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1. 发明专利

AU4780100A Cloth having embroidery pattern and method for forming embroidery pattern and bobbin thread for embroider 未知
公开(公告)号：AU4780100A
公开(公告)日：2000-12-12
申请号：AU4780100
申请日：2000-05-22
申请人： TERUAKI KOMATSU
发明人： KOMATSU TERUAKI
IPC分类号： D02G3/28 , D02G3/38 , D02G3/40 , D02G3/44 , D02G3/46 , D05B89/00 , D05C17/00
摘要： A method for forming an embroidery pattern which comprises embroidering a cloth (1) for embroider by the use of an ordinary embroidery yarn as a needle thread (2) and, as a bobbin thread (5), a yarn obtained by twisting together an ordinary yarn used usually and a yarn formed with a material capable of thermal fusion splicing or a yarn obtained by cover-ing in ordinary yarn with a material capable of thermal fusion splicing, then heating them to fuse the material capable of thermal fusion splicing in the bobbin thread (5) and splice the ordinary yarn of the bobbin thread and the needle thread (2) appearing on the back of the above cloth (1) to the back of the above cloth (1), and cutting each needle thread (2) appearing on the front surface of the cloth (1) at an intermediate portion thereof, thereby fluffing the needle thread (2) out; and a cloth having an embroidery pattern formed by the method or a method similar to that. The method can be used for obtaining an embroidery pattern which is stereoscopic and profound and forming an embroidery pattern of an intricate shape with case.

2. 发明授权

US5841064A Peltier module 失效
标题翻译：珀耳帖模块
公开(公告)号：US5841064A
公开(公告)日：1998-11-24
申请号：US776186
申请日：1997-01-24
申请人： Nobuteru Maekawa , Katsuyoshi Shimoda , Teruaki Komatsu , Shinya Murase , Hiroaki Okada , Hiroyuki Inoue
发明人： Nobuteru Maekawa , Katsuyoshi Shimoda , Teruaki Komatsu , Shinya Murase , Hiroaki Okada , Hiroyuki Inoue
IPC分类号： F25B21/02 , H01L35/32 , H01L35/02 , H01L35/08
CPC分类号： H01L35/32
摘要： A Peltier effect module comprising a plurality of Peltier effect elements arranged in parallel between a pair of substrates where the Peltier effect elements are connected to connection electrodes disposed on the substrates. The array of Peltier effect elements is sealed off by a hollow seal frame surrounding the Peltier effect element array with a seal formed by a bond between both end edges of the seal frame and the substrates. Because the perimeter around the Peltier effect elements is sealed using a seal frame metalically bonded at both ends to the substrates, resistance to moisture penetration is largely determined by the material from which the seal frame is made. Therefore, by appropriately selecting the seal frame materials, the Peltier effect module can be reliably protected for a long period of time against moisture penetration.
摘要翻译： PCT No.PCT / JP96 / 01421 Sec。 371日期1997年1月24日 102（e）日期1997年1月24日PCT提交1996年5月27日PCT公布。 WO96 / 37918 PCT公开号日期：1996年11月28日帕尔帖效应模块包括平行布置在一对基板之间的多个珀耳帖效应元件，其中帕尔帖效应元件连接到设置在基板上的连接电极。 Peltier效应元件的阵列由围绕珀尔帖效应元件阵列的中空密封框架密封，密封框架和基板的两端边缘之间的接合形成密封。由于珀耳帖效应元件周围的周边是使用两端金属结合到基板上的密封框进行密封的，所以耐水分渗透的程度很大程度上取决于制作密封框架的材料。因此，通过适当选择密封框架材料，可以长时间可靠地保护珀尔帖效应模块以防止水分渗透。

3. 发明授权

US06400013B1 Thermoelectric module with interarray bridges 失效
标题翻译：带电桥的热电模块
公开(公告)号：US06400013B1
公开(公告)日：2002-06-04
申请号：US09709577
申请日：2000-11-13
申请人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
发明人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
IPC分类号： H01L2334
CPC分类号： H01L35/325 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.
摘要翻译：热电模块能够成功地降低热应力以提高可靠性。该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片，以形成串联电路。芯片被布置成给出至少三个芯片阵列，每个芯片阵列具有有限数量的芯片。第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥，以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。第一载体还包括至少两个排列间桥，其单独负责相邻芯片阵列之间的电互连。在芯片的相对侧，形成多个第二桥，每个第二桥整体地连接两个相邻的第二触点，以给出第二离散耦合，用于电连接每个芯片阵列中的两个相邻的芯片。因此，阵列间桥仅形成在芯片的一侧，用于相邻芯片阵列之间的第一触点的互连。因此，施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。

