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1. 外观设计

USD442568S1 IC module insert 失效
标题翻译： IC模块插入
公开(公告)号：USD442568S1
公开(公告)日：2001-05-22
申请号：US29120362
申请日：2000-03-20
申请人： Yoshiyuki Masuo , Toshiyuki Kiyokawa , Hiroyuki Takahashi
设计人： Yoshiyuki Masuo , Toshiyuki Kiyokawa , Hiroyuki Takahashi

2. 发明授权

US06313653B1 IC chip tester with heating element for preventing condensation 失效
标题翻译：具有防止冷凝的加热元件的IC芯片测试仪
公开(公告)号：US06313653B1
公开(公告)日：2001-11-06
申请号：US09328499
申请日：1999-06-09
申请人： Hiroyuki Takahashi , Akio Kojima , Toshiyuki Kiyokawa
发明人： Hiroyuki Takahashi , Akio Kojima , Toshiyuki Kiyokawa
IPC分类号： G01R3102
CPC分类号： G01R31/2877 , G01R1/0433 , G01R31/01 , G01R31/2806 , G01R31/2863 , G01R31/2865 , G01R31/2867
摘要： An IC chip testing apparatus provided with an IC socket to which an IC chip is brought into electrical contact, a printed circuit board with one terminal which is electrically connected to a terminal of a test head and with another terminal which is electrically connected to a terminal of the IC socket, and a heating element provided at the printed circuit board. The IC chip testing apparatus may be provided with a socket to which an IC chip to be tested is detachably mounted; a socket guide; a chamber opening to which the socket guide is attached so that an IC chip mounting opening of the socket faces inside a chamber which is maintained at a predetermined state less than ordinary temperature; a printed circuit board; and a heating board which is provided around the chamber opening.
摘要翻译：一种IC芯片测试装置，其具有与IC芯片电接触的IC插座，印刷电路板，一个端子电连接到测试头的端子，另一个端子电连接到端子的IC插座，以及设置在印刷电路板上的加热元件。 IC芯片测试装置可以设置有可拆卸地安装有待测试的IC芯片的插座; 插座指南安装有插座引导件的室开口，使得插座的IC芯片安装开口朝向保持在小于常温的预定状态的室内; 印刷电路板; 以及设置在室开口周围的加热板。

3. 发明授权

US5742168A Test section for use in an IC handler 失效
标题翻译：用于IC处理程序的测试部分
公开(公告)号：US5742168A
公开(公告)日：1998-04-21
申请号：US691724
申请日：1996-08-02
申请人： Toshiyuki Kiyokawa , Keiichi Fukumoto
发明人： Toshiyuki Kiyokawa , Keiichi Fukumoto
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： G01R1/06705
摘要： A test section for use in an IC handler capable of testing even high speed operating IC devices with precision is provided. A mounting fixture 62 for connecting a test head 32 of an IC tester with the constant temperature chamber 20 of the IC handler is configured to be detachable with respect to the base 10a of the body of the IC handler, and a socket guide 70 having IC sockets mounted therein is also configured to be detachable with respect to the mounting fixture 62. With this construction, it is possible to minimize the length of the electric path between the performance board 35 and the terminals of the IC sockets. In addition, the IC sockets may be mounted even directly on the performance board 35. It is thus possible to carry out the testing utilizing all types of test heads by preparing various mounting fixtures matching with the test heads used.
摘要翻译：提供了一种用于能够精确测试高速操作IC器件的IC处理器的测试部分。用于将IC测试器的测试头32与IC处理器的恒温室20连接的安装固定件62被配置为可相对于IC处理器的主体的基座10a拆卸，并且具有IC 安装在其中的插座也被构造成相对于安装固定件62可拆卸。利用这种结构，可以使性能板35和IC插座的端子之间的电路的长度最小化。此外，IC插座甚至可以直接安装在性能板35上。因此，可以通过准备与所使用的测试头相匹配的各种安装夹具，来实现利用所有类型的测试头的测试。

