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1. 发明申请

US20090212411A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090212411A1
公开(公告)日：2009-08-27
申请号：US12247515
申请日：2008-10-08
申请人： Masafumi MATSUMOTO , Tatsuya IWASA , Junji YAMADA , Masaru FURUKAWA
发明人： Masafumi MATSUMOTO , Tatsuya IWASA , Junji YAMADA , Masaru FURUKAWA
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L24/43 , H01L23/053 , H01L24/48 , H01L24/85 , H01L2224/43 , H01L2224/451 , H01L2224/48091 , H01L2224/85205 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.
摘要翻译：半导体器件包括热塑性树脂壳体，安装在热塑性树脂壳体内的半导体芯片，具有引线接合表面和相对接触表面的金属端子，以及连接在引线接合表面和半导体芯片之间的线。金属端子的接触表面在与热塑性树脂外壳的内侧的区域热塑性地结合。

2. 发明授权

US5686758A Semiconductor device having integral structure of case and external connection terminals 失效
标题翻译：具有壳体和外部连接端子整体结构的半导体器件
公开(公告)号：US5686758A
公开(公告)日：1997-11-11
申请号：US441738
申请日：1995-05-16
申请人： Kiyoshi Arai , Yoshio Takagi , Tatsuya Iwasa
发明人： Kiyoshi Arai , Yoshio Takagi , Tatsuya Iwasa
IPC分类号： H01L25/07 , H01L25/18 , H01L23/12
CPC分类号： H01L25/18 , H01L2224/45124 , H01L2224/45144 , H01L2224/48137 , H01L2224/48139 , H01L2924/01019 , H01L2924/01068 , H01L2924/19107
摘要： It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.
摘要翻译：本发明的目的是获得具有壳体和外部连接端子的整体结构的功率半导体器件中的具有小尺寸和高可靠性的功率半导体器件。设置与其他部分没有电连接的虚拟焊盘（42），并且连接线（46）的端部通过依次接合连接电极（43）的暴露表面和半导体的接合焊盘（41）而连接元件（40）与其结合。半导体器件可以小型化，而不会劣化半导体元件的电特性和可靠性。

3. 发明授权

US4347651A System for manufacturing connection wires 失效
标题翻译：连接线制造系统
公开(公告)号：US4347651A
公开(公告)日：1982-09-07
申请号：US168242
申请日：1980-07-10
申请人： Takayuki Inoue , Tatsuya Iwasa
发明人： Takayuki Inoue , Tatsuya Iwasa
IPC分类号： H01R43/055 , H01R43/04 , H01R43/28 , H01R43/00
CPC分类号： H01R43/28 , H01R43/04 , Y10T29/5138 , Y10T29/5142 , Y10T29/5193 , Y10T29/53187 , Y10T29/53213
摘要： A connection wire manufacturing system is provided in which a number of pairs of press-connecting terminals are formed in a hoop material, each being coupled at the heads with each other, and the hoop material with the pairs of press-connecting terminals is transferred to a press-connecting step where those pairs of terminals are separated into individual pairs of terminals and those individual ones are press-connected to connection wires with given lengths properly prepared into a continuous connection wire line which is allowed to be taken up by a take-up drum.
摘要翻译：提供一种连接线制造系统，其中多个压接端子形成在环形材料中，每对连接端子彼此在头部处连接，并且具有一对压接端子的环形材料被转移到压接连接步骤，其中这些端子对被分离成单独的端子对，并且这些端子被连接到具有给定长度的连接线，连接线被适当地制备成连续的连接线，鼓鼓。