4. 发明授权

US4695065A Keyless chuck for rotary tool 失效
标题翻译：旋转工具的无钥匙卡盘
公开(公告)号：US4695065A
公开(公告)日：1987-09-22
申请号：US946067
申请日：1986-12-24
申请人： Teruaki Komatsu , Kiyoshi Kobayashi , Kunihiko Tatsu , Shoichi Shibata
发明人： Teruaki Komatsu , Kiyoshi Kobayashi , Kunihiko Tatsu , Shoichi Shibata
IPC分类号： B23B31/173 , B23B31/12
CPC分类号： B23B31/1253 , Y10S279/902 , Y10T279/17615 , Y10T279/17649
摘要： A keyless chuck for a rotary tool comprises a chuck body which is adapted to be coupled at its one end to a drive spindle of a drive source and coupled at the other end to a tool bit for establishing a driving connection from the drive source to the tool bit. Relatively rotatable to the chuck body is a handle ring which is operatively connected to a set of gripping jaws for tightening the gripping jaws on the tool bit upon being rotated in one direction and loosening the same upon being rotated in the opposite direction. The handle ring is disposed on the chuck body in such a manner as to coincide the rotating direction of the handle ring for tightening the gripping jaws with the reverse rotating direction of the chuck body for removing the tool bit from a workpiece. A clutch interconnects the handle ring and the chuck body in order to rotatively fix the handle ring to the chuck body when the latter is driven to rotate in the reverse direction of removing the tool bit, causing the handle ring to positively rotate in the direction of tightening the gripping jaws and thus preventing it from counter-rotating in the direction of loosening the tool bit when there develops an interaction between the rotating chuck body and the handle ring relatively rotatable thereto. Associated with the clutch is a control mechanism which functionally moves the clutch between an active position where it is activated for the clutch connection and an inactive where it releases the handle ring from the chuck body to permit the relative rotation of the handle ring with respect to the chuck body for enabling the hand tightening and loosening of the gripping jaws.
摘要翻译：用于旋转工具的无钥匙卡盘包括卡盘主体，卡盘主体的一端连接到驱动源的驱动主轴，另一端连接到工具头，用于建立从驱动源到驱动源的驱动连接工具位与卡盘主体相对地可旋转的是手柄环，该手柄环可操作地连接到一组夹爪，用于在沿一个方向旋转时将夹爪紧固在工具头上，并且在沿相反方向旋转时使其松动。把手环以与把手环的旋转方向一致的方式设置在卡盘主体上，以便与卡盘主体的反向旋转方向紧固夹爪，以从工件上移除工具头。离合器将手柄环和卡盘主体相互连接，以便当把手环旋转地固定在卡盘体上时，把手环沿着相反方向旋转，从而使把手环沿着当夹持在相对旋转的卡盘体和手柄环之间发生相互作用时，使夹持爪紧固，从而防止其沿松动工具的方向反向旋转。与离合器相关联的是一种控制机构，其功能地使离合器在其被激活用于离合器连接的活动位置和非活动位置之间移动，其中该离合器从卡盘主体释放手柄环，以允许手柄相对于卡盘主体，用于使手夹紧和松开夹爪。

5. 发明授权

US06467420B1 Cloth having embroidery pattern and method for forming embroidery pattern 失效
标题翻译：具有刺绣图案的布料和形成刺绣图案的方法
公开(公告)号：US06467420B1
公开(公告)日：2002-10-22
申请号：US09979550
申请日：2001-11-21
申请人： Teruaki Komatsu
发明人： Teruaki Komatsu
IPC分类号： D05C1500
CPC分类号： D02G3/404 , D02G3/38 , D02G3/46 , D05C17/00
摘要： A method for forming an embroidery pattern which comprises embroidering a cloth (1) for embroider by the use of an ordinary embroidery yam as a needle thread (2) and, as a bobbin thread (5), a yam obtained by twisting together an ordinary yarn used usually and a yam formed with a material capable of thermal fusion splicing or a yam obtained by covering an ordinary yam with a material capable of thermal fusion splicing, then heating them to fuse the material capable of thermal fusion splicing in the bobbin thread (5) and splice the ordinary yam of the bobbin thread and the needle thread (2) appearing on the back of the above cloth (1) to the back of the above cloth (1), and cutting each needle thread (2) appearing on the front surface of the cloth (1) at an intermediate portion thereof, thereby fluffing the needle thread (2) out; and a cloth having an embroidery pattern formed by the method or a method similar to that. The method can be used for obtaining an embroidery pattern which is stereoscopic and profound and forming an embroidery pattern of an intricate shape with ease.
摘要翻译：一种刺绣图案的形成方法，其特征在于，通过使用普通的刺绣用纱线作为针线（2）来刺绣绣花布（1），作为底线（5），将通常的通常使用的纱线和由能够进行热熔接的材料形成的纱线或通过用能够进行热熔接的材料覆盖普通纱线获得的纱线，然后加热它们以使能够在底线中进行热熔接的材料 5），将上述布（1）背面出现的底线的正常纱线和出口的针线（2）接合到上述布（1）的背面，并切割出上述布在其中间部分处布（1）的前表面，从而使针线松脱; 以及通过该方法或类似方法形成的刺绣图案的布。该方法可以用于获得立体和深刻的刺绣图案，并且容易地形成复杂形状的刺绣图案。

