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1. 发明申请

US20100157539A1 HEATSINK MOUNTING SYSTEM 有权
标题翻译：散热器安装系统
公开(公告)号：US20100157539A1
公开(公告)日：2010-06-24
申请号：US12342273
申请日：2008-12-23
申请人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
发明人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
摘要翻译：提供散热系统（10），用于将散热器（16）容纳和接合到发热部件（通常为IC芯片）上。系统（10）包括限定空腔（26）的矩形整体形成的弹性框架（12），其中容纳散热器（16）。框架（12）包括一对相对的侧面（30）和一对相对的夹持侧面（28），其具有从其相交处悬垂的L形角块（32）。抓握侧面（28）包括向上延伸的中心定位的把手（38）和从其悬挂的夹持块（34），每个抓握块（34）在其下部延伸的向下延伸到空腔（26））。握柄（38）上的向内压力迫使把手舌片（36）向外释放由此捕获的物体。

2. 发明授权

US09146062B2 Interlocking clip heatsink mounting system 有权
标题翻译：联锁夹式散热器安装系统
公开(公告)号：US09146062B2
公开(公告)日：2015-09-29
申请号：US13782699
申请日：2013-03-01
申请人： Thierry Sin Yan Too , Mong Hu
发明人： Thierry Sin Yan Too , Mong Hu
IPC分类号： H05K7/20 , F28F9/26
CPC分类号： F28F9/26 , H01L23/4093 , H01L2924/0002 , H05K7/20418 , Y10T403/7064 , H01L2924/00
摘要： An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.
摘要翻译：提供了互锁夹式散热器安装系统（10），用于固定散热器（12）与芯片载体（14）的最佳热接触。夹子结构（24）包括一对相同的互锁夹构件（28）和弹簧构件（26）。夹子侧构件（28）设置有锯齿（50）和钩楔（62），以便以部分接合和完全接合的模式互锁。

3. 发明申请

US20100321894A1 HEATSINK MOUNTING SYSTEM 有权
标题翻译：散热器安装系统
公开(公告)号：US20100321894A1
公开(公告)日：2010-12-23
申请号：US12870605
申请日：2010-08-27
申请人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
发明人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
IPC分类号： H05K7/20 , F16B2/22
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
摘要翻译：提供散热器安装系统（10），用于容纳和接合散热器（16）抵靠发热部件，通常为IC芯片（18）。系统（10）包括限定空腔（26）的矩形整体形成的弹性框架（12），其中容纳散热器（16）。框架（12）包括一对相对的侧面（30）和一对相对的夹持侧面（28），其具有从其相交处悬垂的L形角块（32）。抓握侧面（28）包括居中定位的把手（38），其具有向上延伸的弯曲的手柄柱（39）和从其悬挂的夹持块（34），每个夹紧块（34）在其下部的一个处有一个把手舌片（36）向内延伸到空腔（26）内。握柄（38）上的向内压力迫使把手舌片（36）向外释放由此捕获的物体。

4. 发明授权

US07848107B2 Heatsink mounting system 有权
标题翻译：散热片安装系统
公开(公告)号：US07848107B2
公开(公告)日：2010-12-07
申请号：US12342273
申请日：2008-12-23
申请人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
发明人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
摘要翻译：提供散热系统（10），用于将散热器（16）容纳和接合到发热部件（通常为IC芯片）上。系统（10）包括限定空腔（26）的矩形整体形成的弹性框架（12），其中容纳散热器（16）。框架（12）包括一对相对的侧面（30）和一对相对的夹持侧面（28），其具有从其相交处悬垂的L形角块（32）。抓握侧面（28）包括向上延伸的中心定位的把手（38）和从其悬挂的夹持块（34），每个抓握块（34）在其下部延伸的向下延伸到空腔（26））。握柄（38）上的向内压力迫使把手舌片（36）向外释放由此捕获的物体。

5. 发明申请

US20140248081A1 INTERLOCKING CLIP HEATSINK MOUNTING SYSTEM 有权
标题翻译： INTERLOCKING CLIP HEATSINK安装系统
公开(公告)号：US20140248081A1
公开(公告)日：2014-09-04
申请号：US13782699
申请日：2013-03-01
申请人： Thierry Sin Yan TOO , Mong HU
发明人： Thierry Sin Yan TOO , Mong HU
IPC分类号： F28F9/26
CPC分类号： F28F9/26 , H01L23/4093 , H01L2924/0002 , H05K7/20418 , Y10T403/7064 , H01L2924/00
摘要： An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.
摘要翻译：提供了互锁夹式散热器安装系统（10），用于固定散热器（12）与芯片载体（14）的最佳热接触。夹子结构（24）包括一对相同的互锁夹构件（28）和弹簧构件（26）。夹子侧构件（28）设置有锯齿（50）和钩楔（62），以便以部分接合和完全接合的模式互锁。

6. 发明授权

US08274793B2 Heatsink mounting system 有权
标题翻译：散热片安装系统
公开(公告)号：US08274793B2
公开(公告)日：2012-09-25
申请号：US12870605
申请日：2010-08-27
申请人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
发明人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
摘要翻译：提供散热器安装系统（10），用于容纳和接合散热器（16）抵靠发热部件，通常为IC芯片（18）。系统（10）包括限定空腔（26）的矩形整体形成的弹性框架（12），其中容纳散热器（16）。框架（12）包括一对相对的侧面（30）和一对相对的夹持侧面（28），其具有从其相交处悬垂的L形角块（32）。抓握侧面（28）包括居中定位的把手（38），其具有向上延伸的弯曲的手柄柱（39）和从其悬挂的夹持块（34），每个夹紧块（34）在其较低的范围具有夹紧舌片（36）向内延伸到空腔（26）内。握柄（38）上的向内压力迫使把手舌片（36）向外释放由此捕获的物体。

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