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    • 1. 发明授权
    • Non-volatile semiconductor storage device
    • 非易失性半导体存储器件
    • US08203882B2
    • 2012-06-19
    • US12718353
    • 2010-03-05
    • Tomoo HishidaYoshihisa Iwata
    • Tomoo HishidaYoshihisa Iwata
    • G11C16/04
    • G11C16/0483G11C16/08G11C16/16H01L27/11578H01L27/11582H01L29/792
    • When a data erase operation is performed in one memory cell block, a first voltage is applied to one source line selected from m source lines in the one memory cell block. A second voltage equal to a voltage of the source lines before the data erase operation begins is applied to the other source lines. Then, after a certain time delay from application of the first voltage, a third voltage smaller than the first voltage is applied to a third conductive layer of a source-side selection transistor connected to a selected source line. Then, a hole current is produced near a third gate insulation layer due to a potential difference between the first and third voltage. A fourth voltage is applied to one of first conductive layers connected to one of the memory transistor to be erased. The other first conductive layers are brought into a floating state.
    • 当在一个存储单元块中执行数据擦除操作时,将第一电压施加到从一个存储单元块中的m个源极线中选择的一个源极线。 在数据擦除操作开始之前等于源极线的电压的第二电压被施加到其它源极线。 然后,在施加第一电压的一定的时间延迟之后,将小于第一电压的第三电压施加到连接到所选择的源极线的源极侧选择晶体管的第三导电层。 然后,由于第一和第三电压之间的电位差,在第三栅极绝缘层附近产生空穴电流。 将第四电压施加到连接到要擦除的存储晶体管之一的第一导电层之一。 其他第一导电层进入浮置状态。
    • 4. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08315097B2
    • 2012-11-20
    • US13026616
    • 2011-02-14
    • Tomoo HishidaHitoshi IwaiYoshihisa Iwata
    • Tomoo HishidaHitoshi IwaiYoshihisa Iwata
    • G11C11/34
    • G11C16/0483H01L27/11582
    • A memory string is configured by a plurality of memory transistors and a spare memory transistor connected in series. Word lines are connected to gates of the memory transistors. A spare word line is connected to a gate of the spare memory transistor. The memory string comprises a first semiconductor layer, a charge storage layer, a plurality of first conductive layers, and a second conductive layer. The first semiconductor layer extends in a perpendicular direction with respect to a substrate. The charge storage layer surrounds a side surface of the first semiconductor layer. The plurality of first conductive layers surround a side surface of the first semiconductor layer with the charge storage layer interposed therebetween, and function as the word lines. The second conductive layer surrounds a side surface of the first semiconductor layer with the charge storage layer interposed therebetween, and functions as the spare word line.
    • 存储器串由多个存储晶体管和备用存储晶体管串联连接。 字线连接到存储晶体管的栅极。 备用字线连接到备用存储晶体管的栅极。 存储器串包括第一半导体层,电荷存储层,多个第一导电层和第二导电层。 第一半导体层相对于基板在垂直方向上延伸。 电荷存储层包围第一半导体层的侧表面。 多个第一导电层围绕第一半导体层的侧表面,电荷存储层位于其间,并用作字线。 第二导电层围绕第一半导体层的侧表面,电荷存储层位于其间,用作备用字线。
    • 5. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20120069655A1
    • 2012-03-22
    • US13026616
    • 2011-02-14
    • Tomoo HishidaHitoshi IwaiYoshihisa Iwata
    • Tomoo HishidaHitoshi IwaiYoshihisa Iwata
    • G11C16/04
    • G11C16/0483H01L27/11582
    • A memory string is configured by a plurality of memory transistors and a spare memory transistor connected in series. Word lines are connected to gates of the memory transistors. A spare word line is connected to a gate of the spare memory transistor. The memory string comprises a first semiconductor layer, a charge storage layer, a plurality of first conductive layers, and a second conductive layer. The first semiconductor layer extends in a perpendicular direction with respect to a substrate. The charge storage layer surrounds a side surface of the first semiconductor layer. The plurality of first conductive layers surround a side surface of the first semiconductor layer with the charge storage layer interposed therebetween, and function as the word lines. The second conductive layer surrounds a side surface of the first semiconductor layer with the charge storage layer interposed therebetween, and functions as the spare word line.
    • 存储器串由多个存储晶体管和备用存储晶体管串联连接。 字线连接到存储晶体管的栅极。 备用字线连接到备用存储晶体管的栅极。 存储器串包括第一半导体层,电荷存储层,多个第一导电层和第二导电层。 第一半导体层相对于基板在垂直方向上延伸。 电荷存储层包围第一半导体层的侧表面。 多个第一导电层围绕第一半导体层的侧表面,电荷存储层位于其间,并用作字线。 第二导电层围绕第一半导体层的侧表面,电荷存储层位于其间,用作备用字线。
    • 7. 发明申请
    • NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE
    • 非挥发性半导体存储器件
    • US20100238732A1
    • 2010-09-23
    • US12718353
    • 2010-03-05
    • Tomoo HISHIDAYoshihisa Iwata
    • Tomoo HISHIDAYoshihisa Iwata
    • G11C16/04
    • G11C16/0483G11C16/08G11C16/16H01L27/11578H01L27/11582H01L29/792
    • When a data erase operation is performed in one memory cell block, a first voltage is applied to one source line selected from m source lines in the one memory cell block. A second voltage equal to a voltage of the source lines before the data erase operation begins is applied to the other source lines. Then, after a certain time delay from application of the first voltage, a third voltage smaller than the first voltage is applied to a third conductive layer of a source-side selection transistor connected to a selected source line. Then, a hole current is produced near a third gate insulation layer due to a potential difference between the first and third voltage. A fourth voltage is applied to one of first conductive layers connected to one of the memory transistor to be erased. The other first conductive layers are brought into a floating state.
    • 当在一个存储单元块中执行数据擦除操作时,将第一电压施加到从一个存储单元块中的m个源极线中选择的一个源极线。 在数据擦除操作开始之前等于源极线的电压的第二电压被施加到其它源极线。 然后,在施加第一电压的一定的时间延迟之后,将小于第一电压的第三电压施加到连接到所选择的源极线的源极侧选择晶体管的第三导电层。 然后,由于第一和第三电压之间的电位差,在第三栅极绝缘层附近产生空穴电流。 将第四电压施加到连接到要擦除的存储晶体管之一的第一导电层之一。 其他第一导电层进入浮置状态。