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1. 发明申请

US20120313518A1 LED LAMP AND METHOD OF MAKING THE SAME 有权
标题翻译： LED灯及其制作方法
公开(公告)号：US20120313518A1
公开(公告)日：2012-12-13
申请号：US13158962
申请日：2011-06-13
申请人： Chih-Hsuan Sun , Wei-Yu Yeh , Tien-Ming Lin
发明人： Chih-Hsuan Sun , Wei-Yu Yeh , Tien-Ming Lin
IPC分类号： H01K1/62 , H05K13/00 , H01J61/52
CPC分类号： F21V29/74 , F21K9/232 , F21K9/90 , F21V3/02 , F21Y2101/00 , F21Y2115/10 , Y10T29/49002
摘要： A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.
摘要翻译：照明装置包括具有朝向外侧的中心部分的小面的多面散热器。小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。照明装置还具有安装有半导体发射体的多个电路板。每个电路板安装在散热器的相应面上。所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件模块。

2. 发明申请

US20120097986A1 WAFER LEVEL REFLECTOR FOR LED PACKAGING 有权
标题翻译： LED包装用水平反射器
公开(公告)号：US20120097986A1
公开(公告)日：2012-04-26
申请号：US12910363
申请日：2010-10-22
申请人： Hao-Wei KU , Chung Yu WANG , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
发明人： Hao-Wei KU , Chung Yu WANG , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
IPC分类号： H01L33/60 , H01L21/56
CPC分类号： H01L27/15 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/10253 , H01L2924/12035 , H01L2924/12041 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
摘要翻译：通过将发光二极管（LED）裸片结合到封装晶片，电连接LED管芯和封装晶片，在封装晶片上的LED管芯上形成荧光体涂层，在LED上模制透镜来制造光发射器在封装晶片上模制，在封装晶片上模制反射器，并将晶片切割成至少一个光发射器。

3. 发明授权

US08765500B2 Method and apparatus for fabricating phosphor-coated LED dies 有权
标题翻译：制造磷光体涂层LED芯片的方法和装置
公开(公告)号：US08765500B2
公开(公告)日：2014-07-01
申请号：US13594219
申请日：2012-08-24
申请人： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Ming Lin
发明人： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Ming Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/50 , H01L2224/13 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.
摘要翻译：本公开涉及封装发光二极管（LED）的方法。根据该方法，提供一组金属焊盘和一组LED。该组LED例如通过粘合工艺连接到金属焊盘组上。在LED连接到金属焊盘之后，每个LED与相邻的LED间隔开。同样根据该方法，荧光膜被集体涂覆在LED组上。荧光膜被涂覆在每个LED的顶表面和侧表面上以及相邻的LED之间。然后进行切割处理以切割位于相邻LED之间的部分荧光膜。切割工艺将LED组分成多个单独的磷光体涂覆的LED。

4. 发明申请

US20120299019A1 Systems and Methods Providing Semiconductor Light Emitters 有权
标题翻译：提供半导体发光器的系统和方法
公开(公告)号：US20120299019A1
公开(公告)日：2012-11-29
申请号：US13117320
申请日：2011-05-27
申请人： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号： H01L33/52 , H01L21/52
CPC分类号： H01L33/58 , H01L33/507 , H01L2224/48091 , H01L2924/0002 , H01L2933/0041 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.
摘要翻译：半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到基材用胶。透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。此外，作为透镜板的一部分包括磷光体。

5. 发明申请

US20120104435A1 REFRACTIVE INDEX TUNING OF WAFER LEVEL PACKAGE LEDS 有权
标题翻译：水平包装LED的折射率调整
公开(公告)号：US20120104435A1
公开(公告)日：2012-05-03
申请号：US12912900
申请日：2010-10-27
申请人： Hsiao-Wen LEE , Shang-Yu TSAI , Tien-Ming LIN , Chyi Shyuan CHERN , Hsin-Hsien WU , Fu-Wen LIU , Huai-En LAI , Yu-Sheng TANG
发明人： Hsiao-Wen LEE , Shang-Yu TSAI , Tien-Ming LIN , Chyi Shyuan CHERN , Hsin-Hsien WU , Fu-Wen LIU , Huai-En LAI , Yu-Sheng TANG
IPC分类号： H01L33/50 , H01L23/24
CPC分类号： H01L33/54 , H01L33/44 , H01L33/504 , H01L33/507 , H01L33/56 , H01L2224/48091 , H01L2924/0002 , H01L2924/1305 , H01L2924/13091 , H01L2933/005 , H01L2924/00 , H01L2924/00014
摘要： Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.
摘要翻译：在封装的LED模具上形成两个或多个模制的椭圆体透镜，该胶片通过将胶料注入到LED模具中的模具中并固化胶料。固化后，与LED芯片接触的透镜的折射率大于不直接接触LED芯片的透镜的折射率。对于不直接接触LED管芯的透镜中的至少一个，将至少一种磷光体材料结合到胶合材料中。直接接触LED芯片的透镜还可以包括一种或多种荧光体材料。可以在LED管芯和透镜之间施加高折射率涂层。

