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1. 发明授权

US5876273A Apparatus for polishing a wafer 失效
标题翻译：用于抛光晶片的设备
公开(公告)号：US5876273A
公开(公告)日：1999-03-02
申请号：US625291
申请日：1996-04-01
申请人： Hiroyuki Yano , Katsuya Okumura , Norio Kimura , Tomoyuki Yahiro , Hozumi Yasuda
发明人： Hiroyuki Yano , Katsuya Okumura , Norio Kimura , Tomoyuki Yahiro , Hozumi Yasuda
IPC分类号： B24B37/30 , B24B29/02
CPC分类号： B24B37/30
摘要： A polishing apparatus is provided which improves uniformity across the surface of a polished wafer. The apparatus includes a wafer carrier, a guide ring coupled to a lower portion of the wafer carrier, a circular plate coupled to a first inner circumference portion of the guide ring distant from the wafer carrier, and a cavity, formed within an area bounded by the lower portion of the wafer carrier, an inner circumference of the circular plate, and a second inner circumference portion of the guide ring between the circular plate and the lower portion of the wafer carrier, the circular plate holding the wafer to be polished in the cavity.
摘要翻译：提供了一种改善抛光晶片表面均匀性的抛光装置。该装置包括晶片载体，联接到晶片载体的下部的引导环，耦合到远离晶片载体的引导环的第一内周部分的圆形板，以及形成在由晶片载体的下部，圆形板的内圆周和导向环的第二内周部分在圆形板和晶片载体的下部之间，圆形板将待抛光的晶片保持在腔。

2. 发明授权

US5543615A Beam charge exchanging apparatus 失效
标题翻译：光束电荷交换装置
公开(公告)号：US5543615A
公开(公告)日：1996-08-06
申请号：US371775
申请日：1995-01-12
申请人： Mutsumi Saito , Tomoyuki Yahiro , Masahiro Hatakeyama
发明人： Mutsumi Saito , Tomoyuki Yahiro , Masahiro Hatakeyama
IPC分类号： G21K1/14 , H05H3/02
CPC分类号： G21K1/14 , H05H3/02
摘要： A beam charge exchanging apparatus causes the charges of charged particles in a fast particle beam to be exchanged with charges of a gas or other fluid. The apparatus includes; a gas/fluid container disposed in a vacuum and having holes which allow the fast particle beam to pass through the container, a source of gas or other fluid, and a nozzle for introducing the gas into the container. The source and the nozzle are designed to introduce a high speed gas/fluid into the container so that the fast particle beam will collide with the high speed gas/fluid in the container and the charges thereof will be exchanged such that the fast particle beam is converted into a neutral particle beam. The apparatus may further include elements for detecting the quantity of neutral particles resulting from the charge exchange by measuring the quantity of generated ionized gas as an electric current.
摘要翻译：光束电荷交换装置使得快速粒子束中的带电粒子的电荷与气体或其它流体的电荷交换。该装置包括：设置在真空中并具有允许快速粒子束通过容器，气体源或其它流体的孔和用于将气体引入容器的喷嘴的气体/流体容器。源和喷嘴被设计成将高速气体/流体引入容器中，使得快速粒子束将与容器中的高速气体/流体碰撞，并且其电荷将被更换，使得快速粒子束转换为中性粒子束。该装置还可以包括用于通过测量所产生的电离气体的量作为电流来检测由电荷交换产生的中性粒子的量的元件。

3. 发明授权

US5857898A Method of and apparatus for dressing polishing cloth 失效
标题翻译：抛光布的修整方法及装置
公开(公告)号：US5857898A
公开(公告)日：1999-01-12
申请号：US974598
申请日：1997-11-19
申请人： Hirokuni Hiyama , Norio Kimura , Tomoyuki Yahiro
发明人： Hirokuni Hiyama , Norio Kimura , Tomoyuki Yahiro
IPC分类号： B24B53/00 , B24B53/007 , B24B53/017 , B24B53/095 , B24B57/02 , H01L21/304 , B24B5/00 , B24B29/00
CPC分类号： B24B53/017
摘要： A polishing cloth is dressed between polishing processes each for polishing a workpiece such as a semiconductor wafer. The polishing cloth is dressed while supplying a dressing liquid such as water during a dressing process, and an abrasive liquid for polishing a workpiece is supplied to the polishing cloth for a predetermined period of time prior to a polishing process. The predetermined period of time may be present within the dressing process and immediately precedes the polishing process, and the dressing process may be carried out while supplying the abrasive liquid to the polishing cloth. Alternatively, the predetermined period of time may be present between the dressing process and the polishing process.
摘要翻译：在抛光工艺之间穿着抛光布，用于抛光诸如半导体晶片的工件。在修整过程中，在提供诸如水的修整液的同时，对抛光布进行修整，并且在抛光处理之前将抛光工件的研磨液供给到抛光布预定的时间。预定的时间段可以存在于修整过程中并且紧接在抛光过程之前，并且可以在将磨料液体供应到抛光布的同时进行修整过程。或者，在修整处理和抛光处理之间可以存在预定时间段。

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