4. 发明授权

US5252132A Apparatus for producing semiconductor film 失效
标题翻译：半导体膜制造装置
公开(公告)号：US5252132A
公开(公告)日：1993-10-12
申请号：US796618
申请日：1991-11-22
申请人： Masao Oda , Yoshiyuki Goto , Toyomi Osige , Tatsuya Iwasa , Yoshimi Kinoshita , Katsuhisa Kitano , Kazuo Yoshida
发明人： Masao Oda , Yoshiyuki Goto , Toyomi Osige , Tatsuya Iwasa , Yoshimi Kinoshita , Katsuhisa Kitano , Kazuo Yoshida
IPC分类号： C23C16/48 , C30B25/10 , C30B25/14 , H01L21/00 , C23C16/00
CPC分类号： H01L21/67115 , C23C16/481 , C23C16/488 , C30B25/105 , C30B25/14
摘要： A semiconductor film production apparatus includes a reaction vessel for containing a substrate and including a gas supply port for supplying a reaction gas to the vessel, a gas discharge port for discharging the reaction gas from the vessel after reaction, and a light-transmitting glass window; a light source disposed outside the reaction vessel for irradiating a substrate in the reaction vessel through the light-transmitting glass window to heat the substrate; a cylindrical substrate holder disposed in the reaction vessel for holding the substrate with a first surface facing the light source and a second surface, opposed to the first surface, exposed to the reaction gas; a ring plate having a central opening with an area smaller than the substrate and an outside diameter dividing the reaction vessel into two compartments, the ring plate contacting the first surface of the substrate; a carrier gas supply port for introducing a carrier gas between the substrate and the light-transmitting glass window; and a reaction gas supply nozzle disposed in the substrate holder connected to said gas supply port and opposing the second surface of the substrate.
摘要翻译：半导体膜制造装置包括：容纳基板的反应容器，具有用于向容器供给反应气体的气体供给口;反应后从反应容器排出反应气体的气体排出口;透光性玻璃窗 ; 设置在所述反应容器的外部的光源，用于通过所述透光玻璃窗照射反应容器中的基板以加热所述基板; 设置在所述反应容器中的圆柱形衬底保持器，用于保持所述衬底具有面向所述光源的第一表面和与所述第一表面相对的暴露于所述反应气体的第二表面; 环形板，具有中心开口，面积小于基板，外径将反应容器分成两个隔室，环板接触基板的第一表面; 用于在基板和透光玻璃窗之间引入载气的载气供给口; 以及反应气体供给喷嘴，其设置在与所述气体供给口连接并与所述基板的第二表面相对的所述基板保持件中。

5. 发明授权

US5192370A Method and apparatus for forming thin film 失效
标题翻译：用于形成薄膜的方法和装置
公开(公告)号：US5192370A
公开(公告)日：1993-03-09
申请号：US542148
申请日：1990-06-22
申请人： Masao Oda , Tatsuya Iwasa
发明人： Masao Oda , Tatsuya Iwasa
IPC分类号： C23C16/50 , C23C16/44 , C23C16/452 , C23C16/455 , C23C16/511 , H01L21/205 , H01L21/31
CPC分类号： C23C16/45517 , C23C16/452 , C23C16/45591 , Y10S156/916
摘要： Method of forming a thin film on a substrate by CVD (Chemical Vapor Deposition) method and an apparatus therefor, wherein a first gas is supplied from a reaction gas supply port in a reaction chamber, and an active species produced by exciting a second gas are supplied from an active species supply port in the reaction chamber, and a thin film is formed on the substrate by reaction of the first reaction gas and the active species, since a metal porous plate having a number of small holes is installed close to the substrate between the active species supply port and a heater so as to enclose at least the substrate and the active species supply port, the precursor forming reaction is limited to position on the surface of the substrate and diffusion of the precursor to the outer circumferential portion and the inner wall of the reaction chamber is prevented, thereby the low dust producing process to advance the thin film forming reaction is obtained without generating the reaction product of fine particle form which may cause the dust producing.
摘要翻译：通过CVD（化学气相沉积）法在基板上形成薄膜的方法及其装置，其中从反应室中的反应气体供给口供给第一气体，通过激发第二气体产生的活性物质由反应室中的活性物质供给口供给，并且通过第一反应气体和活性物质的反应，在基板上形成薄膜，因为具有多个小孔的金属多孔板安装在基板附近在活性物质供给口和加热器之间至少包围基材和活性物质供给口的情况下，前体形成反应被限制在基材表面上的位置和前体向外周部的扩散，防止反应室的内壁，从而获得促进薄膜形成反应的低粉尘产生过程而不产生反应产物可能导致粉尘产生的细颗粒形式。

