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    • 6. 发明授权
    • Semiconductor device with high-temperature ohmic contact and method of forming the same
    • 具有高温欧姆接触的半导体器件及其形成方法
    • US06320265B1
    • 2001-11-20
    • US09290535
    • 1999-04-12
    • Utpal K. ChakrabartiGustav E. Derkits, Jr.
    • Utpal K. ChakrabartiGustav E. Derkits, Jr.
    • H01L2348
    • H01L29/45
    • A semiconductor device includes a semiconductor layer, prelayer, refractory layer, and conductive layer. The conductive layer includes an ohmic contact layer, and may also include a barrier layer, of a highly stable, low-resistance element or compound, such as Au or Ti, which is formed on the refractory layer. The refractory layer is a material that does not react with, or dissociate from, either the prelayer or the conductive layer when the semiconductor device is exposed to relatively high temperatures. The refractory layer material may be metal suicides, phosphides, or nitrides. The material of the prelayer is selected to minimize strain between the prelayer, the refractory layer and the semiconductor layer to provide a relatively strong bond between the refractory layer and semiconductor. The prelayer may be selected to provide relatively high current injection to the semiconductor, and may further form a low Schottky barrier height with the semiconductor. Effects from dissociation and/or diffusion of the materials forming the conductive layer to the semiconductor when the semiconductor device is exposed to temperatures above 350° C. may be reduced by employing the refractory layer and prelayer.
    • 半导体器件包括半导体层,预层,耐火层和导电层。 导电层包括欧姆接触层,并且还可以包括形成在耐火层上的高稳定性,低电阻元件或化合物(例如Au或Ti)的阻挡层。 当半导体器件暴露于较高温度时,耐火层是不与预层或导电层发生反应或离解的材料。 难熔层材料可以是金属硅化物,磷化物或氮化物。 选择预层的材料以使前层,耐火层和半导体层之间的应变最小化,以在耐火层和半导体之间提供相对较强的结合。 可以选择预层以向半导体提供相对高的电流注入,并且还可以与半导体形成低肖特基势垒高度。 当半导体器件暴露于高于350℃的温度时,形成导电层的材料的解离和/或扩散对半导体的影响可通过采用耐火层和预层来降低。