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    • 6. 发明授权
    • Nonvolatile semiconductor memory device and method of manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • US08148769B2
    • 2012-04-03
    • US12534576
    • 2009-08-03
    • Masaru KitoYoshiaki FukuzumiRyota KatsumataMasaru KidohHiroyasu TanakaMegumi IshidukiYosuke KomoriHideaki Aochi
    • Masaru KitoYoshiaki FukuzumiRyota KatsumataMasaru KidohHiroyasu TanakaMegumi IshidukiYosuke KomoriHideaki Aochi
    • H01L29/788
    • H01L27/11578H01L27/11582H01L29/66833H01L29/792H01L29/7926
    • A nonvolatile semiconductor memory device includes a plurality of memory strings, each of which has a plurality of electrically rewritable memory cells connected in series; and select transistors, one of which is connected to each of ends of each of the memory strings. Each of the memory strings is provided with a first semiconductor layer having a pair of columnar portions extending in a perpendicular direction with respect to a substrate, and a joining portion formed so as to join lower ends of the pair of columnar portions; a charge storage layer formed so as to surround a side surface of the columnar portions; and a first conductive layer formed so as to surround the side surface of the columnar portions and the charge storage layer, and configured to function as a control electrode of the memory cells. Each of the select transistors is provided with a second semiconductor layer extending upwardly from an upper surface of the columnar portions; and a second conductive layer formed so as to surround a side surface of the second semiconductor layer with a gap interposed, and configured to function as a control electrode of the select transistors.
    • 非易失性半导体存储器件包括多个存储串,每个存储串具有串联连接的多个电可重写存储单元; 并选择晶体管,其中一个连接到每个存储器串的每一端。 每个存储器串都具有第一半导体层,该第一半导体层具有相对于衬底在垂直方向上延伸的一对柱状部分,以及形成为连接该一对柱状部分的下端的接合部分; 形成为围绕所述柱状部的侧面的电荷存储层; 以及形成为围绕柱状部分的侧面和电荷存储层的第一导电层,并且被配置为用作存储单元的控制电极。 每个选择晶体管设置有从柱状部分的上表面向上延伸的第二半导体层; 以及第二导电层,其被形成为以间隔开的方式围绕所述第二半导体层的侧表面,并且被配置为用作所述选择晶体管的控制电极。
    • 7. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
    • 半导体存储器件及其制造方法
    • US20110215394A1
    • 2011-09-08
    • US12813895
    • 2010-06-11
    • Yosuke KomoriMasaru KidohRyota Katsumata
    • Yosuke KomoriMasaru KidohRyota Katsumata
    • H01L29/792H01L21/336
    • H01L27/11582G11C16/0483G11C16/26H01L27/0688H01L27/11573
    • According to one embodiment, a semiconductor memory device includes a base, a stacked body, a memory film, a channel body, a contact plug, a global bit line, and a plurality of local bit lines. The base has a substrate and a peripheral circuit formed on the substrate. The stacked body has a plurality of conductive layers and insulating layers stacked alternately above the base. The memory film includes a charge storage film provided on an inner wall of a memory hole formed in a stacking direction of the stacked body. The channel body is provided inside the memory film in the memory hole. The contact plug is provided by piercing the stacked body. The global bit line is provided between the peripheral circuit and the stacked body and connected to a lower end portion of the contact plug. The plurality of local bit lines are provided above the stacked body and divided in an extending direction of the plurality of local bit lines. The plurality of local bit lines are connected to the channel body and commonly connected to the global bit line through the contact plug.
    • 根据一个实施例,半导体存储器件包括基底,层叠体,存储膜,通道体,接触塞,全局位线和多个局部位线。 该基底具有形成于该基板上的基板和外围电路。 层叠体具有交替地堆叠在基底上的多个导电层和绝缘层。 记忆膜包括设置在层叠体的层叠方向形成的存储孔的内壁上的电荷存储膜。 通道体设置在存储器孔内的记忆膜的内部。 接触插塞是通过刺穿层叠体来提供的。 全局位线设置在外围电路和层叠体之间并连接到接触插塞的下端部分。 多个局部位线设置在堆叠体的上方并沿多个局部位线的延伸方向分割。 多个局部位线连接到通道体并且通过接触插塞共同连接到全局位线。