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    • 2. 发明申请
    • TEST APPARATUS AND TEST METHOD
    • 测试装置和测试方法
    • US20110298630A1
    • 2011-12-08
    • US12857488
    • 2010-08-16
    • Toshiyuki KIYOKAWAToshikazu OKAWA
    • Toshiyuki KIYOKAWAToshikazu OKAWA
    • G08B21/00H01H31/02G01R31/00G01R31/02
    • H01L21/67207G01R31/2862G01R31/2868H01L21/67173H01L21/67276
    • A test apparatus comprising a plurality of test units that test a device under test; a plurality of housing sections that respectively house the test units therein; a plurality of opening/closing sections that are disposed respectively in the housing sections and that expose the test units to the outside or isolate the test units from the outside; and a control section that independently controls whether each of the opening/closing sections is allowed to be opened. The control section may allow test units that are not supplied with power to be exposed to the outside. For at least one of (i) a period during which one of the test units is performing a predetermined operation, (ii) a predetermined period before the period during which one of the test units is performing the predetermined operation, and (iii) a predetermined period after the period during which one of the test units is performing the predetermined operation, the control section may prohibit other test units from being exposed to the outside.
    • 一种测试装置,包括测试被测设备的多个测试单元; 分别容纳测试单元的多个壳体部分; 多个打开/关闭部分,分别设置在壳体部分中并将测试单元暴露于外部或将测试单元与外部隔离; 以及控制部,其独立地控制是否允许打开/关闭部分。 控制部分可以允许没有供电的测试单元暴露于外部。 对于(i)其中一个测试单元正在执行预定操作的周期中的至少一个,(ii)测试单元之一执行预定操作的时段之前的预定时间段,以及(iii) 一个测试单元执行预定操作的期间之后的预定时间段,控制部分可以禁止其他测试单元暴露于外部。
    • 3. 发明授权
    • Test section for use in an IC handler
    • 用于IC处理程序的测试部分
    • US5742168A
    • 1998-04-21
    • US691724
    • 1996-08-02
    • Toshiyuki KiyokawaKeiichi Fukumoto
    • Toshiyuki KiyokawaKeiichi Fukumoto
    • G01R1/067G01R31/02
    • G01R1/06705
    • A test section for use in an IC handler capable of testing even high speed operating IC devices with precision is provided. A mounting fixture 62 for connecting a test head 32 of an IC tester with the constant temperature chamber 20 of the IC handler is configured to be detachable with respect to the base 10a of the body of the IC handler, and a socket guide 70 having IC sockets mounted therein is also configured to be detachable with respect to the mounting fixture 62. With this construction, it is possible to minimize the length of the electric path between the performance board 35 and the terminals of the IC sockets. In addition, the IC sockets may be mounted even directly on the performance board 35. It is thus possible to carry out the testing utilizing all types of test heads by preparing various mounting fixtures matching with the test heads used.
    • 提供了一种用于能够精确测试高速操作IC器件的IC处理器的测试部分。 用于将IC测试器的测试头32与IC处理器的恒温室20连接的安装固定件62被配置为可相对于IC处理器的主体的基座10a拆卸,并且具有IC 安装在其中的插座也被构造成相对于安装固定件62可拆卸。利用这种结构,可以使性能板35和IC插座的端子之间的电路的长度最小化。 此外,IC插座甚至可以直接安装在性能板35上。因此,可以通过准备与所使用的测试头相匹配的各种安装夹具,来实现利用所有类型的测试头的测试。
    • 5. 发明申请
    • WAFER TRAY AND TEST APPARATUS
    • WAFER托盘和测试装置
    • US20110043237A1
    • 2011-02-24
    • US12881137
    • 2010-09-13
    • Toshiyuki KIYOKAWAYoshiharu UMEMURA
    • Toshiyuki KIYOKAWAYoshiharu UMEMURA
    • G01R31/00
    • H01L21/67207G01R31/2893H01L21/67346H01L21/681
    • In order to shorten testing time of a plurality of devices under test formed on a semiconductor wafer, a wafer tray used by a test apparatus performing the test is provided. The wafer tray includes a first flow passage for fixing the semiconductor wafer to the wafer tray using vacuum suction, a second flow passage for fixing the wafer tray to the test apparatus using vacuum suction, and a heater for heating a loading surface on which at least the semiconductor wafer is loaded. By using this wafer tray, the semiconductor wafer, which is the object being tested, can be smoothly attached to and detached from different test heads, and testing can be begun quickly after the semiconductor wafer is attached to a test head.
