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    • 2. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US07956408B2
    • 2011-06-07
    • US12021003
    • 2008-01-28
    • Toshiyuki EndaHirosyoshi TanimotoTakashi Izumida
    • Toshiyuki EndaHirosyoshi TanimotoTakashi Izumida
    • H01L27/115
    • H01L27/115H01L27/11568H01L27/11578H01L27/11582H01L29/792H01L29/7926
    • A nonvolatile semiconductor memory device relating to one embodiment of this invention includes a substrate, a plurality of memory strings formed on said substrate, said memory string having a first select gate transistor, a plurality of memory cells and a second select gate transistor, said first select gate transistor having a first pillar semiconductor, a first gate insulation layer formed around said first pillar semiconductor and a first gate electrode being formed around said first gate insulation layer; said memory cell having a second pillar semiconductor, a first insulation layer formed around said second pillar semiconductor, a storage layer formed around said first insulation layer, a second insulation layer formed around said storage layer and first to nth electrodes (n is a natural number 2 or more) being formed around said second insulation layer, said first to nth electrodes being spread in two dimensions respectively, said second select gate transistor having a third pillar semiconductor, a second gate insulation layer formed around said third pillar semiconductor and a second gate electrode being formed around said second gate insulation layer, and a channel region of at least either said first select gate transistor or said second select gate transistor formed by an opposite conductive type semiconductor to a source region and a drain region.
    • 关于本发明的一个实施例的非易失性半导体存储器件包括衬底,形成在所述衬底上的多个存储器串,所述存储器串具有第一选择栅晶体管,多个存储单元和第二选择栅晶体管,所述第一 选择具有第一柱状半导体的栅极晶体管,形成在所述第一柱状半导体周围的第一栅极绝缘层和围绕所述第一栅极绝缘层形成的第一栅极电极; 所述存储单元具有第二柱状半导体,围绕所述第二柱状半导体形成的第一绝缘层,围绕所述第一绝缘层形成的存储层,形成在所述存储层和第一至第n电极周围的第二绝缘层(n为自然数) 2个或更多个),所述第一至第n电极分别以两维扩展,所述第二选择栅晶体管具有第三柱半导体,围绕所述第三柱半导体形成的第二栅绝缘层和第二栅极 形成在所述第二栅极绝缘层周围的电极,以及至少所述第一选择栅极晶体管或所述第二选择栅极晶体管的沟道区域,所述沟道区域由相对的导电型半导体形成为源极区域和漏极区域。
    • 6. 发明授权
    • Simulator, simulation and fabrication methods of semiconductor device
and storage medium storing program for executing the simulation method
    • US5889687A
    • 1999-03-30
    • US61867
    • 1998-04-17
    • Toshiyuki Enda
    • Toshiyuki Enda
    • H01L29/00G06F17/00G06F17/50H01L21/00H01L21/02
    • G06F17/5036
    • The present invention provides a device simulation method comprising at least the steps of: inputting a geometry of a semiconductor device, a donor and an acceptor impurity concentrations at each point inside the semiconductor device and also terminal voltages of the semiconductor device (step S101); setting initial values by obtaining electron concentrations n, and n.sub.J and also hole concentrations p.sub.I and p.sub.J with respect to given points I and J respectively inside the semiconductor device and also a potential at each point (step S102); obtaining a voltage difference .PSI..sub.dd across a prescribed segment dd along a segment IJ connecting the points I and J (step S103); calculating an electron current density J.sub.eIJ of the segment IJ by an equation J.sub.eLJ =C.sub.eI .multidot.A(.PHI..sub.edd)-C.sub.eJ .multidot.A(-.PHI..sub.edd) using a constant C.sub.eI dependent on the electron concentration n.sub.J, a constant C.sub.eJ dependent on the electron concentration n.sub.J, and a voltage difference (.PHI..sub.edd =.PSI..sub.dd /NV.sub.e) across the segment dd normalized by an electron's thermal voltage (NV.sub.e =k.multidot.T.sub.e /(-q)) (step S104); calculating a hole current density J.sub.hIJ of the segment IJ by an equation J.sub.hIJ =C.sub.hI .multidot.A(.PHI..sub.hdd)-C.sub.hJ .multidot.A(-.PHI..sub.hdd) using a constant C.sub.hI dependent on the hole concentration p.sub.I, a constant C.sub.hJ dependent on the hole concentration p.sub.J, and a voltage difference ((.PHI..sub.hdd =.PSI..sub.dd /NV.sub.h) across the segment dd normalized by a hole's thermal voltage (NV.sub.h =k.multidot.T.sub.h /q) (step S105); and outputting a terminal current, where A(.PHI.)=1/(exp(.PHI.)+1). The present invention provides also a device simulator that can perform this device simulation method for fabricating semiconductor devices, and a storage medium storing the program to perform this device simulation method. The present invention further provides a device fabrication method employing the device simulation method.
    • 8. 发明申请
    • SIMULATION APPARATUS FOR A SEMICONDUCTOR DEVICE
    • 一种半导体器件的仿真设备
    • US20100169061A1
    • 2010-07-01
    • US12563517
    • 2009-09-21
    • Toshiyuki ENDA
    • Toshiyuki ENDA
    • G06F17/12
    • G06F17/5018G06F2217/78
    • A simulation apparatus of semiconductor device includes a first calculator, a second calculator, a third calculator, a fourth calculator, and a controller. The first calculator applies a voltage to an area which functions as a virtual electrode, and setting a pseudo-Fermi level of a first carrier in the area functioning as the virtual electrode to calculate a first carrier density. The second calculator analyzes continuous equation of a second carrier to calculate a second carrier density. The third calculator uses the first carrier density as a function of an electrostatic potential, and solving a first equation of the function and a Poisson's equation to calculate an electrostatic potential and the first carrier density expressed by the function. The fourth calculator calculates a current density of the first carrier to calculate a current flowing. The controller controls the voltage applied to the virtual electrode.
    • 半导体器件的模拟装置包括第一计算器,第二计算器,第三计算器,第四计算器和控制器。 第一计算器将电压施加到用作虚拟电极的区域,并且在用作虚拟电极的区域中设置第一载体的伪费米能级以计算第一载流子密度。 第二计算器分析第二载波的连续方程式来计算第二载流子密度。 第三计算器使用第一载流子密度作为静电势的函数,并且求解函数的第一方程和泊松方程来计算由该函数表达的静电势和第一载流子密度。 第四计算器计算第一载波的电流密度以计算电流流动。 控制器控制施加到虚拟电极的电压。