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    • 1. 发明授权
    • Manufacturing process monitoring system and manufacturing process monitoring method
    • 制造过程监控系统和制造过程监控方法
    • US09268325B2
    • 2016-02-23
    • US13207943
    • 2011-08-11
    • Tomomi Ino
    • Tomomi Ino
    • G06F19/00G05B19/418
    • G05B19/4184G05B19/4183Y02P90/10Y02P90/14
    • According to one embodiment, a manufacturing process monitoring system for monitoring anomaly in a manufacturing process for products, the system includes an information storage section, a selection information section, a reference space formation section and a monitoring section. The information storage section is configured to store previously collected data. The selection information section is configured to create information used in classifying the data stored in the information storage section. The reference space formation section is configured to form a reference space based on data subjected to anomaly monitoring acquired in the manufacturing process and the data classified by the information from the data stored in the information storage section. The monitoring section is configured to monitor anomaly of the data subjected to anomaly monitoring based on the reference space.
    • 根据一个实施例,一种用于监视产品制造过程中的异常的制造过程监控系统,该系统包括信息存储部分,选择信息部分,参考空间形成部分和监视部分。 信息存储部分被配置为存储先前收集的数据。 选择信息部分被配置为创建用于对存储在信息存储部分中的数据进行分类的信息。 参考空间形成部分被配置为基于在制造过程中获取的异常监视数据和根据存储在信息存储部分中的数据由信息分类的数据形成参考空间。 该监视部分被配置为基于参考空间来监视遭受异常监视的数据的异常。
    • 3. 发明申请
    • Method for determining a failure of a manufacturing condition, system for determining a failure of a manufacuring condition and method for manufacturing an industrial product
    • 用于确定制造条件故障的方法,用于确定制造条件故障的系统和用于制造工业产品的方法
    • US20060085165A1
    • 2006-04-20
    • US11236719
    • 2005-09-28
    • Yukihiro UshikuTomomi Ino
    • Yukihiro UshikuTomomi Ino
    • G06F11/30
    • G05B23/024
    • A method for determining a failure of a manufacturing condition, includes creating waveforms implemented by respective first data strings of first characteristic variables corresponding to operation parameter data of manufacturing apparatuses which execute manufacturing processes of products under respective manufacturing conditions for the products; classifying the first data strings that are analogous to each other into groups based on a correlation of the waveforms; creating a first visualized data table visualizing magnitude correlations between the first characteristic variables for each of the groups; adding second data strings of second characteristic variables to the groups, the second characteristic variables corresponding to workmanship data representing measurement and inspection results of the products; and creating a second visualized data table visualizing magnitude correlations between the second characteristic variables for each of the groups.
    • 一种用于确定制造条件故障的方法,包括:通过对与产品的相应制造条件下执行产品的制造过程的制造装置的操作参数数据相对应的第一特征变量的各个第一数据串实现的波形; 基于波形的相关性将彼此类似的第一数据串分组成组; 创建第一可视化数据表可视化每个组的第一特征变量之间的幅度相关性; 将第二特征变量的第二数据串添加到组中,对应于表示产品的测量和检查结果的工艺数据的第二特征变量; 以及创建第二可视化数据表,其可视化每个组的第二特征变量之间的幅度相关性。
    • 6. 发明申请
    • MANUFACTURING PROCESS MONITORING SYSTEM AND MANUFACTURING PROCESS MONITORING METHOD
    • 制造过程监控系统和制造过程监控方法
    • US20120072002A1
    • 2012-03-22
    • US13207943
    • 2011-08-11
    • Tomomi INO
    • Tomomi INO
    • G06F19/00
    • G05B19/4184G05B19/4183Y02P90/10Y02P90/14
    • According to one embodiment, a manufacturing process monitoring system for monitoring anomaly in a manufacturing process for products, the system includes an information storage section, a selection information section, a reference space formation section and a monitoring section. The information storage section is configured to store previously collected data. The selection information section is configured to create information used in classifying the data stored in the information storage section. The reference space formation section is configured to form a reference space based on data subjected to anomaly monitoring acquired in the manufacturing process and the data classified by the information from the data stored in the information storage section. The monitoring section is configured to monitor anomaly of the data subjected to anomaly monitoring based on the reference space.
    • 根据一个实施例,一种用于监视产品制造过程中的异常的制造过程监控系统,该系统包括信息存储部分,选择信息部分,参考空间形成部分和监视部分。 信息存储部分被配置为存储先前收集的数据。 选择信息部分被配置为创建用于对存储在信息存储部分中的数据进行分类的信息。 参考空间形成部分被配置为基于在制造过程中获取的异常监视数据和根据存储在信息存储部分中的数据由信息分类的数据形成参考空间。 该监视部分被配置为基于参考空间来监视遭受异常监视的数据的异常。
    • 8. 发明申请
    • Quality control system, quality control method, and method of lot-to-lot wafer processing
    • 质量控制体系,质量控制方法,批量批处理方法
    • US20060235560A1
    • 2006-10-19
    • US11395276
    • 2006-04-03
    • Akira OgawaYukihiro UshikuTomomi Ino
    • Akira OgawaYukihiro UshikuTomomi Ino
    • G06F19/00
    • G05B19/41875G05B2219/32097G05B2219/32194G05B2219/45031H01L21/67253Y02P90/20Y02P90/22
    • A quality control system has: a QC value storage unit that stores QC actual measurements of past lots, a data acquisition device that acquires the device internal information of a processing device processing an intended lot, a device internal information storage unit that stores the device internal information, a recipe storage unit that stores a plurality of recipes classified by the distribution of sampling density within a wafer, a QC value prediction unit that predicts a QC prediction value of the intended lot using the device internal information and the QC actual measurements, a wafer determination unit that determines a sample wafer to be measured from among a plurality of wafers constituting the intended lot using the QC prediction value, a recipe selection unit that selects an application recipe to be applied to the sample wafer from among the plurality of recipes using the QC prediction value, and a measurement device that makes a QC measurement on the sample wafer using the application recipe and stores the measurement result in the QC value storage unit.
    • 质量控制系统具有:存储过去批次的QC实际测量值的QC值存储单元,获取处理预期批次的处理设备的设备内部信息的数据获取设备,存储设备内部的设备内部信息存储单元 信息,存储通过晶片内的采样密度分布分类的多个配方的食谱存储单元,使用设备内部信息和QC实际测量来预测预期批次的QC预测值的QC值预测单元, 晶片确定单元,其使用QC预测值从构成预期批次的多个晶片中确定待测量的样品晶片;配方选择单元,从多个配方中选择应用于样品晶片的应用配方,所述配方选择单元使用 QC预测值,以及使用该测量装置对样品晶片进行QC测量 应用配方,并将测量结果存储在QC值存储单元中。