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1. 发明授权

US09099512B2 Article including a device wafer reversibly mountable to a carrier substrate 有权
标题翻译：本文包括可逆地安装到载体衬底的器件晶片
公开(公告)号：US09099512B2
公开(公告)日：2015-08-04
申请号：US12951530
申请日：2010-11-22
申请人： Tony D. Flaim , Jeremy McCutcheon
发明人： Tony D. Flaim , Jeremy McCutcheon
IPC分类号： H01L23/48 , H01L23/52 , H01L29/06 , H01L21/683
CPC分类号： H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2924/0002 , H01L2924/19041 , Y10T428/31678 , H01L2924/00
摘要： New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.
摘要翻译：提供了从这些方法形成的新的临时粘合方法和制品。这些方法包括仅在其外周界处将器件晶片结合到载体晶片或衬底，以便在随后的处理和处理期间有助于保护器件晶片及其器件位置。通过该方法形成的边缘粘合是化学和耐热的，但也可以被软化，溶解或机械破坏，以允许晶片在非常低的力和在室温下或在室温下在制造过程中的适当阶段容易地分离。

2. 发明授权

US08808969B2 Method of making radiation-sensitive sol-gel materials 有权
标题翻译：制造辐射敏感溶胶凝胶材料的方法
公开(公告)号：US08808969B2
公开(公告)日：2014-08-19
申请号：US13443533
申请日：2012-04-10
申请人： Qin Lin , Yubao Wang , Tony D. Flaim
发明人： Qin Lin , Yubao Wang , Tony D. Flaim
IPC分类号： G03F7/26 , G03F7/075 , G03F7/20
CPC分类号： G03F7/075 , G03F7/0045 , G03F7/038 , G03F7/0757 , G03F7/11 , G03F7/20
摘要： Radiation-sensitive sol-gel compositions are provided, along with methods of forming microelectronic structures and the structures thus formed. The compositions comprise a sol-gel compound and a base generator dispersed or dissolved in a solvent system. The sol-gel compound comprises recurring monomeric units comprising silicon with crosslinkable moieties bonded to the silicon. Upon exposure to radiation, the base generator generates a strong base, which crosslinks the sol-gel compound in the compositions to yield a crosslinked layer that is insoluble in developers or solvents. The unexposed portions of the layer can be removed to yield a patterned sol-gel layer. The invention can be used to form patterns from sol-gel materials comprising features having feature sizes of less than about 1 μm.
摘要翻译：提供了辐射敏感的溶胶 - 凝胶组合物，以及形成微电子结构和如此形成的结构的方法。组合物包含分散或溶解在溶剂体系中的溶胶 - 凝胶化合物和碱产生剂。溶胶 - 凝胶化合物包括具有与硅结合的可交联部分的包含硅的重复单体单元。暴露于辐射后，基底发生器产生强碱，其使组合物中的溶胶 - 凝胶化合物交联，得到不溶于显影剂或溶剂的交联层。可以除去该层的未曝光部分以产生图案化的溶胶 - 凝胶层。本发明可用于形成包含特征尺寸小于约1μm的特征的溶胶 - 凝胶材料的图案。

3. 发明授权

US08202442B2 Spin-on protective coatings for wet-etch processing of microelectronic substrates 有权
标题翻译：用于微电子衬底的湿法蚀刻加工的旋涂保护涂层
公开(公告)号：US08202442B2
公开(公告)日：2012-06-19
申请号：US11856552
申请日：2007-09-17
申请人： Chenghong Li , Kimberly A. Yess , Tony D. Flaim
发明人： Chenghong Li , Kimberly A. Yess , Tony D. Flaim
IPC分类号： C03C15/00 , C03C25/68 , H01B13/00 , C23F1/00 , H01L21/31
CPC分类号： B81C1/00539 , C03C15/00 , C03C2218/355 , C09D125/12 , H01L21/3081 , H01L21/31144 , Y10T428/265 , Y10T428/3154 , Y10T428/31544 , Y10T428/31612 , Y10T428/31663 , Y10T428/31678 , Y10T428/31935
摘要： New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and optionally other addition-polymerizable monomers such as (meth)acrylate monomers, vinylbenzyl chloride, and diesters of maleic acid or fumaric acid. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.
摘要翻译：提供了在制造半导体和MEMS器件期间用于湿蚀刻工艺的新的保护涂层。这些层包括底漆层，第一保护层和任选的第二保护层。底漆层优选在溶剂体系中包含有机硅烷化合物。第一保护层包括由苯乙烯，丙烯腈和任选的其它加成聚合单体如（甲基）丙烯酸酯单体，乙烯基苄基氯和马来酸或富马酸的二酯制备的热塑性共聚物。第二保护层包括高度卤化的聚合物，例如氯化聚合物，其在加热时可以或不会交联。

