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    • 2. 发明授权
    • Wire forming method for semiconductor device
    • 半导体器件的成线方法
    • US5604156A
    • 1997-02-18
    • US560913
    • 1995-11-20
    • U-in ChungJae-duk KimChang-ki Hong
    • U-in ChungJae-duk KimChang-ki Hong
    • H01L21/28H01L21/304H01L21/306H01L21/3205H01L21/768H01L23/532H01L21/44
    • H01L21/76831H01L21/76807H01L21/76843H01L21/76877H01L23/53238H01L23/53257H01L23/5329H01L2924/0002
    • A wire forming method for a semiconductor device includes the steps of depositing an insulation material on a semiconductor substrate and patterning the insulation material to form a first insulation layer, forming a lower capping layer on the first insulation layer, etching the lower capping layer and the first insulation layer to form a first contact hole that exposes a first part of the semiconductor substrate, forming a wire layer over the capping layer and the first part of the semiconductor substrate, performing a chemical and mechanical polishing (CMP) process with respect to the wire layer and the lower capping layer to expose the first insulation layer, forming a second insulation layer over the wire layer and the first insulation layer, and etching the first and second insulation layers to form a second contact hole that exposes a second part of the semiconductor substrate. The wire forming method can prevent the lifting of the wire layer, the splitting of the lower insulation layer, and the formation of a protrusion n the second contact hole.
    • 一种用于半导体器件的线形成方法包括以下步骤:在半导体衬底上沉积绝缘材料并图案化绝缘材料以形成第一绝缘层,在第一绝缘层上形成下覆盖层,蚀刻下封盖层和 第一绝缘层以形成暴露半导体衬底的第一部分的第一接触孔,在覆盖层和半导体衬底的第一部分上方形成引线层,对相对于第二绝缘层进行化学和机械抛光(CMP)处理 线层和下覆盖层以暴露第一绝缘层,在导线层和第一绝缘层上形成第二绝缘层,并蚀刻第一和第二绝缘层以形成第二接触孔,其暴露第二绝缘层的第二部分 半导体衬底。 线形成方法可以防止线层的提升,下绝缘层的分离,以及在第二接触孔处形成突起。
    • 7. 发明申请
    • Semiconductor structures including accumulations of silicon boronide and related methods
    • 半导体结构包括硅化硼的积累和相关方法
    • US20070215959A1
    • 2007-09-20
    • US11713877
    • 2007-03-05
    • Jin-Wook LeeChang-Woo RyooTai-Su ParkU-In ChungYu-Gyun Shin
    • Jin-Wook LeeChang-Woo RyooTai-Su ParkU-In ChungYu-Gyun Shin
    • H01L29/94
    • H01L29/4941H01L21/28061
    • A semiconductor device may include a semiconductor substrate, first and second source/drain regions on a surface of the semiconductor substrate, and a channel region on the surface of the semiconductor substrate with the channel region between the first and second source/drain regions. An insulating layer pattern may be on the channel region, a first conductive layer pattern may be on the insulating layer, and a second conductive layer pattern may be on the first conductive layer pattern. The insulating layer pattern may be between the first conductive layer pattern and the channel region, and the first conductive layer pattern may include boron doped polysilicon with a surface portion having an accumulation of silicon boronide. The first conductive layer pattern may be between the second conductive layer pattern and the insulating layer pattern, and the second conductive layer pattern may include tungsten. Related methods are also discussed.
    • 半导体器件可以包括半导体衬底,半导体衬底的表面上的第一和第二源极/漏极区域以及在第一和第二源极/漏极区域之间具有沟道区域的半导体衬底的表面上的沟道区域。 绝缘层图案可以在沟道区上,第一导电层图案可以在绝缘层上,并且第二导电层图案可以在第一导电层图案上。 绝缘层图案可以在第一导电层图案和沟道区之间,并且第一导电层图案可以包括硼掺杂多晶硅,表面部分具有硅化硼的积累。 第一导电层图案可以在第二导电层图案和绝缘层图案之间,并且第二导电层图案可以包括钨。 还讨论了相关方法。