6. 发明授权

US08860056B2 Structure and method for LED with phosphor coating 有权
公开(公告)号：US08860056B2
公开(公告)日：2014-10-14
申请号：US13308715
申请日：2011-12-01
申请人： Chi Xiang Tseng , Hsiao-Wen Lee , Tien-Ming Lin , Min-Sheng Wu
发明人： Chi Xiang Tseng , Hsiao-Wen Lee , Tien-Ming Lin , Min-Sheng Wu
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , H01L27/153 , H01L33/504 , H01L33/508 , H01L2933/0041
摘要： The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.

7. 发明授权

US09024341B2 Refractive index tuning of wafer level package LEDs 有权
$Refractive index tuning of wafer level package LEDs$
标题翻译：晶圆级封装LED的折射率调谐
公开(公告)号：US09024341B2
公开(公告)日：2015-05-05
申请号：US12912900
申请日：2010-10-27
申请人： Hsiao-Wen Lee , Shang-Yu Tsai , Tien-Ming Lin , Chyi Shyuan Chern , Hsin-Hsien Wu , Fu-Wen Liu , Huai-En Lai , Yu-Sheng Tang
发明人： Hsiao-Wen Lee , Shang-Yu Tsai , Tien-Ming Lin , Chyi Shyuan Chern , Hsin-Hsien Wu , Fu-Wen Liu , Huai-En Lai , Yu-Sheng Tang
IPC分类号： H01L33/00 , H01L33/54 , H01L33/44 , H01L33/50 , H01L33/56
CPC分类号： H01L33/54 , H01L33/44 , H01L33/504 , H01L33/507 , H01L33/56 , H01L2224/48091 , H01L2924/0002 , H01L2924/1305 , H01L2924/13091 , H01L2933/005 , H01L2924/00 , H01L2924/00014
摘要： Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.
摘要翻译：在封装的LED模具上形成两个或多个模制的椭圆体透镜，该胶片通过将胶料注入到LED模具中的模具中并固化胶料。固化后，与LED芯片接触的透镜的折射率大于不直接接触LED芯片的透镜的折射率。对于不直接接触LED管芯的透镜中的至少一个，将至少一种磷光体材料结合到胶合材料中。直接接触LED芯片的透镜还可以包括一种或多种荧光体材料。可以在LED管芯和透镜之间施加高折射率涂层。

8. 发明授权

US08721097B2 LED lamp with improved light output 有权
标题翻译： LED灯具有改善的光输出
公开(公告)号：US08721097B2
公开(公告)日：2014-05-13
申请号：US13111222
申请日：2011-05-19
申请人： Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
发明人： Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
IPC分类号： F21V9/16 , F21V3/00
CPC分类号： F21K9/64 , F21K9/232 , F21K9/90 , F21V3/02 , F21V13/02 , F21V29/507 , F21V29/70 , F21V29/74 , F21Y2101/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/4913
摘要： The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.
摘要翻译：本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管（LED）光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。盖结构包含磷光体材料和漫射材料。盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。

9. 发明申请

US20140054616A1 Method and Apparatus for Fabricating Phosphor-Coated LED Dies 有权
公开(公告)号：US20140054616A1
公开(公告)日：2014-02-27
申请号：US13594219
申请日：2012-08-24
申请人： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Ming Lin
发明人： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Ming Lin
IPC分类号： H01L33/48 , H01L33/08
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/50 , H01L2224/13 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.

10. 发明授权

US08486724B2 Wafer level reflector for LED packaging 有权
标题翻译：晶圆级反射器用于LED封装
公开(公告)号：US08486724B2
公开(公告)日：2013-07-16
申请号：US12910363
申请日：2010-10-22
申请人： Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
发明人： Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
IPC分类号： H01L21/00
CPC分类号： H01L27/15 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/10253 , H01L2924/12035 , H01L2924/12041 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
摘要翻译：通过将发光二极管（LED）裸片结合到封装晶片，电连接LED管芯和封装晶片，在封装晶片上的LED管芯上形成荧光体涂层，在LED上模制透镜来制造光发射器在封装晶片上模制，在封装晶片上模制反射器，并将晶片切割成至少一个光发射器。

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