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1. 发明申请

US20100321894A1 HEATSINK MOUNTING SYSTEM 有权
标题翻译：散热器安装系统
公开(公告)号：US20100321894A1
公开(公告)日：2010-12-23
申请号：US12870605
申请日：2010-08-27
申请人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
发明人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
IPC分类号： H05K7/20 , F16B2/22
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
摘要翻译：提供散热器安装系统（10），用于容纳和接合散热器（16）抵靠发热部件，通常为IC芯片（18）。系统（10）包括限定空腔（26）的矩形整体形成的弹性框架（12），其中容纳散热器（16）。框架（12）包括一对相对的侧面（30）和一对相对的夹持侧面（28），其具有从其相交处悬垂的L形角块（32）。抓握侧面（28）包括居中定位的把手（38），其具有向上延伸的弯曲的手柄柱（39）和从其悬挂的夹持块（34），每个夹紧块（34）在其下部的一个处有一个把手舌片（36）向内延伸到空腔（26）内。握柄（38）上的向内压力迫使把手舌片（36）向外释放由此捕获的物体。

2. 发明授权

US07848107B2 Heatsink mounting system 有权
标题翻译：散热片安装系统
公开(公告)号：US07848107B2
公开(公告)日：2010-12-07
申请号：US12342273
申请日：2008-12-23
申请人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
发明人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
摘要翻译：提供散热系统（10），用于将散热器（16）容纳和接合到发热部件（通常为IC芯片）上。系统（10）包括限定空腔（26）的矩形整体形成的弹性框架（12），其中容纳散热器（16）。框架（12）包括一对相对的侧面（30）和一对相对的夹持侧面（28），其具有从其相交处悬垂的L形角块（32）。抓握侧面（28）包括向上延伸的中心定位的把手（38）和从其悬挂的夹持块（34），每个抓握块（34）在其下部延伸的向下延伸到空腔（26））。握柄（38）上的向内压力迫使把手舌片（36）向外释放由此捕获的物体。

3. 发明申请

US20100157539A1 HEATSINK MOUNTING SYSTEM 有权
标题翻译：散热器安装系统
公开(公告)号：US20100157539A1
公开(公告)日：2010-06-24
申请号：US12342273
申请日：2008-12-23
申请人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
发明人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
摘要翻译：提供散热系统（10），用于将散热器（16）容纳和接合到发热部件（通常为IC芯片）上。系统（10）包括限定空腔（26）的矩形整体形成的弹性框架（12），其中容纳散热器（16）。框架（12）包括一对相对的侧面（30）和一对相对的夹持侧面（28），其具有从其相交处悬垂的L形角块（32）。抓握侧面（28）包括向上延伸的中心定位的把手（38）和从其悬挂的夹持块（34），每个抓握块（34）在其下部延伸的向下延伸到空腔（26））。握柄（38）上的向内压力迫使把手舌片（36）向外释放由此捕获的物体。

4. 发明申请

US20140248081A1 INTERLOCKING CLIP HEATSINK MOUNTING SYSTEM 有权
标题翻译： INTERLOCKING CLIP HEATSINK安装系统
公开(公告)号：US20140248081A1
公开(公告)日：2014-09-04
申请号：US13782699
申请日：2013-03-01
申请人： Thierry Sin Yan TOO , Mong HU
发明人： Thierry Sin Yan TOO , Mong HU
IPC分类号： F28F9/26
CPC分类号： F28F9/26 , H01L23/4093 , H01L2924/0002 , H05K7/20418 , Y10T403/7064 , H01L2924/00
摘要： An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.
摘要翻译：提供了互锁夹式散热器安装系统（10），用于固定散热器（12）与芯片载体（14）的最佳热接触。夹子结构（24）包括一对相同的互锁夹构件（28）和弹簧构件（26）。夹子侧构件（28）设置有锯齿（50）和钩楔（62），以便以部分接合和完全接合的模式互锁。