6. 发明授权

US09160981B2 System for assisting driving of vehicle 有权
标题翻译：辅助驾驶车辆的系统
公开(公告)号：US09160981B2
公开(公告)日：2015-10-13
申请号：US13636970
申请日：2011-02-16
申请人： Haruhiko Nishiguchi , Kei Oshida , Takashi Watanabe , Tatsuya Iwasa
发明人： Haruhiko Nishiguchi , Kei Oshida , Takashi Watanabe , Tatsuya Iwasa
IPC分类号： H04N7/18 , B60R1/06 , B60R1/12
CPC分类号： H04N7/18 , B60R1/06 , B60R2001/1253 , B60R2300/8026
摘要： Disclosed is a device which is mounted on a vehicle, and captures a rear region of a vehicle and a blind spot region outside of a viewing range of a side mirror adjacent to the rear region of the vehicle. A captured image is subjected to image processing so that the blind spot region on the captured image is compressed. The image after subjected to the image processing is displayed so as to be visible to a driver. The blind spot region on the captured image is compressed so that a sudden change of position of a object in a horizontal direction on the captured image is suppressed, as against a change of distance from the vehicle to the object. Compression is performed so that the ratio of transition of position of the object in the horizontal direction on the captured image to transition of distance from the vehicle to the object is substantially the same as the ratio of transition of position of the object in the horizontal direction in the side mirror to transition of distance from the vehicle to the object. The phenomenon of the object's appearance as if the object suddenly accelerates in the vicinity of the vehicle is avoided.
摘要翻译：公开了一种安装在车辆上的装置，并且捕获车辆的后部区域和邻近车辆后部区域的侧镜的观察范围之外的盲点区域。拍摄的图像经受图像处理，使得捕获的图像上的盲点区域被压缩。显示经过图像处理后的图像，以便对驾驶员可见。被捕获的图像上的盲点区域被压缩，从而抑制了被拍摄图像上的物体在水平方向上的位置的突然变化，与对车辆的距离的变化相对应。进行压缩，使得物体在水平方向上的位置的转变与捕获的图像之间的距离与从车辆到物体的距离的转变的比率基本上与物体在水平方向上的位置的转变的比率相同在侧视镜中，从车辆到物体的距离过渡。避免了在车辆附近突然加速物体的外观现象。

7. 发明授权

US08785252B2 Resin sealed semiconductor device and manufacturing method therefor 有权
标题翻译：树脂密封半导体器件及其制造方法
公开(公告)号：US08785252B2
公开(公告)日：2014-07-22
申请号：US13757231
申请日：2013-02-01
申请人： Masafumi Matsumoto , Tatsuya Iwasa , Junji Yamada , Masaru Furukawa
发明人： Masafumi Matsumoto , Tatsuya Iwasa , Junji Yamada , Masaru Furukawa
IPC分类号： H01L23/00
CPC分类号： H01L24/43 , H01L23/053 , H01L24/48 , H01L24/85 , H01L2224/43 , H01L2224/451 , H01L2224/48091 , H01L2224/85205 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.
摘要翻译：半导体器件包括热塑性树脂壳体，安装在热塑性树脂壳体内的半导体芯片，具有引线接合表面和相对接触表面的金属端子，以及连接在引线接合表面和半导体芯片之间的线。金属端子的接触表面在与热塑性树脂外壳的内侧的区域热塑性地结合。