4. 发明授权

US5892096A Non-subliming mid-UV dyes and ultra-thin organic arcs having differential solubility 失效
标题翻译：非升华中紫外线染料和具有差异溶解度的超薄有机电弧
公开(公告)号：US5892096A
公开(公告)日：1999-04-06
申请号：US598711
申请日：1996-02-08
申请人： Jim D. Meador , Xie Shao , Vandana Krishnamurthy , Earnest C. Murphy , Tony D. Flaim , Terry Lowell Brewer
发明人： Jim D. Meador , Xie Shao , Vandana Krishnamurthy , Earnest C. Murphy , Tony D. Flaim , Terry Lowell Brewer
IPC分类号： C07C45/74 , C07C49/84 , C07C255/41 , G03F7/09 , C07C255/09
CPC分类号： G03F7/091 , C07C255/41 , C07C45/74 , C07C49/84
摘要： Mid-UV dyes enabling ultra thin antireflection coatings for multi-layer i-line photoetching are produced from bichalcones; bis-a-cyanoacrylates/bis-cyanoacrylamides; and 1.4 divinylbenzenes. The dyes are nonsubliminal and differentially insoluble in standard photoresist solvents.
摘要翻译：使用双层i线光刻技术实现超薄抗反射涂层的紫外线紫外线染料由双柠檬烯生产; 双氰基丙烯酸酯/双氰基丙烯酰胺; 和1.4二乙烯基苯。染料在标准光刻胶溶剂中是非共沸的和差异不溶的。

5. 发明授权

US5688987A Non-subliming Mid-UV dyes and ultra-thin organic arcs having differential solubility 失效
标题翻译：不升华的中紫外线染料和具有不同溶解度的超薄有机电弧
公开(公告)号：US5688987A
公开(公告)日：1997-11-18
申请号：US336340
申请日：1994-11-09
申请人： Jim D. Meador , Xie Shao , Vandana Krishnamurthy , Earnest C. Murphy , Tony D. Flaim , Terry Lowell Brewer
发明人： Jim D. Meador , Xie Shao , Vandana Krishnamurthy , Earnest C. Murphy , Tony D. Flaim , Terry Lowell Brewer
IPC分类号： C07C45/74 , C07C49/84 , C07C255/41 , G03F7/09 , C07C255/00
CPC分类号： G03F7/091 , C07C255/41 , C07C45/74 , C07C49/84
摘要： Mid-UV dyes enabling ultra thin antireflection coatings for multi-layer i-line photoetching are produced from bichalcones; bis-a-cyanoacrylates/bis-cyanoacrylamides; and 1.4 divinylbenzenes. The dyes are nonsubliminal and differentially insoluble in standard photoresist solvents.
摘要翻译：使用双层i线光刻技术实现超薄抗反射涂层的紫外线紫外线染料由双柠檬烯生产; 双氰基丙烯酸酯/双氰基丙烯酰胺; 和1.4二乙烯基苯。染料在标准光刻胶溶剂中是非共沸的和差异不溶的。

6. 发明授权

US5336925A Positive working polyamic acid/imide photoresist compositions and their use as dielectrics 失效
标题翻译：正加工聚酰胺酸/酰亚胺光致抗蚀剂组合物及其作为电介质的用途
公开(公告)号：US5336925A
公开(公告)日：1994-08-09
申请号：US827342
申请日：1992-01-29
申请人： Mary G. Moss , Terry Brewer , Ruth M. Cuzmar , Dan W. Hawley , Tony D. Flaim
发明人： Mary G. Moss , Terry Brewer , Ruth M. Cuzmar , Dan W. Hawley , Tony D. Flaim
IPC分类号： G03F7/039 , H01L21/312 , H01L23/532 , H01L29/34
CPC分类号： G03F7/039 , H01L21/312 , H01L23/5329 , H01L2924/0002
摘要： Positive working polyamic acid photoresist compositions are disclosed having improved high resolution upon image development and exhibiting stable photosensitivity and superior dielectric performance. The compositions comprise polyamic acid condensation products of an aromatic dianhydride and an aromatic di-primary amine wherein a percentage of the diamine comprises special dissolution inhibiting monomers. The compositions may be further improved by the presence of particular supplemental additives.
摘要翻译：公开了正性工作聚酰胺酸光致抗蚀剂组合物，其在图像显影时具有改进的高分辨率并且表现出稳定的光敏性和优异的介电性能。组合物包含芳族二酐和芳族二伯胺的聚酰胺酸缩合产物，其中一定百分比的二胺包括特殊的溶解抑制单体。通过存在特定的补充添加剂可以进一步改善组合物。