5. 发明授权

US08274793B2 Heatsink mounting system 有权
标题翻译：散热片安装系统
公开(公告)号：US08274793B2
公开(公告)日：2012-09-25
申请号：US12870605
申请日：2010-08-27
申请人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
发明人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
摘要翻译：提供散热器安装系统（10），用于容纳和接合散热器（16）抵靠发热部件，通常为IC芯片（18）。系统（10）包括限定空腔（26）的矩形整体形成的弹性框架（12），其中容纳散热器（16）。框架（12）包括一对相对的侧面（30）和一对相对的夹持侧面（28），其具有从其相交处悬垂的L形角块（32）。抓握侧面（28）包括居中定位的把手（38），其具有向上延伸的弯曲的手柄柱（39）和从其悬挂的夹持块（34），每个夹紧块（34）在其较低的范围具有夹紧舌片（36）向内延伸到空腔（26）内。握柄（38）上的向内压力迫使把手舌片（36）向外释放由此捕获的物体。

6. 发明授权

US09146062B2 Interlocking clip heatsink mounting system 有权
标题翻译：联锁夹式散热器安装系统
公开(公告)号：US09146062B2
公开(公告)日：2015-09-29
申请号：US13782699
申请日：2013-03-01
申请人： Thierry Sin Yan Too , Mong Hu
发明人： Thierry Sin Yan Too , Mong Hu
IPC分类号： H05K7/20 , F28F9/26
CPC分类号： F28F9/26 , H01L23/4093 , H01L2924/0002 , H05K7/20418 , Y10T403/7064 , H01L2924/00
摘要： An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.
摘要翻译：提供了互锁夹式散热器安装系统（10），用于固定散热器（12）与芯片载体（14）的最佳热接触。夹子结构（24）包括一对相同的互锁夹构件（28）和弹簧构件（26）。夹子侧构件（28）设置有锯齿（50）和钩楔（62），以便以部分接合和完全接合的模式互锁。

7. 发明授权

US07203065B1 Heatsink assembly 有权
标题翻译：散热器组装
公开(公告)号：US07203065B1
公开(公告)日：2007-04-10
申请号：US10876473
申请日：2004-06-28
申请人： Thierry Sin Yan Too
发明人： Thierry Sin Yan Too
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heatsink assembly is disclosed that includes a holder slidably engaging a circuit board component to be cooled and a heatsink secured to the heatsink holder. A method of cooling a circuit board component is also disclosed that involves the steps of providing a bracket having a central portion and first and second end portions directed toward one another, sliding the bracket over a portion of a circuit board component to be cooled such that the central portion faces a first surface of the circuit board component and the first and second end portions face opposing edges of the circuit board component, providing a heatsink, and securing the heatsink to the bracket in a manner that retains the heatsink and bracket on the circuit board component.
摘要翻译：公开了一种散热器组件，其包括可滑动地接合要冷却的电路板部件和固定到散热器保持器的散热器的保持架。还公开了一种冷却电路板部件的方法，其包括以下步骤：提供具有中心部分和第一和第二端部朝向彼此的支架，将支架滑动到要冷却的电路板部件的一部分上，使得中心部分面向电路板部件的第一表面，并且第一和第二端部面对电路板部件的相对边缘，提供散热器，并以将散热器和支架保持在支架上的方式将散热片固定到支架上电路板组件。

8. 发明授权

US07099550B1 Angular optical component retention and removal system 失效
标题翻译：角度光学元件保持和去除系统
公开(公告)号：US07099550B1
公开(公告)日：2006-08-29
申请号：US10806395
申请日：2004-03-23
申请人： Thierry Sin Yan Too
发明人： Thierry Sin Yan Too
IPC分类号： G02B6/00
CPC分类号： G02B6/3897
摘要： Disclosed herein is an angular optical component retention and removal system that reduces the amount of space needed to accommodate fiber optic cables and enables optical components to be quickly and easily inserted, retained, and removed from an optical communications system. The optical component retention and removal system may include a single or plural angular retention sections that retain optical components in an angular orientation through a faceplate. The system may further include an insertion/retention mechanism that enables an optical component to be inserted and removed with a single hand. With the system, fiber optic cables extend at an angle from the optical components, requiring less clearance space in front of the faceplate for provision of the fiber optic cables.
摘要翻译：本文公开了一种角度光学部件保持和移除系统，其减少了容纳光纤电缆所需的空间量，并且使光学部件能够快速且容易地从光通信系统插入，保持和移除。光学部件保持和移除系统可以包括单个或多个角度保持部分，其保持通过面板的角度定向的光学部件。该系统可以进一步包括能够用单手插入和移除光学部件的插入/保持机构。使用该系统，光纤电缆与光学部件成一角度延伸，在面板前面需要更少的间隙以提供光纤电缆。

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