4. 发明授权

US08513962B2 Wafer tray and test apparatus 有权
标题翻译：晶圆托盘和测试仪器
公开(公告)号：US08513962B2
公开(公告)日：2013-08-20
申请号：US12881137
申请日：2010-09-13
申请人： Toshiyuki Kiyokawa , Yoshiharu Umemura
发明人： Toshiyuki Kiyokawa , Yoshiharu Umemura
IPC分类号： G01R31/00
CPC分类号： H01L21/67207 , G01R31/2893 , H01L21/67346 , H01L21/681
摘要： In order to shorten testing time of a plurality of devices under test formed on a semiconductor wafer, a wafer tray used by a test apparatus performing the test is provided. The wafer tray includes a first flow passage for fixing the semiconductor wafer to the wafer tray using vacuum suction, a second flow passage for fixing the wafer tray to the test apparatus using vacuum suction, and a heater for heating a loading surface on which at least the semiconductor wafer is loaded. By using this wafer tray, the semiconductor wafer, which is the object being tested, can be smoothly attached to and detached from different test heads, and testing can be begun quickly after the semiconductor wafer is attached to a test head.
摘要翻译：为了缩短形成在半导体晶片上的多个待测器件的测试时间，提供了由执行测试的测试设备使用的晶片托盘。晶片托盘包括用于使用真空抽吸将半导体晶片固定到晶片托盘的第一流动通道，用于使用真空抽吸将晶片托盘固定到测试装置的第二流动通道，以及加热器，用于加热装载表面至少加载半导体晶片。通过使用该晶片托盘，作为被测定对象的半导体晶片能够平滑地安装到不同的测试头上并从其拆卸，并且可以在将半导体晶片安装到测试头之后快速开始测试。

5. 发明授权

US06445203B1 Electric device testing apparatus 失效
标题翻译：电器测试仪器
公开(公告)号：US06445203B1
公开(公告)日：2002-09-03
申请号：US09456408
申请日：1999-12-08
申请人： Tsuyoshi Yamashita , Yoshihito Kobayashi , Toshiyuki Kiyokawa , Hiroto Nakamura , Noriyuki Igarashi , Kenichi Shimada
发明人： Tsuyoshi Yamashita , Yoshihito Kobayashi , Toshiyuki Kiyokawa , Hiroto Nakamura , Noriyuki Igarashi , Kenichi Shimada
IPC分类号： G01R3102
CPC分类号： G01R31/2874 , G01R31/2806 , G01R31/2856 , G01R31/2863
摘要： An electric device testing apparatus comprises a connection terminal to which an IC chip to be tested is removably connected, a pusher for pushing the IC chip in the direction of the connection terminal in order to connect the IC chip to the connection terminal, and temperature adjusted air supply for blowing a temperature adjusted air to around the IC chip during a test on the IC chip via a through hole formed on the pushed.
摘要翻译：一种电气设备测试装置，包括：被测试的IC芯片可拆卸地连接到的连接端子，用于沿着连接端子的方向推动IC芯片的推动器，以将IC芯片连接到连接端子，并且温度调节用于在通过形成在所述推动件上的通孔对IC芯片进行测试期间将温度调节的空气吹送到IC芯片周围。

6. 发明授权

US5812409A Semiconductor device transport system with deformed tray compensation 失效
标题翻译：具有变形托盘补偿的半导体装置运输系统
公开(公告)号：US5812409A
公开(公告)日：1998-09-22
申请号：US916015
申请日：1997-08-21
申请人： Yukio Kanno , Toshiyuki Kiyokawa
发明人： Yukio Kanno , Toshiyuki Kiyokawa
IPC分类号： B25J13/00 , B23Q15/24 , H01L21/50 , H05K13/02 , H05K13/04 , G01R31/28
CPC分类号： B23Q15/24 , H05K13/0413
摘要： A semiconductor device transporting and handling apparatus is provided which provides for positively grasping and transporting an IC out of a tray loaded with ICs, even if the tray is tilted due to deformations an/or distortions, by the use of a carrier head which is vertically movable through constant strokes. The tilt of the tray is measured by attitude gauging means comprising four sets of optical sensors, the altitude differences of the top surfaces of ICs accommodated in the tray with respect to a reference level are calculated by altitude difference calculating means, and the calculated altitude differences are stored in altitude difference storage means. Once an IC being picked up has been identified, the altitude difference of the identified IC with respect to the reference level is read out, and the position of the tray is moved vertically to conform with the reference level by altitude difference correcting means to insure that the carrier head can pick up the IC.
摘要翻译：提供一种半导体器件输送和处理装置，其通过使用垂直方向的载体头，即使托盘由于变形和/或变形而变形而使IC从装载有IC的托盘中正确地抓取和运送IC 通过恒定的行程移动。托盘的倾斜度通过包括四组光学传感器的姿态测量装置来测量，由高度差计算装置计算相对于参考水平容纳在托盘中的IC的顶面的高度差，计算出的高度差存储在高度差存储装置中。一旦已经识别到被拾取的IC，则读出识别的IC相对于参考水平的高度差，并且通过高度差校正装置使托盘的位置垂直移动以与参考水平一致，以确保载波头可以接收IC。

