010-02-23
申请号：US12231623
申请日：2008-09-04
申请人： Juan J. Perez-Villar , Han Chang , Steven B. Kanner , Gena S. Whitney , Yuli Wu , Wen-Pin Yang
发明人： Juan J. Perez-Villar , Han Chang , Steven B. Kanner , Gena S. Whitney , Yuli Wu , Wen-Pin Yang
IPC分类号： C07K16/28
CPC分类号： C07K14/47 , A01K2217/05 , Y10S435/81
摘要： The present invention describes a newly discovered full-length polynucleotide encoding an SH2 domain-containing adapter protein, called human MIST, cloned, isolated and identified from a human spleen cDNA library. Also described are the MIST polypeptide sequence, expression vectors, host cells, agonists, antagonists, antisense molecules, and antibodies related to the polynucleotide and/or polypeptide of the present invention. Novel splice variant forms of human MIST are provided. Methods for screening for modulators, particularly inhibitors, of the MIST protein and use of the human MIST polynucleotide and polypeptide for therapeutics and diagnostics are described.
摘要翻译：本发明描述了一种新发现的全长多核苷酸，其编码含有SH2结构域的衔接蛋白，称为人MIST，从人脾cDNA文库克隆，分离和鉴定。还描述了与本发明的多核苷酸和/或多肽相关的MIST多肽序列，表达载体，宿主细胞，激动剂，拮抗剂，反义分子和抗体。提供人类MIST的新型剪接变体形式。描述了用于筛选MIST蛋白的调节剂，特别是抑制剂的方法以及人MIST多核苷酸和多肽用于治疗和诊断的用途。

4. 发明申请

US20090051025A1 FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME 有权
标题翻译：风扇式水平包装结构及其方法
公开(公告)号：US20090051025A1
公开(公告)日：2009-02-26
申请号：US12255868
申请日：2008-10-22
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/48
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
摘要翻译：在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。

5. 发明申请

US20080108168A1 STRUCTURE OF IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING OF WAFER LEVEL PACKAGE 有权
标题翻译：图像传感器模块的结构和制造水平包装的方法
公开(公告)号：US20080108168A1
公开(公告)日：2008-05-08
申请号：US11945723
申请日：2007-11-27
申请人： Wen-Kun Yang , Wen-Pin Yang
发明人： Wen-Kun Yang , Wen-Pin Yang
IPC分类号： H01L21/00
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要翻译：图像传感器管芯包括衬底和形成在衬底上的图像传感器阵列。微透镜设置在图像传感器阵列上。在微透镜上形成保护层，以防止微透镜受到颗粒的抑制。

6. 发明授权

US07235375B2 Organic anion transport proteins 有权
标题翻译：有机阴离子转运蛋白
公开(公告)号：US07235375B2
公开(公告)日：2007-06-26
申请号：US10736936
申请日：2003-12-16
申请人： Todd G. Kirchgessner , Bonnie Hsiang , Yingjie Zhu , Yuli Wu , Zhaoging Wang , Jean S. Lynch , Xin Huang , Wen-Pin Yang
发明人： Todd G. Kirchgessner , Bonnie Hsiang , Yingjie Zhu , Yuli Wu , Zhaoging Wang , Jean S. Lynch , Xin Huang , Wen-Pin Yang
IPC分类号： G01N33/567 , G01N33/53 , A61K49/00 , A61B10/00 , C01P21/06 , C07K1/00
CPC分类号： G01N33/6872 , C07K14/47 , C07K14/705 , G01N2500/04
摘要： The current invention discloses nucleic acid and amino acid sequences for novel organic anion transfer proteins (“OATPs”). The invention encompasses the OATPs described herein, together with vectors containing the cDNA sequences, host cells containing the vectors and polypeptides having all or part of an OATP. Also encompasses are uses for OATPs for targeting drugs to specific organs and for modulating the concentration of endogenous substrates.
摘要翻译：本发明公开了新型有机阴离子转移蛋白（“OATPs”）的核酸和氨基酸序列。本发明包括本文所述的OATP以及含有cDNA序列的载体，含有载体的宿主细胞和具有全部或部分OATP的多肽。还包括OATPs用于将药物靶向特定器官和调节内源底物浓度的用途。