7. 发明授权

US5262195A Soluble conducting polymers and their use in manufacturing electronic devices 失效
标题翻译：可溶性导电聚合物及其在制造电子器件中的应用
公开(公告)号：US5262195A
公开(公告)日：1993-11-16
申请号：US958286
申请日：1992-10-07
申请人： Mary G. Moss , Terry L. Brewer , Tony D. Flaim
发明人： Mary G. Moss , Terry L. Brewer , Tony D. Flaim
IPC分类号： B05D5/12 , C08G73/02 , H01B1/12 , H01C7/00 , H01C17/065 , H01L51/30 , H01M4/60 , C23C26/00
CPC分类号： H01M4/60 , C08G73/0266 , H01B1/128 , H01C17/065 , H01C7/003 , H01L51/0035 , H01L51/05
摘要： Soluble conducting polymers from substituted polyanilines and large organic counterions are disclosed and used directly from solution in the manufacture of electronic devices.
摘要翻译：来自取代的聚苯胺和大的有机抗衡离子的可溶性导电聚合物被公开并直接用于制造电子器件的溶液。

8. 发明授权

US4950583A Adhesion promoting product and process for treating an integrated circuit substrate therewith 失效
标题翻译：用于处理集成电路基板的粘合促进产品和方法
公开(公告)号：US4950583A
公开(公告)日：1990-08-21
申请号：US908360
申请日：1986-09-17
申请人： Terry Brewer , Tony D. Flaim , Mary G. Moss
发明人： Terry Brewer , Tony D. Flaim , Mary G. Moss
IPC分类号： H01L21/312 , G03C1/74 , G03F7/075 , H01L21/027
CPC分类号： G03F7/0751 , Y10S438/948
摘要： An improved method of promoting the adhesion of microelectronic coatings to substrates uses new adhesion promoters, catalysts for adhesion promoters and adjuvant polymers.
摘要翻译：促进微电子涂层对基材粘附的改进方法使用新的粘合促进剂，用于粘合促进剂的催化剂和辅助聚合物。

9. 发明授权

US09111981B2 Method for reversibly mounting a device wafer to a carrier substrate 有权
标题翻译：将器件晶片可逆地安装到载体衬底的方法
公开(公告)号：US09111981B2
公开(公告)日：2015-08-18
申请号：US12358951
申请日：2009-01-23
申请人： Tony D. Flaim , Jeremy McCutcheon
发明人： Tony D. Flaim , Jeremy McCutcheon
IPC分类号： H01L21/30 , H01L21/46 , H01L21/683
CPC分类号： H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2924/0002 , H01L2924/19041 , Y10T428/31678 , H01L2924/00
摘要： New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.
摘要翻译：提供了从这些方法形成的新的临时粘合方法和制品。这些方法包括仅在其外周界处将器件晶片结合到载体晶片或衬底，以便在随后的处理和处理期间有助于保护器件晶片及其器件位置。通过该方法形成的边缘粘合是化学和耐热的，但也可以被软化，溶解或机械破坏，以允许晶片在非常低的力和在室温下或在室温下在制造过程中的适当阶段容易地分离。

10. 发明申请

US20140130969A1 METHODS OF TRANSFERRING DEVICE WAFERS OR LAYERS BETWEEN CARRIER SUBSTRATES AND OTHER SURFACES 有权
标题翻译：在载体基板和其他表面之间传输器件波形或层的方法
公开(公告)号：US20140130969A1
公开(公告)日：2014-05-15
申请号：US14131157
申请日：2012-07-09
申请人： Jeremy McCutcheon , Tony D. Flaim , Susan Bailey
发明人： Jeremy McCutcheon , Tony D. Flaim , Susan Bailey
IPC分类号： B32B38/10 , B32B7/06 , B32B7/14 , B32B43/00 , B32B7/12
CPC分类号： B32B38/10 , B32B7/06 , B32B7/12 , B32B7/14 , B32B43/006 , B32B2457/14 , H01L21/2007 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , Y10T156/11 , Y10T428/24331 , Y10T428/24851 , Y10T428/30 , Y10T428/31598 , Y10T428/31667
摘要： New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.
摘要翻译：提供了从这些方法形成的新的临时粘合方法和制品。在一个实施方案中，所述方法包括用刚性支撑层在生长衬底上涂覆器件或其它超薄层，然后将该堆叠结合到载体衬底。然后可以除去生长衬底，并将超薄层安装在最终的载体上。在另一个实施例中，本发明提供了在处理期间处理装置层的方法，该方法必须在脆性层的两侧出现而不会损坏脆性层。这是通过连续使用两个载体来实现的，一个在器件层的每一侧上，用不同的粘合组合物键合，用于选择性脱粘。

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