7. 发明授权

US5722514A Tray installation rack for test handler 失效
标题翻译：托盘安装架用于测试处理器
公开(公告)号：US5722514A
公开(公告)日：1998-03-03
申请号：US636269
申请日：1996-04-26
申请人： Toshiyuki Kiyokawa
发明人： Toshiyuki Kiyokawa
IPC分类号： G01R31/26 , B65G57/00 , B65G59/02 , G01R1/067 , H01L21/673 , H01L21/677 , H01L21/68 , H05K13/00 , B66B9/02
CPC分类号： G01R1/06705 , H05K13/0084
摘要： A tray installation rack is used for a test handler to install therein a plurality of trays each of which has a large number of IC devices to be tested. The tray installation rack includes, a main base fixed to the test handler, a slide base slidably mounted on the main base and has a floor for receiving the trays thereon, a pair of tray guide bars perpendicularly mounted on the slide base to meet two adjacent sides of the trays for limiting movements of the trays in two horizontal directions, a pair of tray adjust bars slidably provided on the slide base to press the trays against the pair of guide bars in the two horizontal directions, an elevator provided on the test handler to lift the trays in a vertical direction in the tray installation rack until an uppermost tray exceeds top ends of the tray guide bars, a pair of tray pushers provided at top portions of the tray adjust bars, and tray standard members mounted on the main base at immediately above the top ends of the tray guide bars to restrict movements of the uppermost tray in the two horizontal directions, wherein the uppermost tray is positioned when the uppermost tray is pressed by the tray pushers against the tray standard members.
摘要翻译：托盘安装架用于测试处理器以在其中安装多个托盘，每个托盘具有大量待测试的IC器件。托盘安装架包括：固定到测试处理器的主基座，可滑动地安装在主基座上的滑动基座，并具有用于在其上容纳托盘的底板;一对托盘引导杆，垂直地安装在滑动基座上以满足两个相邻的用于限制托盘在两个水平方向的运动的托盘的一侧，一对托盘调节杆，可滑动地设置在滑动基座上，以在两个水平方向上将托盘按压在一对导杆上;设置在测试处理器在托盘安装架中垂直方向提起托盘，直到最上面的托盘超过托盘引导杆的顶端，设置在托盘调节杆顶部的一对托盘推动器和安装在主基座上的托盘标准件在托盘引导杆的上端的正上方，限制最上面的托盘在两个水平方向上的移动，其中最上面的托盘定位在最上面的托盘是pr 托盘推动器与托盘标准成员配合。

8. 发明授权

US09121901B2 Semiconductor wafer test apparatus 有权
标题翻译：半导体晶圆试验装置
公开(公告)号：US09121901B2
公开(公告)日：2015-09-01
申请号：US13148971
申请日：2009-02-12
申请人： Toshiyuki Kiyokawa , Takashi Naito
发明人： Toshiyuki Kiyokawa , Takashi Naito
IPC分类号： G01R31/00 , G01R31/28 , H01L21/683
CPC分类号： G01R31/2893 , G01R31/2886 , G01R31/2887 , G01R31/2891 , H01L21/683
摘要： An apparatus includes a plurality of test heads to which probe cards are electrically connected; a wafer tray which is able to hold a semiconductor wafer; and an alignment apparatus which positions the semiconductor wafer held on the wafer tray relatively with respect to the probe card so as to make the wafer tray face the probe card. The wafer tray has a pressure reducing mechanism which pulls the wafer tray toward the probe card. The alignment apparatus is configured to be able to move along the array direction of the test heads.
摘要翻译：一种装置包括多个测试头，探针卡电连接到该测试头上; 能够保持半导体晶片的晶片托盘; 以及对准装置，其将保持在晶片托盘上的半导体晶片相对于探针卡相对定位，以使晶片托盘面向探针卡。晶片托盘具有将晶片托盘朝向探针卡拉动的减压机构。对准装置被构造成能够沿着测试头的排列方向移动。

