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    • 8. 发明专利
    • Pressure-sensitive adhesive tape for electronic part production
    • 用于电子零件生产的压敏胶带
    • JP2013040276A
    • 2013-02-28
    • JP2011178023
    • 2011-08-16
    • Toray Advanced Materials Korea Inc東レ先端素材株式会社
    • IM MIN HOKIM SANG PILLMOON KI JUNGSIM CHANG HOONCHOI SUNG HWAN
    • C09J7/02C09J11/06C09J133/00C09J171/12H01L21/56
    • PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for electronic part production which enables detaping of the pressure-sensitive adhesive tape for electronic part production at normal temperature after a tight resin sealing process without an additional heating process, and satisfies any demand characteristics of a lamination processing condition, and can improve the limit of adhesive residues and sealing resin leakage of the pressure-sensitive adhesive tape used in a production process of an existing electronic part.SOLUTION: The pressure-sensitive adhesive tape for electronic part production includes a heat-resistant base material, and a pressure-sensitive adhesive layer obtained by applying a pressure-sensitive adhesive composition on the heat-resistant base material, wherein the pressure-sensitive adhesive composition contains a phenoxy resin, an acrylic resin, a heat curing agent, an energy ray-curable acrylic resin and a photoinitiator, and the pressure-sensitive adhesive layer is cured by heat curing and an energy ray.
    • 要解决的问题:提供一种用于电子部件生产的压敏粘合带,其能够在紧密的树脂密封过程之后在常温下脱离用于电子部件生产的压敏胶带而不需要额外的加热工艺,以及 满足层压处理条件的任何需求特性,并且可以改善在现有电子部件的生产过程中使用的压敏粘合带的粘合残留物的限制和密封树脂的泄漏。 解决方案:用于电子部件生产的压敏粘合带包括耐热基材和通过在耐热基材上施加压敏粘合剂组合物获得的压敏粘合剂层,其中压力 敏感性粘合剂组合物含有苯氧基树脂,丙烯酸树脂,热固化剂,能量射线固化性丙烯酸树脂和光引发剂,并且通过热固化和能量射线固化该粘合剂层。 版权所有(C)2013,JPO&INPIT