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    • 4. 发明申请
    • IMAGE PROCESSING APPARATUS, IMAGE PROCESSING SYSTEM, AND DISPLAY SCREEN CONTROLLING METHOD
    • 图像处理设备,图像处理系统和显示屏幕控制方法
    • US20110214167A1
    • 2011-09-01
    • US13033743
    • 2011-02-24
    • Tetsuya OKA
    • Tetsuya OKA
    • G06F21/20G06F21/00
    • G06F21/608
    • An image processing apparatus comprises: a display part on which various information is displayed; an authentication information inputting part for receiving entry of authentication information made by a user; a setting information inputting part for receiving an operation to set made by the user, and inputting setting information; an authentication processing part for starting authentication processing to execute user authentication based on the authentication information in response to the entry of the authentication information; and a display controlling part for displaying an initial operation screen operable for the user to make setting on the display part in parallel with the authentication processing executed by the authentication processing part, and for reflecting the setting information received by the setting information inputting part before obtaining a result of the authentication processing to the initial operation screen. So, a waiting time of the user after the entry of the authentication information is reduced. Also, the user is allowed to start making operation relatively-early, and convenience of the image processing apparatus is enhanced.
    • 一种图像处理装置,包括:显示部,显示各种信息; 认证信息输入部,用于接收用户进行的认证信息的输入; 设置信息输入部分,用于接收由用户设置的操作并输入设置信息; 认证处理部件,用于响应于认证信息的输入,基于认证信息开始认证处理以执行用户认证; 以及显示控制部分,用于显示可操作的用户的初始操作屏幕,以便与由认证处理部分执行的认证处理并行地在显示部分上进行设置,并且用于在获得之前反映由设置信息输入部分接收的设置信息 是对初始操作画面的认证处理的结果。 因此,在进入认证信息之后,用户的等待时间减少。 此外,允许用户相对早地开始操作,并且增强了图像处理装置的便利性。
    • 6. 发明申请
    • METHOD FOR PRODUCING SILICON WAFER AND SILICON WAFER
    • 生产硅波和硅波的方法
    • US20130093060A1
    • 2013-04-18
    • US13704905
    • 2011-06-07
    • Tetsuya OkaKoji EbaraShuji Takahashi
    • Tetsuya OkaKoji EbaraShuji Takahashi
    • H01L21/26H01L29/06
    • H01L21/26C30B15/00C30B29/06C30B33/02H01L21/3225H01L29/0684
    • A silicon wafer and method for producing a silicon wafer, including at least: a first heat treatment process in which rapid heat treatment is performed on the wafer by using a rapid heating/cooling apparatus in an atmosphere containing at least one of nitride film formation atmospheric gas, rare gas, and oxidizing gas at a temperature higher than 1300° C. and lower than or equal to a silicon melting point for 1 to 60 seconds; and a second heat treatment process in which temperature and atmosphere are controlled to suppress generation of a defect caused by a vacancy in the wafer and rapid heat treatment is performed on the wafer. Therefore, RIE defects such as oxide precipitates, COPs, and OSFs are not present at a depth of at least 1 μm from the surface, which becomes a device fabrication region, and the lifetime is 500 μsec or longer.
    • 一种硅晶片和硅晶片的制造方法,其至少包括:第一热处理工序,其中在包含氮化膜形成大气中的至少一种的气氛中使用快速加热/冷却装置在晶片上进行快速热处理 气体,稀有气体和氧化气体,温度高于1300℃,低于或等于硅熔点1〜60秒; 以及第二热处理工艺,其中控制温度和气氛以抑制由晶片空位引起的缺陷的产生,并且对晶片进行快速热处理。 因此,RIE缺陷如氧化物沉淀物,COP和OSF在距离表面至少1um的深度处不存在,其成为器件制造区域,并且寿命为500μs或更长。