8. 发明申请

US20130143365A1 Resin Sealed Semiconductor Device And Manufacturing Method Therefor 有权
标题翻译：树脂密封半导体器件及其制造方法
公开(公告)号：US20130143365A1
公开(公告)日：2013-06-06
申请号：US13757231
申请日：2013-02-01
申请人： Masafumi MATSUMOTO , Tatsuya IWASA , Junji YAMADA , Masaru FURUKAWA
发明人： Masafumi MATSUMOTO , Tatsuya IWASA , Junji YAMADA , Masaru FURUKAWA
IPC分类号： H01L23/00
CPC分类号： H01L24/43 , H01L23/053 , H01L24/48 , H01L24/85 , H01L2224/43 , H01L2224/451 , H01L2224/48091 , H01L2224/85205 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.
摘要翻译：半导体器件包括热塑性树脂壳体，安装在热塑性树脂壳体内的半导体芯片，具有引线接合表面和相对接触表面的金属端子，以及连接在引线接合表面和半导体芯片之间的线。金属端子的接触表面在与热塑性树脂外壳的内侧的区域热塑性地结合。

9. 发明授权

US08399976B2 Resin sealed semiconductor device and manufacturing method therefor 有权
标题翻译：树脂密封半导体器件及其制造方法
公开(公告)号：US08399976B2
公开(公告)日：2013-03-19
申请号：US12247515
申请日：2008-10-08
申请人： Masafumi Matsumoto , Tatsuya Iwasa , Junji Yamada , Masaru Furukawa
发明人： Masafumi Matsumoto , Tatsuya Iwasa , Junji Yamada , Masaru Furukawa
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L24/43 , H01L23/053 , H01L24/48 , H01L24/85 , H01L2224/43 , H01L2224/451 , H01L2224/48091 , H01L2224/85205 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.
摘要翻译：半导体器件包括热塑性树脂壳体，安装在热塑性树脂壳体内的半导体芯片，具有引线接合表面和相对接触表面的金属端子，以及连接在引线接合表面和半导体芯片之间的线。金属端子的接触表面在与热塑性树脂外壳的内侧的区域热塑性地结合。

10. 发明授权

US07755508B2 Driving assistance system for appropriately making the driver recognize another vehicle behind or next to present vehicle 有权
标题翻译：驾驶辅助系统适当地使驾驶员识别出现在车辆后方或旁边的另一车辆
公开(公告)号：US07755508B2
公开(公告)日：2010-07-13
申请号：US11804822
申请日：2007-05-21
申请人： Takashi Watanabe , Kei Oshida , Yoshiyuki Matsumoto , Yoichi Sugimoto , Tatsuya Iwasa
发明人： Takashi Watanabe , Kei Oshida , Yoshiyuki Matsumoto , Yoichi Sugimoto , Tatsuya Iwasa
IPC分类号： G08G1/16
CPC分类号： B60Q9/008 , B60Q1/2665 , B60R1/00 , B60R1/1207 , B60R2001/1215 , B60R2001/1253 , B60R2300/8066 , G08G1/166 , G08G1/167
摘要： A driving assistance system may include a device for obtaining an image of an area behind and next to the present vehicle, the area including a lane other than the present lane; a device for displaying the obtained image so that it is visible to the driver; and a device for superimposing a mark on the image, which indicates degree of danger with respect to another vehicle running on the other lane when the present vehicle enters the other lane. The system may include a mirror for reflecting such an area behind and next to the present vehicle in a manner such that the area is visible to a driver of the present vehicle; and a device for displaying a mark on the mirror, wherein the mark indicates a degree of danger with respect to another vehicle running on the other lane when the present vehicle enters the other lane.
摘要翻译：驾驶辅助系统可以包括用于获得当前车辆后面和之后的区域的图像的设备，该区域包括除当前车道之外的车道; 用于显示所获得的图像使其对于驾驶员可见的装置; 以及用于在图像上叠加标记的装置，其指示当本车辆进入另一车道时相对于在另一车道上行驶的另一车辆的危险程度。该系统可以包括用于以使得该区域对于本车辆的驾驶员可见的方式反映本车辆后面和之后的该区域的反射镜; 以及用于在所述反射镜上显示标记的装置，其中，当所述车辆进入所述另一车道时，所述标记表示相对于在另一车道上行驶的另一车辆的危险程度。

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