7. 发明授权

US07061106B2 Structure of image sensor module and a method for manufacturing of wafer level package 有权
标题翻译：图像传感器模块的结构和晶圆级封装的制造方法
公开(公告)号：US07061106B2
公开(公告)日：2006-06-13
申请号：US10833345
申请日：2004-04-28
申请人： Wen-Kun Yang , Wen-Pin Yang
发明人： Wen-Kun Yang , Wen-Pin Yang
IPC分类号： H01L23/34
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises an isolating base, a wafer level package, a lens holder, and a F.P.C.. The wafer level package having a plurality of image sensor dies and a plurality of solder balls is attached to the isolating base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dies. The lens holder is placed in the F.P.C., and the F.P.C. has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dies. Moreover, the image sensor dies may be packaged with passive components or other dies with a side by side structure or a stacking structure.
摘要翻译：本发明公开了一种图像传感器模块和晶片级封装的形成方法。图像传感器模块包括隔离基座，晶片级封装，透镜保持器和F.P.C。具有多个图像传感器管芯和多个焊球的晶片级封装件附接到隔离基座。多个透镜被放置在透镜保持器中，并且透镜保持器位于图像传感器模具上。镜头架放置在F.P.C.和F.P.C. 具有耦合到焊球的多个焊点，用于方便地传输图像传感器管芯的信号。此外，图像传感器管芯可以与无源部件或具有并排结构或堆叠结构的其它管芯一起封装。

8. 发明申请

US20060091514A1 Fan out type wafer level package structure and method of the same 有权
标题翻译：扇出式晶圆级封装结构及其方法
公开(公告)号：US20060091514A1
公开(公告)日：2006-05-04
申请号：US11301303
申请日：2005-12-12
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/02
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
摘要翻译：在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。

9. 发明申请

US20050236696A1 Fan out type wafer level package structure and method of the same 有权
标题翻译：扇出式晶圆级封装结构及其方法
公开(公告)号：US20050236696A1
公开(公告)日：2005-10-27
申请号：US11169722
申请日：2005-06-30
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/12 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/58 , H01L21/60 , H01L23/00 , H01L23/14 , H01L23/31 , H01L23/48 , H01L23/485 , H01L23/52 , H01L23/522 , H01L23/538 , H01L23/552 , H01L25/065
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure .
摘要翻译：在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。

10. 发明授权

US06692934B1 Organic anion transport proteins 有权
标题翻译：有机阴离子转运蛋白
公开(公告)号：US06692934B1
公开(公告)日：2004-02-17
申请号：US09575081
申请日：2000-05-19
申请人： Todd G. Kirchgessner , Bonnie Hsiang , Yingjie Zhu , Yuli Wu , Zhaoqing Wang , Jean S. Lynch , Xin Huang , Wen-Pin Yang
发明人： Todd G. Kirchgessner , Bonnie Hsiang , Yingjie Zhu , Yuli Wu , Zhaoqing Wang , Jean S. Lynch , Xin Huang , Wen-Pin Yang
IPC分类号： C12P2106
CPC分类号： G01N33/6872 , C07K14/47 , C07K14/705 , G01N2500/04
摘要： The current invention discloses nucleic acid and amino acid sequences for novel organic anion transfer proteins (“OATPs”). The invention encompasses the OATPs described herein, together with vectors containing the cDNA sequences, host cells containing the vectors and polypeptides having all or part of an OATP. Also encompasses are uses for OATPs for targeting drugs to specific organs and for modulating the concentration of endogenous substrates.
摘要翻译：本发明公开了新型有机阴离子转移蛋白（“OATPs”）的核酸和氨基酸序列。本发明包括本文所述的OATP以及含有cDNA序列的载体，含有载体的宿主细胞和具有全部或部分OATP的多肽。还包括OATPs用于将药物靶向特定器官和调节内源底物浓度的用途。

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