    • 为了缩短形成在半导体晶片上的多个待测器件的测试时间,提供了由执行测试的测试设备使用的晶片托盘。 晶片托盘包括用于使用真空抽吸将半导体晶片固定到晶片托盘的第一流动通道,用于使用真空抽吸将晶片托盘固定到测试装置的第二流动通道,以及加热器,用于加热装载表面至少 加载半导体晶片。 通过使用该晶片托盘,作为被测定对象的半导体晶片能够平滑地安装到不同的测试头上并从其拆卸,并且可以在将半导体晶片安装到测试头之后快速开始测试。
    • 6. 发明申请
    • Image sensor test apparatus
    • 图像传感器测试仪
    • US20070159532A1
    • 2007-07-12
    • US10599374
    • 2004-03-31
    • Toshiyuki Kiyokawa
    • Toshiyuki Kiyokawa
    • H04N17/00
    • G01M11/00G01R31/2641H01L27/14618H01L2224/16225H04N5/2257H04N17/002
    • An image sensor test apparatus that emits light to a light receiving surface of an image sensor (DUT) and inputs and outputs electrical signals from a contact part to input and output terminals of the image sensor so as to test the image sensor (DUT) for optical characteristics, which captures an image of the image sensor (DUT) in the state held by a contact arm (315) by a first camera (326), recognizes a relative position of the image sensor (DUT) with respect to the contact part by image processing, adds a precalculated amount of deviation of an optical axis of the image sensor (DUT) with respect to an optical axis of a light source to that relative position to calculate an amount of alignment of the image sensor (DUT), drives a drive unit (322) based on this, and moves a holding side arm (317) abutting against a movable stage (321) with a lock-and L-free mechanism (318) in a free state.
    • 一种图像传感器测试装置,其将光发射到图像传感器(DUT)的光接收表面,并将电信号从接触部分输入和输出到图像传感器的输入和输出端,以便测试图像传感器 在由第一照相机(326)由接触臂(315)保持的状态下捕获图像传感器(DUT)的图像的光学特性识别图像传感器(DUT)相对于接触部分的相对位置 通过图像处理,将相对于光源的光轴的图像传感器(DUT)的光轴的预先计算量的偏移量添加到该相对位置,以计算图像传感器(DUT)的对准量,驱动 基于此的驱动单元(322),并且在自由状态下将与锁定-L无机构(318)抵靠在可动台(321)上的保持侧臂(317)移动。
    • 7. 发明申请
    • Electronic part test apparatus
    • 电子零件测试仪器
    • US20050151551A1
    • 2005-07-14
    • US10505959
    • 2002-12-03
    • Hiroshi OkudaToshiyuki KiyokawaHaruki Nakajima
    • Hiroshi OkudaToshiyuki KiyokawaHaruki Nakajima
    • G01R31/26G01R31/01H01L21/66G01R31/02
    • G01R31/01G01R31/2851G01R31/2886G01R31/2887G01R31/2893
    • A holding side contact arm (317) for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera (326) of an alignment device (320), the IC to be tested is inserted to a first opening (321a) formed on an alignment movable portion (321), and a contact member (317d) of the holding side contact arm (317) is brought to contact the alignment movable portion (321). Then, an alignment amount for correcting a position of the IC to be tested is calculated by taking an image by the camera (326) and performing image processing. A lock-and-free means (318) provided to a first contact arm (315a1) is made to be in a non-restricted state, a movable portion driving device (322) is driven based on the alignment amount, and the holding side contact arm (317) contacting the alignment movable portion (321) is moved with respect to a root side contact arm (316), so that alignment of a position of the IC to be tested is performed.
    • 用于保持待测试的IC的保持侧接触臂(317)位于对准装置(320)的对准CCD照相机(326)的光轴(OP)上,待测试的IC被插入到第一 形成在对准可动部(321)上的开口(321a)和保持侧接触臂(317)的接触部件(317d)与对准可动部(321)接触。 然后,通过摄像机(326)拍摄图像并进行图像处理来计算用于校正待测试IC的位置的对准量。 设置到第一接触臂(315a,1N)的无锁装置(318)被制成处于非限制状态,可动部分驱动装置(322)被驱动为基于 并且与对准可动部(321)接触的保持侧接触臂(317)相对于根侧接触臂(316)移动,从而进行被测试IC的位置的对准 。