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    • 5. 发明授权
    • Method for depositing a platinum layer on a silicon wafer
    • 在硅晶片上沉积铂层的方法
    • US5981390A
    • 1999-11-09
    • US914397
    • 1997-08-19
    • Dong Su LeeDong il ChunDong Yeon ParkJo Woong HaEui Joon YoonMin Hong KimHyun Jung Woo
    • Dong Su LeeDong il ChunDong Yeon ParkJo Woong HaEui Joon YoonMin Hong KimHyun Jung Woo
    • H01L21/285H01L21/203H01L21/28H01L21/288H01L21/316H01L21/3205H01L41/08H01L41/09H01L21/283H01L21/477
    • C23C14/5806C23C14/14H01L21/32051
    • The present invention relates to a method of depositing a platinum thin-film on a silicon wafer. The method includes the steps of depositing a platinum layer on an insulating oxide layer under an oxidation atmosphere to form a mixture film consisted of platinum grains, platinum oxide grains and oxygen adhered to those grains (hereinafter, "the mixture film" to be referred as "oxygen containing platinum thin-film"); depositing an additional platinum thin-film to a desired thickness on the oxygen containing platinum thin-film under a complete inert atmosphere; and annealing the silicon substrate at a temperature of 400 to 1,300.degree. C. in order to remove oxygen present in the independent form or in platinum oxide form within the oxygen containing platinum thin-film and to stabilize the entire platinum thin-film. The oxygen containing platinum thin-film layer serves as a glue layer during the depositing step of additional platinum thin-film layer and is converted into pure platinum condition after the annealing step, whereby the silicon substrate substantially does not have any glue layer between the platinum layer and the insulating layer of the silicon substrate.
    • 本发明涉及在硅晶片上沉积铂薄膜的方法。 该方法包括以下步骤:在氧化气氛下在绝缘氧化物层上沉积铂层,形成由铂颗粒,氧化铂颗粒和附着在这些晶粒上的氧构成的混合膜(以下将“混合膜”称为 “含氧铂金薄膜”); 在完全惰性气氛下在含氧铂薄膜上沉积另外的铂薄膜至所需厚度; 并在400〜1300℃的温度下退火硅衬底,以便除去含氧铂金薄膜中独立形式或氧化铂形式存在的氧并稳定整个铂薄膜。 含铂的铂薄膜层在附加的铂薄膜层的沉积步骤中用作胶层,并且在退火步骤之后转化为纯铂状态,由此硅衬底在铂之间基本上不具有任何胶层 层和硅衬底的绝缘层。
    • 9. 发明申请
    • Apparatus and Method for Measuring Curvature Using Multiple Beams
    • 使用多个光束测量曲率的装置和方法
    • US20080186512A1
    • 2008-08-07
    • US11995561
    • 2006-08-01
    • Bong KeeEui-Joon Yoon
    • Bong KeeEui-Joon Yoon
    • G01B11/14G01B11/24
    • G01B11/25
    • There is provided a curvature measuring apparatus and method using multiple beams. m×n multiple beams generated by an m×n laser diode (LD) array or an m×n vertical cavity surface emitting laser array having a uniform pitch are converted into multiple divergent or multiple parallel beams. The multiple beams strike and reflect from the surface of a thin film formed on a substrate Then, the multiple beams are detected by an m×n spot array in a detector such as a charge coupled device (CCD) or a CMOS image sensor. The spot spacing between the beams in the array is measured in a direction parallel to the incident plane. The spot spacing between the beams is changed by the curvature of the substrate in the direction parallel to the incident plane and the curvature may be expressed by a function including change in beam spacing, an incident angle, a distance between the surface of the thin film and the detector. These values can be measured and the curvature of the surface of the thin film can be obtained from these values. Since an m×n two-dimensional spot array is used, it is possible to obtain a two-dimensional curvature profile of the surface of the thin film.
    • 提供了使用多个光束的曲率测量装置和方法。 由具有均匀间距的mxn激光二极管(LD)阵列或mxn垂直腔表面发射激光器阵列产生的多个光束被转换成多个发散或多个平行光束。 多个光束从形成在基板上的薄膜的表面射出并反射。然后,多个光束通过诸如电荷耦合器件(CCD)或CMOS图像传感器的检测器中的mxn光点阵列检测。 在平行于入射平面的方向上测量阵列中的光束之间的光点间隔。 光束之间的光斑间隔在平行于入射平面的方向上被基板的曲率改变,并且曲率可以由包括光束间隔的变化,入射角,薄膜表面之间的距离 和检测器。 可以测量这些值,并且可以从这些值获得薄膜表面的曲率。 由于使用了mxn二维光点阵列,所以可以获得薄膜表面的二维曲率轮廓。