6. 发明授权

US06391676B1 Thermoelectric module and a method of fabricating the same 失效
标题翻译：热电模块及其制造方法
公开(公告)号：US06391676B1
公开(公告)日：2002-05-21
申请号：US09200972
申请日：1998-11-30
申请人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
发明人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
IPC分类号： H01L2100
CPC分类号： H01L35/325 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.
摘要翻译：热电模块能够成功地降低热应力以提高可靠性。该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片，以形成串联电路。芯片被布置成给出至少三个芯片阵列，每个芯片阵列具有有限数量的芯片。第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥，以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。第一载体还包括至少两个排列间桥，其单独负责相邻芯片阵列之间的电互连。在芯片的相对侧，形成多个第二桥，每个第二桥整体地连接两个相邻的第二触点，以给出第二离散耦合，用于电连接每个芯片阵列中的两个相邻的芯片。因此，阵列间桥仅形成在芯片的一侧，用于相邻芯片阵列之间的第一触点的互连。因此，施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。

7. 发明授权

US5950067A Method of fabricating a thermoelectric module 失效
标题翻译：制造热电模块的方法
公开(公告)号：US5950067A
公开(公告)日：1999-09-07
申请号：US973095
申请日：1998-03-19
申请人： Nobuteru Maegawa , Hiroaki Okada , Michimasa Tsuzaki , Yuri Sakai , Katsuyoshi Shimoda , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa
发明人： Nobuteru Maegawa , Hiroaki Okada , Michimasa Tsuzaki , Yuri Sakai , Katsuyoshi Shimoda , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa
IPC分类号： H01L35/32 , H01L35/34 , H01L21/324
CPC分类号： H01L35/32 , H01L35/325 , H01L35/34 , Y10S257/93
摘要： A method of fabricating a thermoelectric module in which a plurality of thermoelectric chips are arranged in a matrix between first and second dielectric substrates and electrically connected in series so as to heat one of the substrates and cool the other substrate. Elongated thermoelectric bars of P-type and N-type to be cut into the chips are employed together with a first conductive plate having a plurality of first contacts arranged in a matrix pattern. Adjacent first contacts spaced along the row are interconnected by horizontal bridges. The method of the present invention comprises the steps of integrating the first conductive plate to the first substrate to support the first conductive plate thereby; placing a plurality of the bars of the P-type and N-type on the first contacts along the rows in such a manner that the P-type bars alternate with the N-type bars in a spaced relation along the column; bonding each bar on its one face to the first contacts; cutting each bar into the chips and cutting the horizontal bridges simultaneously to allocate the chips on the individual first contacts; placing a plurality of second contacts of a second substrate onto the chips to form a series electric circuit of the chips in combination with the first contacts, and bonding the second substrate supporting the second contacts to the first substrate.
摘要翻译： PCT No.PCT / JP97 / 01797 Sec。 371日期：1998年3月19日 102（e）1998年3月19日PCT PCT 1997年6月3日PCT公布。公开号WO97 / 45882 日期1997年12月4日一种制造热电模块的方法，其中多个热电芯片以矩阵形式布置在第一和第二电介质基板之间并串联电连接以加热其中一个基板并冷却另一个基板。将要切割成芯片的P型和N型的细长热电棒与具有以矩阵图案排列的多个第一触头的第一导电板一起使用。沿着行间隔的相邻的第一接触件通过水平桥互连。本发明的方法包括以下步骤：将第一导电板与第一基板集成，从而支撑第一导电板; 沿着行将P型和N型的多个条放置在第一触点上，使得P型条以与柱相隔的关系与N型条交替; 将其一个面上的每个条连接到第一触点; 将每个棒切割成芯片并同时切割水平桥，以将芯片分配在单独的第一触点上; 将第二基板的多个第二触点放置在芯片上以与第一触点组合形成芯片的串联电路，以及将支撑第二触点的第二基板接合到第一基板。

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