会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • In-situ Gettering Method for Removing Metal Impurities from the Surface and Interior of a Upgraded Metallurgical Grade Silicon Wafer
    • 用于从表面和内部升级的冶金级硅晶片上去除金属杂质的原位吸气方法
    • US20130149843A1
    • 2013-06-13
    • US13313124
    • 2011-12-07
    • Jin-Jang JhengTsun-Neng YangChin-Chen Chiang
    • Jin-Jang JhengTsun-Neng YangChin-Chen Chiang
    • H01L21/322
    • H01L21/3221
    • An in-situ gettering method for removing impurities from the surface and interior of a upgraded metallurgical grade silicon wafer is continuously conducted in a reaction chamber. Chloride gas is mixed with carrier gas. The gaseous mixture is used to clean the surface of the silicon wafer. Then, the gaseous mixture is used to form a porous structure on the surface of the silicon wafer before hot annealing is executed. Finally, the gaseous mixture is used to execute hot etching on the surface of the silicon wafer and remove the porous structure from the surface of the silicon wafer. As the chloride gas is used to clean the surface of the silicon wafer and form the porous structure on the surface of the silicon wafer, external gettering is improved. Moreover, interstitial-type metal impurities are effectively removed from the interior of the silicon wafer.
    • 在反应室中连续进行用于从升级的冶金级硅晶片的表面和内部除去杂质的原位吸气方法。 氯化物气与载气混合。 气态混合物用于清洁硅晶片的表面。 然后,在执行热退火之前,气态混合物用于在硅晶片的表面上形成多孔结构。 最后,气态混合物用于在硅晶片的表面上执行热蚀刻,并从硅晶片的表面去除多孔结构。 由于氯化物气体用于清洁硅晶片的表面,并且在硅晶片的表面上形成多孔结构,所以外部吸气性得到改善。 此外,有效地从硅晶片的内部除去间隙型金属杂质。
    • 5. 发明授权
    • Method of reducing metal impurities of upgraded metallurgical grade silicon wafer by using epitaxial silicon film
    • 通过使用外延硅膜降低升级冶金级硅晶片的金属杂质的方法
    • US07972942B1
    • 2011-07-05
    • US12887665
    • 2010-09-22
    • Tsun-Neng Yang
    • Tsun-Neng Yang
    • H01L21/322
    • H01L21/3221Y10S257/913
    • Metal impurities of an upgraded metallurgical grade (UMG) silicon (Si) wafer are reduced. The UMG Si wafer having a 5N (99.999%) purity is chosen to grow a high-quality epitaxial Si thin film through atmospheric pressure chemical vapor deposition (APCVD). Through heat treating diffusion, the epitaxial Si film is used to form sink positions for the metal impurities in the UMG Si wafer. By using concentration gradient, temperature gradient and interface defect, individual and comprehensive effects are built for enhancing purity of the UMG Si wafer from 5N to 6N. Thus, a low-cost Si wafer can be fabricated for Si-based solar cell through a simple, fast and effective method.
    • 升级冶金级(UMG)硅(Si)晶片的金属杂质减少。 选择具有5N(99.999%)纯度的UMG Si晶片,以通过大气压化学气相沉积(APCVD)生长高品质外延Si薄膜。 通过热处理扩散,外延Si膜用于形成UMG Si晶片中的金属杂质的吸收位置。 通过使用浓度梯度,温度梯度和界面缺陷,建立了个体和综合效应,以提高UMG Si晶片的5N至6N的纯度。 因此,可以通过简单,快速和有效的方法制造用于Si基太阳能电池的低成本Si晶片。