9. 发明申请

US20070159532A1 Image sensor test apparatus 审中-公开
标题翻译：图像传感器测试仪
公开(公告)号：US20070159532A1
公开(公告)日：2007-07-12
申请号：US10599374
申请日：2004-03-31
申请人： Toshiyuki Kiyokawa
发明人： Toshiyuki Kiyokawa
IPC分类号： H04N17/00
CPC分类号： G01M11/00 , G01R31/2641 , H01L27/14618 , H01L2224/16225 , H04N5/2257 , H04N17/002
摘要： An image sensor test apparatus that emits light to a light receiving surface of an image sensor (DUT) and inputs and outputs electrical signals from a contact part to input and output terminals of the image sensor so as to test the image sensor (DUT) for optical characteristics, which captures an image of the image sensor (DUT) in the state held by a contact arm (315) by a first camera (326), recognizes a relative position of the image sensor (DUT) with respect to the contact part by image processing, adds a precalculated amount of deviation of an optical axis of the image sensor (DUT) with respect to an optical axis of a light source to that relative position to calculate an amount of alignment of the image sensor (DUT), drives a drive unit (322) based on this, and moves a holding side arm (317) abutting against a movable stage (321) with a lock-and L-free mechanism (318) in a free state.
摘要翻译：一种图像传感器测试装置，其将光发射到图像传感器（DUT）的光接收表面，并将电信号从接触部分输入和输出到图像传感器的输入和输出端，以便测试图像传感器在由第一照相机（326）由接触臂（315）保持的状态下捕获图像传感器（DUT）的图像的光学特性识别图像传感器（DUT）相对于接触部分的相对位置通过图像处理，将相对于光源的光轴的图像传感器（DUT）的光轴的预先计算量的偏移量添加到该相对位置，以计算图像传感器（DUT）的对准量，驱动基于此的驱动单元（322），并且在自由状态下将与锁定-L无机构（318）抵靠在可动台（321）上的保持侧臂（317）移动。

10. 发明申请

US20050151551A1 Electronic part test apparatus 有权
标题翻译：电子零件测试仪器
公开(公告)号：US20050151551A1
公开(公告)日：2005-07-14
申请号：US10505959
申请日：2002-12-03
申请人： Hiroshi Okuda , Toshiyuki Kiyokawa , Haruki Nakajima
发明人： Hiroshi Okuda , Toshiyuki Kiyokawa , Haruki Nakajima
IPC分类号： G01R31/26 , G01R31/01 , H01L21/66 , G01R31/02
CPC分类号： G01R31/01 , G01R31/2851 , G01R31/2886 , G01R31/2887 , G01R31/2893
摘要： A holding side contact arm (317) for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera (326) of an alignment device (320), the IC to be tested is inserted to a first opening (321a) formed on an alignment movable portion (321), and a contact member (317d) of the holding side contact arm (317) is brought to contact the alignment movable portion (321). Then, an alignment amount for correcting a position of the IC to be tested is calculated by taking an image by the camera (326) and performing image processing. A lock-and-free means (318) provided to a first contact arm (315a1) is made to be in a non-restricted state, a movable portion driving device (322) is driven based on the alignment amount, and the holding side contact arm (317) contacting the alignment movable portion (321) is moved with respect to a root side contact arm (316), so that alignment of a position of the IC to be tested is performed.
摘要翻译：用于保持待测试的IC的保持侧接触臂（317）位于对准装置（320）的对准CCD照相机（326）的光轴（OP）上，待测试的IC被插入到第一形成在对准可动部（321）上的开口（321a）和保持侧接触臂（317）的接触部件（317d）与对准可动部（321）接触。然后，通过摄像机（326）拍摄图像并进行图像处理来计算用于校正待测试IC的位置的对准量。设置到第一接触臂（315a，1N）的无锁装置（318）被制成处于非限制状态，可动部分驱动装置（322）被驱动为基于并且与对准可动部（321）接触的保持侧接触臂（317）相对于根侧接触臂（316）移动，从而进行被测试IC的位置的对准。

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